High Quality Semiconductor SMT Dispensing and Filling Machine
Product Description
The TSV-200D Desktop Vision Glue Dispensing Machine by Jiangsu Himalaya Semiconductor Co., Ltd. is a high-precision, automated dispensing solution designed for industries requiring micron-level accuracy in adhesive application. Equipped with CCD visual positioning, multi-axis servo control, and intelligent programming, this machine ensures flawless dispensing for semiconductor packaging, advanced PCB assembly, MEMS devices, and high-precision electronics manufacturing.
Key Features & Advantages
Ultra-Precise Dispensing for Semiconductor Applications
Repeatability: ±0.025mm (ideal for micro-dots, underfill, and die-attach adhesives)
Max Speed: 800mm/s (optimized for high-throughput production)
Multi-Axis Servo Control (X, Y1, Y2, Z) - Ensures smooth motion for complex dispensing paths
| Equipment model |
HMLA-300 |
HMLA-400 |
HMLA-600 |
| Equipment Size(mm) |
L1800*D1550*H2200 |
L2000*D1550*H2200 |
L2200*D1550*H2200 |
| Equipment weight |
APPROX:1500KG |
APPROX:1600KG |
APPROX:1800KG |
| Jig dimension(mm) |
L300*D250*H25 |
L400*D350*H25 |
L600*D500*H25 |
| Number of heating areas |
4 temperature zones (2 top, 2 bottom) |
4 temperature zones (2 top, 2 bottom) |
4 temperature zones (2 top) |
| Air exhaust requirements |
5m²3/H |
5m³/H |
5m²/H |
| Power requirement |
3P 380V/220/48050/60Hz |
| Total power |
25KW |
30KW |
35KW |
| Consumed power |
5KW |
6KW |
7KW |
| Hot wind speed |
frequency control |
frequency control |
frequency control |
| Heating-up time |
APPROX:15-30min |
APPROX:15-30min |
APPROX:15-30min |
| Curing temperature |
≤200ºC |
≤200ºC |
≤200ºC |
| Temperature control mode |
PID closed-loop control + high-frequency pulse |
PID closed-loop control + high-frequency pulse |
PID closed-loop control + high-frequency pulse |
| Temperature control accuracy |
±1.0ºC |
±1.0ºC |
±1.0ºC |
| Temperature difference of heating area |
±2.0ºC |
±2.0ºC |
±2.0ºC |
| Temperature on the stove surface |
≤50ºC |
≤50ºC |
≤50ºC |
| Parameter storage |
Multiple production setting parameters can be stored |
Multiple production setting parameters can be stored |
Multiple production setting parameters can be stored |
| Single-layer chain bearing capacity |
5KG |
5KG |
5KG |
| Complete machine bearing capacity |
250KG |
250KG |
250KG |
| Transportation direction |
Standard left to right |
Standard left to right |
Standard left to right |
| Treatment with support edge |
≥5mm |
≥5mm |
≥5mm |
| Signal interface |
Front key board rear key board |
Front key board rear key board |
Front key board / rear exit board |
| Transport motor |
Coservice / stepper motor |
Servo / stepping motor |
Servo / stepping motor |
| Push board motor |
stepper motor |
stepper motor |
stepper motor |
| Input / out plate height(mm) |
900±20 |
900±20 |
900±20 |
| Productive efficiency |
60min / baking time (min) x number of storage layers |
| Deposit board level |
25mm(64 layers) |
50mm(32 layers) |
75mm(16layers) |
| Bake time |
8min-10000min can be set |
8min-10000min can be set |
8min-10000min can be set |
Glue Dispensing process:
Specification
Our dispensing machine can do point, line, arc or other patterns per required.
Features:
Smart CCD Vision Alignment
Automated Pattern Recognition - Compensates for substrate misalignment
Real-Time Inspection - Detects missing glue or dispensing errors
Semiconductor-Grade Control System
Industrial PC + High-Speed Motion Control Card
User-Friendly Anda Software with drag-and-drop programming
Supports SECS/GEM Protocol for seamless integration into smart factories
Reliability & Cleanroom Compatibility
Vacuum Nozzle Cleaning System - Prevents clogging in precision applications
Anti-Static Design (ESD Protection) - Critical for semiconductor environments
Low-Particulate Construction - Suitable for ISO Class 5-8 cleanrooms
Optimized for Semiconductor Workflows
Working Area: X1/X2 (260mm), Y1/Y2 (260mm), Z (100mm) - Fits wafer trays & JEDEC carriers
Compact Footprint (1120×740×760mm) - Saves valuable cleanroom space
Applications
1. Solder Paste
- Use: PCB assembly (SMT, rework).
- Key: High precision (±0.01mm), jetting/time-pressure.
2. Hot Melt Glue
- Use: Fast bonding (electronics, automotive).
- Key: Heated nozzle (120-200°C), rapid curing.
3. Silicone Gel
- Use: LED encapsulation, sealing.
- Key: Bubble-free, high-viscosity pumps.
4. SMT Adhesives (Epoxy/UV)
- Use: Component fixation, underfill.
- Key: UV/thermal curing, micro-dosing.
5. Epoxy Resin
- Use: Structural bonding, potting.
- Key: Dual-cartridge mixing, vacuum degassing.
6. UV Adhesive
- Use: Optics, touch panels.
- Key: Instant cure (<5 sec), transparent bonds.
7. Coating Gel
- Use: Conformal coating, protection.
- Key: Robotic precision, adjustable thickness.
Exhibition & Customers
Packaging & Shipping
Our dispening machine is packed with wooden pack
Transported by sea, express or truck upon requests.
After Sales Service
Customer Commitment & After-Sales Support
1-Year Comprehensive Warranty
Coverage: Full protection against manufacturing defects (parts/labor included).
Extensions: Optional extended warranty plans available for critical applications.
24/7 Global Technical Support
Response: ≤1-hour emergency response via dedicated hotline/TeamViewer.
Languages: Multilingual engineers (English/Chinese/German/Japanese).
On-Site: Rapid dispatch for unresolved issues (72hrs max for Tier-1 regions).
Value-Added Services
Certifications
We are an ISO 9001-certified manufacturer and innovator specializing in semiconductor equipment, with 6 registered utility model patents (UM Patents) in China. Our patented technologies cover:
Semiconductor annealing systems
Cleaning equipment for semiconductor etching
UV debonding machines
And more .
Backed by ISO 9001 quality management, we ensure high precision, reliability, and efficiency in semiconductor manufacturing processes. Our R&D-driven solutions enhance production yield and cost-effectiveness for global clients in IC packaging, MEMS, and advanced wafer processing.
Partner with us for cutting-edge, patent-protected semiconductor equipment tailored to your needs.
FAQ
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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