Next-Generation X-ray Imaging System for Semiconductor Quality Control
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Product Attributes
- Customization
- Available
- Certification
- ISO9001, CCC
- Protection
- Anti-static
- Model NO.
- HM-1000
- Installation
- Vertical
- Housing
- ABS and Metal
- Product Name
- Imaging X-ray Equipment
- Tube Current
- 2.5mA
- Light Tube Power
- 400W
- Detail Resolution
- 0.4-0.8mm
- Tube Voltage
- 160kv
- Transport Package
- Complies with International Logistics Standards
- Specification
- customized
- Trademark
- Himalaya
- Origin
- China
- Production Capacity
- 50000
Product Images of Next-Generation X-ray Imaging System for Semiconductor Quality Control
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Next-Generation X-ray Imaging System for Semiconductor Quality Control -
Next-Generation X-ray Imaging System for Semiconductor Quality Control -
Next-Generation X-ray Imaging System for Semiconductor Quality Control -
Next-Generation X-ray Imaging System for Semiconductor Quality Control -
Next-Generation X-ray Imaging System for Semiconductor Quality Control -
Next-Generation X-ray Imaging System for Semiconductor Quality Control -
Next-Generation X-ray Imaging System for Semiconductor Quality Control
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Product Description
Casting NDT Real-Time Imaging X-ray Equipment industrial device
Equipment overview
It is used for non-destructive testing of various lightweight flat products such as metal castings, auto parts, plastic products, rubber products, etc. This equipment is suitable for equipment manufacturing, electronics, automobiles, high-speed rail and other industries.
Industrial NDT X-ray Equipment for Semiconductor Inspection
1. Overview
Our high-precision NDT X-ray inspection systems are designed for semiconductor manufacturing, enabling non-destructive internal defect detection, quality control, and failure analysis with micrometer-level resolution.
Key Features:
Sub-micron Resolution (≤0.5µm with microfocus X-ray)
Real-time 2D/3D Imaging (CT scanning for layered inspection)
Automated Defect Recognition (ADR) with AI-driven analysis
High-Throughput Inspection (Inline & Offline modes)
Multi-Angle & Oblique Viewing (for complex chip structures)
Functions and Feature
1. Inspection of small precision castings with high cost performance
2. Adopting highly integrated design, compact structure and space saving
3. Small focus size
4. Software HDR processing capabilities
X-Ray Tube |
Tube Style | Sealed tube |
| Tube voltage | 160KV | |
| Tube current | 2.5mA | |
| Light tube power | 400W | |
| Detail resolution | 0.4-0.8mm | |
| Cooling mode | Air Cooling | |
Flat panel detector |
Pixel size | 2816×2816mm |
| Effective imaging area | 432mm*432mm | |
| A/D conversion digits | 16bit | |
Motion Control System |
Movement Control | Keypad,Mouse,joystick |
| X axis | 400mm | |
| Yaxis | 400mm | |
| Stage area | 500*500mm | |
| Effective visual range | 400*400mm | |
Radiation safety |
The surface of the whole machine is less than lusv/h | <lusv/h |
| X-Ray Shell | Safety door automatic interlocking protection function | When X-ray is turned on,the safety door automatically locks for protection |
| size | About 1005*1180*1625mm | |
| weight | About 1400kg | |
| power supply | Power supply | AC110-230VAC,50/60Hz |
| computer | operating system | Win10 |
| monitor | 22inch | |
| CPU | 15 @memory 8G hard drive 1T |
Industrial NDT X-ray Applications in Electronics Manufacturing
X-ray inspection is a critical non-destructive testing (NDT) method for semiconductor, battery, capacitor, resistor, and chip manufacturing. It enables internal defect detection, quality control, and failure analysis without damaging components.
1. Semiconductor & IC Chips
Applications:
Die Bonding Inspection - Verify wire bonding and die attach quality
Wafer-Level Defects - Detect cracks, voids, and delamination
Flip-Chip BGA/CSP Inspection - Check solder joint integrity (voids, bridging)
TSV (Through-Silicon Via) Analysis - Verify vertical interconnect integrity
2. Lithium Batteries (Li-ion, Solid-State)
Applications:
Electrode Alignment - Prevent internal short circuits
Tab Welding Quality - Ensure proper current collector connections
Foreign Object Debris (FOD) Detection - Metal particles cause thermal runaway
SEI Layer & Dendrite Growth Monitoring - Early detection of aging issues
3. Capacitors & Resistors
Applications:
MLCC (Multilayer Ceramic Capacitors) - Detect internal cracks & electrode delamination
Tantalum Capacitors - Check anode/cathode integrity to prevent short circuits
Film Capacitors - Inspect winding defects in metallized layers
Thick/Thin Film Resistors - Identify micro-cracks & layer uniformity
4. PCBA & SMT Components
Applications:
Solder Joint Inspection (QFN, LGA, BGA) - Detect head-in-pillow, cold solder
Component Tombstoning - Check for misaligned passive components (0402, 0201)
PCB Layer Alignment - Verify via & trace integrity in HDI boards
Customer Commitment & After-Sales Support
1-Year Comprehensive Warranty
Coverage: Full protection against manufacturing defects (parts/labor included).
Extensions: Optional extended warranty plans available for critical applications.
24/7 Global Technical Support
Response: ≤1-hour emergency response via dedicated hotline/TeamViewer.
Languages: Multilingual engineers (English/Chinese/Russian).
On-Site: Rapid dispatch for unresolved issues (72hrs max for Tier-1 regions).
About the Supplier
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Company Profile
Empowering Global Semiconductor Excellence: An Introduction to Jiangsu Himalaya Semiconductor Co., Ltd.
In the rapidly evolving landscape of global electronics, precision and reliability are the cornerstones of success. Since its establishment in 2019, Jiangsu Himalaya Semiconductor Co., Ltd. Has emerged as a pivotal force in the semiconductor industry, specializing in the high-level integration and international trade of advanced manufacturing equipment.
With a footprint extending to over 30 countries and a robust network of more than 200 global customers and suppliers, we serve as the critical link in the semiconductor supply chain. Our mission is clear: To secure the most cost-effective, high-performance solutions for our clients while ensuring seamless, risk-free transactions for our partners.
Comprehensive Equipment Solutions for Semiconductor Manufacturing
We take pride in our diverse portfolio of high-precision machinery designed to meet the rigorous demands of modern wafer processing and packaging.
1. Advanced Bonding & Marking
Precision at the microscopic level is essential for chip integrity. Our core lineup includes:
Die Bonders: Ensuring high-speed, accurate placement of chips.
Wire Bonding: Providing reliable electrical interconnections with industry-leading stability.
Laser Marking: Specialized ID marking for IC wafers to ensure full traceability throughout the lifecycle.
2. Cutting-Edge Laser Processing
As wafers become thinner and materials more complex, our laser solutions provide the necessary finesse without compromising structural integrity:
Laser Grooving & Cutting: Expertly designed for glass, ceramics, and wafer packaging.
Internal Modification Machines: Specialized laser technology for Si/SiC (Silicon Carbide) and LT/LN (Lithium Tantalate/Lithium Niobate) wafers.
Laser Annealing: Optimized for Si/SiC substrates to enhance electrical properties and repair lattice damage.
3. Dicing & Dispensing
Automatic Dicing Saw Machines: High-efficiency dicing for wafer packaging applications.
Automatic Silicone Dispensing Equipment: Precision fluid control for protective coating and encapsulation.
Customized Industrial Solutions
Beyond standard machinery, Jiangsu Himalaya Semiconductor provides specialized engineering solutions tailored to unique factory requirements:
TGV (Through Glass Via) Technology: Offering manual, semi-automatic, and fully automatic equipment for next-generation 3D packaging.
Coating & Plating: Customized machines designed for specific surface treatment and metal deposition needs.
Environmental & Resource Management: Efficient solutions for handling exhausted metal sorter equipment, promoting sustainable manufacturing practices.
Why Partner with Jiangsu Himalaya Semiconductor?
In a market defined by volatility, we offer stability and strategic advantage. We understand that for our customers, the "final stage" of procurement is the most critical. We utilize our deep industry expertise to filter through global options, delivering products that balance cost with cutting-edge performance.
For our suppliers, we are a partner of trust. We strive for one-time payment collection and comprehensive risk avoidance, allowing manufacturers to focus on innovation while we handle the complexities of global distribution.
Contact Us Today
Whether you are scaling your production line or seeking a reliable global export partner, Jiangsu Himalaya Semiconductor Co., Ltd. is ready to elevate your operations.
Explore the peak of semiconductor technology with Himalaya.
About Our Factory & Business Background
- Address
- Room 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
-
Registered Capital
- 100,000,000 RMB
-
Terms of Payment
- LC, T/T, PayPal, Western Union
-
International Commercial Terms(Incoterms)
- FOB, CIF, CFR, EXW
-
Average Lead Time
-
Peak Season Lead Time: 3-6 months
Off Season Lead Time: 1-3 months -
Nearest Port
- Shenzhen Port
-
Minimum Order Quantity
- 1 Set
-
Supply Chain Partners
- 30
Our Production Capability & Technical Expertise
-
Main Products
- Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
-
Inspection Type for Finished Products
- 100% inspection(Visual inspection & Function inspection)
-
Inspection Method for Finished Products
- Finished product checked by packing staff
-
Customization Options
- Flexible customization
-
ODM Service Available
- Yes
-
OEM Service Available
- Yes
-
Traceability of Raw Materials
- No
Our Industry Experience & Global Business Record
-
Year of Establishment
- 2019-09-12
-
Export Year
- 5 Years
-
Main Markets
- Europe
-
Repeat Buyers Choice
- 80%~100%
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