| Certification: | ISO9001, CCC |
|---|---|
| Protection: | Anti-static |
| Installation: | Vertical |
Equipment overview
It is used for non-destructive testing of various lightweight flat products such as metal castings, auto parts, plastic products, rubber products, etc. This equipment is suitable for equipment manufacturing, electronics, automobiles, high-speed rail and other industries.
Our high-precision NDT X-ray inspection systems are designed for semiconductor manufacturing, enabling non-destructive internal defect detection, quality control, and failure analysis with micrometer-level resolution.
Sub-micron Resolution (≤0.5µm with microfocus X-ray)
Real-time 2D/3D Imaging (CT scanning for layered inspection)
Automated Defect Recognition (ADR) with AI-driven analysis
High-Throughput Inspection (Inline & Offline modes)
Multi-Angle & Oblique Viewing (for complex chip structures)
Functions and Feature
1. Inspection of small precision castings with high cost performance
2. Adopting highly integrated design, compact structure and space saving
3. Small focus size
4. Software HDR processing capabilities
X-Ray Tube |
Tube Style | Sealed tube |
| Tube voltage | 160KV | |
| Tube current | 2.5mA | |
| Light tube power | 400W | |
| Detail resolution | 0.4-0.8mm | |
| Cooling mode | Air Cooling | |
Flat panel detector |
Pixel size | 2816×2816mm |
| Effective imaging area | 432mm*432mm | |
| A/D conversion digits | 16bit | |
Motion Control System |
Movement Control | Keypad,Mouse,joystick |
| X axis | 400mm | |
| Yaxis | 400mm | |
| Stage area | 500*500mm | |
| Effective visual range | 400*400mm | |
Radiation safety |
The surface of the whole machine is less than lusv/h | <lusv/h |
| X-Ray Shell | Safety door automatic interlocking protection function | When X-ray is turned on,the safety door automatically locks for protection |
| size | About 1005*1180*1625mm | |
| weight | About 1400kg | |
| power supply | Power supply | AC110-230VAC,50/60Hz |
| computer | operating system | Win10 |
| monitor | 22inch | |
| CPU | 15 @memory 8G hard drive 1T |
X-ray inspection is a critical non-destructive testing (NDT) method for semiconductor, battery, capacitor, resistor, and chip manufacturing. It enables internal defect detection, quality control, and failure analysis without damaging components.
Applications:
Die Bonding Inspection - Verify wire bonding and die attach quality
Wafer-Level Defects - Detect cracks, voids, and delamination
Flip-Chip BGA/CSP Inspection - Check solder joint integrity (voids, bridging)
TSV (Through-Silicon Via) Analysis - Verify vertical interconnect integrity
Applications:
Electrode Alignment - Prevent internal short circuits
Tab Welding Quality - Ensure proper current collector connections
Foreign Object Debris (FOD) Detection - Metal particles cause thermal runaway
SEI Layer & Dendrite Growth Monitoring - Early detection of aging issues
Applications:
MLCC (Multilayer Ceramic Capacitors) - Detect internal cracks & electrode delamination
Tantalum Capacitors - Check anode/cathode integrity to prevent short circuits
Film Capacitors - Inspect winding defects in metallized layers
Thick/Thin Film Resistors - Identify micro-cracks & layer uniformity
Applications:
Solder Joint Inspection (QFN, LGA, BGA) - Detect head-in-pillow, cold solder
Component Tombstoning - Check for misaligned passive components (0402, 0201)
PCB Layer Alignment - Verify via & trace integrity in HDI boards
Customer Commitment & After-Sales Support
1-Year Comprehensive Warranty
Coverage: Full protection against manufacturing defects (parts/labor included).
Extensions: Optional extended warranty plans available for critical applications.
24/7 Global Technical Support
Response: ≤1-hour emergency response via dedicated hotline/TeamViewer.
Languages: Multilingual engineers (English/Chinese/Russian).
On-Site: Rapid dispatch for unresolved issues (72hrs max for Tier-1 regions).
