Product Description
Laser trimming is the mainstream technology for trimming . It has the highest precision and efficiency , and can complete circuit functiontrimming . The high-precision laser trimming automation system isbased on precision laser trimming . The system is equipped with a fully automatic loading and unloading mechanism and a visual positioning automatic correction system , which is easy for automated mass production , and is especially suitable for rapid mass production of various specifications of chip resistors.
| Category |
Details |
| Laser Type |
UV, IR, or Green laser (wavelength selectable) |
| Accuracy |
±1µm or better (depends on material) |
| Trim Speed |
Up to 1000 resistors/sec (adjustable) |
| Supported Materials |
Thin-film, thick-film, Si, GaAs, etc. |
| Control System |
PC-based with GUI (real-time monitoring) |
| Measurement Feedback |
In-situ resistance monitoring (4-wire Kelvin) |
| Applications |
Resistor trimming, MEMS tuning, IC repair |
| Wafer Size Compatibility |
6", 8", 12" (optional cassettes) |
| Safety Features |
Class 1 enclosed system, interlock compliance |
1 . Fully automatic loading / unloading mechanism to greatly increase production capacity
2 . Equipped with intelligent vision automatic positioning correction system to realize high-precision positioning of chip resistor substrates
3.Self-developed PMU measurement system , with high accuracy speed , good consistency and full range resistor trimming .
4 . Self-developed resistor trimming software system supports various types of resistor trimming knife , and can be customized to meet needs of customers
5 . The equipment is stable and reliable , and the parameter values of modified products are highly reliable and will not drift :
6 . Low cost of operation and maintenance , whole machine is highly efficient with low energy consumption , built-in dust-proof , anti-static , leakage protection and perssafety protection functions , rest assured to use
Applications
Key Applications of Laser Trimming Machines
Laser trimming machines are widely used in industries requiring high precision and miniaturization, with the following major application fields:
1. Electronic Component Manufacturing
This is the largest application field, focusing on calibrating passive components to ensure parameter accuracy:
- Resistors: Trimming thick-film resistors (used in power supplies, automotive electronics) and thin-film resistors (used in precision instruments, aerospace) to achieve resistance tolerance of ±0.01%-±1%.
- Capacitors: Trimming ceramic capacitors or thin-film capacitors for high-frequency circuits (e.g., communication equipment) to stabilize capacitance values.
- Potentiometers & Sensors: Trimming the conductive tracks of potentiometers or the sensitive elements of temperature/humidity sensors to optimize linearity and measurement accuracy.
2. Semiconductor & Integrated Circuit (IC) Industry
In IC manufacturing, laser trimming is critical for improving chip performance and yield:
- IC Voltage Regulation: Trimming the on-chip voltage reference (e.g., bandgap reference circuits) to ensure stable output voltage (error <1mV), which is essential for analog chips (e.g., amplifiers, ADCs/DACs).
- MEMS Device Trimming: Adjusting MEMS (Micro-Electro-Mechanical Systems) components such as accelerometers, gyroscopes, and pressure sensors. For example, trimming the mass block or spring structure of an accelerometer to eliminate zero-offset errors (common in automotive inertial navigation and smartphone motion sensing).
- Chip Rework: Repairing defective wire bonds or redundant circuits on high-end chips (e.g., CPU, FPGA) to reduce scrap rates and lower production costs.
Product Parameters
| Component |
Details |
Quantity |
Brand/Model |
| Field Lens |
100*100mm lens (imported) |
1 |
SGBC (1064nm) |
| Beam Expander |
4X beam expander (imported) |
1 |
SGBC (1064nm) |
| Laser |
Infrared laser (imported from Germany) |
1 |
IRADION-1064nm |
| Motion System |
Linear motor |
1 |
LH |
| Measurement System |
24-channel |
1 |
SHARP SPEED |
| Galvanometer |
High-precision scanning motor (imported) |
1 |
GO7 |
| Coaxial Camera System |
T100 type |
1 |
SHARP SPEED |
| Auto Load/Unload Mechanism |
Dual magazine |
1 |
40*40~120*120mm |
| Measurement Meter |
Low-resistance measurement meter |
1 |
AX-1152D |
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Our laser trimming machine for semiconductor can be packed per clients' requirement.
The freight can be railway, sea-freight or truck
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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