Advanced CCD Glue Dispensing System for LED Potting Solutions

Product Description

High Quality Semiconductor SMT Dispensing and Filling Machine

Product Description

 
The TSV-200D Desktop Vision Glue Dispensing Machine by Jiangsu Himalaya Semiconductor Co., Ltd. is a high-precision, automated dispensing solution designed for industries requiring micron-level accuracy in adhesive application. Equipped with CCD visual positioning, multi-axis servo control, and intelligent programming, this machine ensures flawless dispensing for semiconductor packaging, advanced PCB assembly, MEMS devices, and high-precision electronics manufacturing.

Key Features & Advantages
Ultra-Precise Dispensing for Semiconductor Applications
Repeatability: ±0.025mm (ideal for micro-dots, underfill, and die-attach adhesives)
Max Speed: 800mm/s (optimized for high-throughput production)
Multi-Axis Servo Control (X, Y1, Y2, Z) - Ensures smooth motion for complex dispensing paths
 

 

Equipment model	HMLA-300	HMLA-400		HMLA-600
Equipment Size(mm)	L1800*D1550*H2200	L2000*D1550*H2200		L2200*D1550*H2200
Equipment weight	APPROX:1500KG	APPROX:1600KG		APPROX:1800KG
Jig dimension(mm)	L300*D250*H25	L400*D350*H25		L600*D500*H25
Number of heating areas	4 temperature zones (2 top, 2 bottom)	4 temperature zones (2 top, 2 bottom)		4 temperature zones (2 top)
Air exhaust requirements	5m²3/H	5m³/H		5m²/H
Power requirement	3P 380V/220/48050/60Hz
Total power	25KW	30KW	35KW
Consumed power	5KW	6KW	7KW
Hot wind speed	frequency control	frequency control	frequency control
Heating-up time	APPROX:15-30min	APPROX:15-30min	APPROX:15-30min
Curing temperature	≤200ºC	≤200ºC	≤200ºC
Temperature control mode	PID closed-loop control + high-frequency pulse	PID closed-loop control + high-frequency pulse	PID closed-loop control + high-frequency pulse
Temperature control accuracy	±1.0ºC	±1.0ºC	±1.0ºC
Temperature difference of heating area	±2.0ºC	±2.0ºC	±2.0ºC
Temperature on the stove surface	≤50ºC	≤50ºC	≤50ºC
Parameter storage	Multiple production setting parameters can be stored	Multiple production setting parameters can be stored	Multiple production setting parameters can be stored
Single-layer chain bearing capacity	5KG	5KG	5KG
Complete machine bearing capacity	250KG	250KG	250KG
Transportation direction	Standard left to right	Standard left to right	Standard left to right
Treatment with support edge	≥5mm	≥5mm	≥5mm
Signal interface	Front key board rear key board	Front key board rear key board	Front key board / rear exit board
Transport motor	Coservice / stepper motor	Servo / stepping motor	Servo / stepping motor
Push board motor	stepper motor	stepper motor	stepper motor
Input / out plate height(mm)	900±20	900±20	900±20
Productive efficiency	60min / baking time (min) x number of storage layers
Deposit board level	25mm(64 layers)	50mm(32 layers)	75mm(16layers)
Bake time	8min-10000min can be set	8min-10000min can be set	8min-10000min can be set

Glue Dispensing process:

Specification

Our dispensing machine can do point, line, arc or other patterns per required.

Features:

Smart CCD Vision Alignment
Automated Pattern Recognition - Compensates for substrate misalignment
Real-Time Inspection - Detects missing glue or dispensing errors

Semiconductor-Grade Control System

Industrial PC + High-Speed Motion Control Card
User-Friendly Anda Software with drag-and-drop programming
Supports SECS/GEM Protocol for seamless integration into smart factories

Reliability & Cleanroom Compatibility
Vacuum Nozzle Cleaning System - Prevents clogging in precision applications
Anti-Static Design (ESD Protection) - Critical for semiconductor environments
Low-Particulate Construction - Suitable for ISO Class 5-8 cleanrooms

Optimized for Semiconductor Workflows
Working Area: X1/X2 (260mm), Y1/Y2 (260mm), Z (100mm) - Fits wafer trays & JEDEC carriers
Compact Footprint (1120×740×760mm) - Saves valuable cleanroom space
 

Applications

1. Solder Paste

• Use: PCB assembly (SMT, rework).
• Key: High precision (±0.01mm), jetting/time-pressure.

2. Hot Melt Glue

• Use: Fast bonding (electronics, automotive).
• Key: Heated nozzle (120-200°C), rapid curing.

3. Silicone Gel

• Use: LED encapsulation, sealing.
• Key: Bubble-free, high-viscosity pumps.

4. SMT Adhesives (Epoxy/UV)

• Use: Component fixation, underfill.
• Key: UV/thermal curing, micro-dosing.

5. Epoxy Resin

• Use: Structural bonding, potting.
• Key: Dual-cartridge mixing, vacuum degassing.

6. UV Adhesive

• Use: Optics, touch panels.
• Key: Instant cure (<5 sec), transparent bonds.

7. Coating Gel

• Use: Conformal coating, protection.
• Key: Robotic precision, adjustable thickness.

Exhibition & Customers

 

Packaging & Shipping

Our dispening machine is packed with wooden pack

Transported by sea, express or truck upon requests.

After Sales Service

Customer Commitment & After-Sales Support
1-Year Comprehensive Warranty

Coverage: Full protection against manufacturing defects (parts/labor included).
Extensions: Optional extended warranty plans available for critical applications.
24/7 Global Technical Support

Response: ≤1-hour emergency response via dedicated hotline/TeamViewer.
Languages: Multilingual engineers (English/Chinese/German/Japanese).
On-Site: Rapid dispatch for unresolved issues (72hrs max for Tier-1 regions).
Value-Added Services

 

 

Certifications

We are an ISO 9001-certified manufacturer and innovator specializing in semiconductor equipment, with 6 registered utility model patents (UM Patents) in China. Our patented technologies cover:
Semiconductor annealing systems
Cleaning equipment for semiconductor etching
UV debonding machines
And more .
Backed by ISO 9001 quality management, we ensure high precision, reliability, and efficiency in semiconductor manufacturing processes. Our R&D-driven solutions enhance production yield and cost-effectiveness for global clients in IC packaging, MEMS, and advanced wafer processing.

Partner with us for cutting-edge, patent-protected semiconductor equipment tailored to your needs.

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.