| Customization: | Available |
|---|---|
| After-sales Service: | Provided |
| Warranty: | 12 Months |
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Benefits:
1.High precision: Adopt high-precision optical path system and equip with high-stability working platform
2.High yield: high processing yield and good consistency
3.Industrial design, 7*24 operating conditions to ensure machining accuracy and running stability
4.0Automatic loading and unloading, unattended
Technical Parameters:
| Parameters | Specifications |
| Laser type | fiber laser |
| processing format | 300 * 300Mm (can be customized) |
| ceramic thickness | < 2mm |
| Cut shape | Straight line or special shape |
| Cutting speed | Cutting 20mm/s@1mm alumina ceramics Scribing > 75mm/s@1mm Alumina Ceramics |
| cutting material | Alumina, aluminum nitride and other ceramic materials |
| Compressed air required for equipment | 0.5-0 MPa, air consumption 18m3/h |
Applications:
Ceramic materials such as alumina and aluminum nitride
Sample Display:
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:Why choo us?
A3:OEM/ODM/Designing.
We design and manufacture advanced semiconductor production equipment, including:
Die Bonders - High-precision chip attachment for IC packaging
Wire Bonders - Reliable interconnects for semiconductor devices
Laser Processing Machines - Wafer marking, grooving, cutting (Si, SiC, glass, ceramics)
Wafer Dicing Saws - Precision cutting for MEMS, optoelectronics, and advanced packaging
Laser Annealing Systems - For Si/SiC wafers
Automatic Dispensing Equipment - High-accuracy silicone & epoxy application
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