High-Precision 3D UV Laser Engraver for Wood and Metal Projects
| Customization: | Available |
|---|---|
| After-sales Service: | Provided |
| Warranty: | Provided |
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Basic Info.
- Model NO.
- UV-3C
- Laser Visibility
- Visible
- Applicable Material
- Metal
- Cooling System
- Air Cooling
- Technical Class
- Continuous Wave Laser
- Laser Wavelength
- Fiber Laser
- Laser Classification
- Semiconductor Laser
- Type
- YAG Laser Marking Machine
- Marking Method
- Scanning Marking
- Product Name
- UV Laser Marking
- Feature 1
- Guaranteed Quality
- Feature 2
- Customized According to Needs
- After-Sale Service
- Provided
- Transport Package
- Customized or Wooden Box Packaging
- Specification
- Standard Specifications
- Trademark
- Himalaya
- Origin
- China
Product Description
2. Marking of food, PVC pipe, medicine packaging material (HDPE, PO, PP and so on); micro-hole drilling, diameter d≤10μm.
3. PCB marking and cutting.
2. Good beam quality, small focused laser spot, enabling super-fine marking.
3. Small heat-affected zone, avoiding damaging the material; high yield rate.
4. High marking speed, high efficiency and high precision.
5. No consumables are required, thereby reducing cost and maintenance expenses.
6. Overall performance is stable, suitable for continuous long-time operation.
7. Rotary worktable is used for marking.
| No. | Machine model | UV-3C |
| 1 | Laser wavelength | 355nm |
| 2 | Laser power | 3W / 20KHz |
| 3 | Repetition frequency | 10-200KHz |
| 4 | Marking range | 100mm*100mm |
| 5 | Marking line width | ≤0.01mm |
| 6 | Marking depth | ≤0.01mm |
| 7 | Min. character | 0.06mm |
| 8 | Marking linear speed | ≤7000mm/s |
| 9 | Repeatability | ±0.003mm |
| 10 | Power supply requirement | 220V/single-phase/50Hz/15A |
| 11 | Total power | ≤1KW |
| 12 | Main machine system dimension | 845x950x1630mm |
| 13 | Cooling system dimension | 485x580x270mm |
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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