| Customization: | Available |
|---|---|
| After-sales Service: | 7*24 Hours |
| Function: | Abrasion Resistance |
Suppliers with verified business licenses
Audited Supplier Audited by an independent third-party inspection agency
The Himalaya DS Series of manual desktop wire bonders provides a versatile and cost-effective solution for precision interconnection tasks. Engineered for reliability and ease of use, these compact machines are ideal for research and development, small-batch production, prototyping, and educational institutions. We offer three specialized models to cover a wide range of wire bonding applications, from delicate integrated circuits to high-power modules.
| Feature | DS-2575 (Thin Aluminum Wire) | DS-7550 (Heavy Aluminum Wire) | DSB-1750 (Gold Wire Ball Bonder) |
| Model No. | DS-2575 | DS-7550 | DSB-1750 |
| Bonding Type | Wedge / Wedge | Wedge / Wedge | Ball / Wedge |
| Wire Material | Aluminum | Aluminum | Gold |
| Wire Diameter | 25 ~ 75 micron | 75 ~ 500 micron (3-20 mil) | 17 ~ 50 micron |
| Ultrasonic Power | 0 - 3 W (Dual Channel) | 0 - 30 W (Dual Channel) | 0 - 3 W (Dual Channel) |
| Bond Force | 10 - 60 g | 30 - 1200 g | 35 - 180 g |
| Bond Time | 5 - 200 ms | 10 - 500 ms | 0 - 200 ms |
| Motorized Span | 0 - 10 mm | 0 - 18 mm (Y-axis) | > 4 mm |
| Work Area | Diameter 16 mm | Diameter 25 mm | Diameter 25 mm |
| Key Applications | Digital Tubes, ICs, Transistors | IGBTs, Power Modules, SCRs, Diodes | LEDs, Laser Diodes, Chips |
| Heating Stage | N/A | N/A | Room Temp. ~ 400C |
| Weight | 36 kg | ~40 kg | 28 kg |
To ensure your Himalaya DS Wire Bonder arrives in perfect condition, each unit is meticulously prepared for shipment:
Secure Packaging: Every wire bonder is first wrapped in bubble foam to protect against shock, dust, and moisture.
Robust Outer Case: The protected unit is then securely packed inside a custom-built wooden crate, designed to withstand the rigors of long-distance transport.
Flexible Shipping Options: We can deliver via truck, sea-freight, or air-freight to meet your schedule and logistical requirements.
Jiangsu Himalaya Semiconductor Co., Ltd. - Your Partner in Precision Assembly
Jiangsu Himalaya Semiconductor Co., Ltd. is a specialized manufacturer of benchtop semiconductor assembly equipment, focusing on innovative and accessible wire bonding solutions. We are best known for our Himalaya DS Series of manual desktop wire bonders, which are engineered to deliver laboratory precision for research, development, and low-volume production. Our commitment is to provide the global semiconductor, power electronics, and optoelectronics industries with reliable, cost-effective, and user-friendly equipment, backed by robust support and CE certification. From prototyping to specialized manufacturing, we empower innovation at the bench.
1. Himalaya DS-2575: Thin Aluminum Wire Wedge Bonder
This model is precision-engineered for ultra-fine interconnections. It is perfectly suited for bonding delicate components such as digital tubes, lattice displays, integrated circuits in soft packages, transistors, and other miniature semiconductor devices where precision is paramount.
2. Himalaya DS-7550: Heavy Aluminum Wire Wedge Bonder
Designed for demanding high-power applications, the DS-7550 delivers the necessary force and ultrasonic power for robust interconnects. It is the ideal choice for bonding high-power transistors, FETs, SCRs, IGBT modules, Schottky diodes, and a wide variety of power packages like TO-3, TO-220, and TO-247.
3. Himalaya DSB-1750: Gold Wire Ball Bonder
This model specializes in the high-speed, reliable formation of gold ball bonds, making it essential for optoelectronics and high-frequency devices. Its primary applications include LED packaging, laser diodes, chip-on-board (COB) assemblies, and other semiconductor devices that benefit from the superior conductivity and bonding properties of gold.
Key Applications: R&D, Prototyping, Small-Batch Production, Education, Laboratories
Target Industries: Semiconductor, Power Electronics, LED & Optoelectronics, Aerospace, Automotive, Research Institutions
Ideal For: Low-volume production, Research departments, Schools, Maintenance and repair
Key Features & Benefits:
Compact Desktop Design: Saves valuable bench space and is easily integrated into any lab or workshop environment.
Manual Operation with Motorized Assistance: Combines the flexibility of manual control with the precision of motorized functions for bond span and arc control, ensuring consistent results.
Dual-Channel Independent Control: Allows separate setting of ultrasonic power, bond time, and bond force for the first and second bonds, providing superior process flexibility.
Robust Construction & Long Mould Life: Designed for durability with a mould life of 300,000 to 1,000,000 shots, guaranteeing long-term reliability.
CE Certified & 12-Month Warranty: Manufactured to international safety standards and backed by our comprehensive warranty and support.
Versatile Application Range: From fine-pitch ICs to heavy-duty power devices, a model is available to meet your specific bonding needs.
){kind=link}