| Customization: | Available |
|---|---|
| After-sales Service: | 7*24 Hours |
| Function: | High Temperature Resistance |
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This laser wafer modification stealth dicing equipment is designed for silicon wafers, silicon carbide (SiC) wafers, LED sapphire wafers, and solar-related semiconductor wafers, supporting 4-inch, 6-inch, 8-inch, and optional 12-inch formats. It combines an infrared laser and dedicated optics, a high-precision motion platform, CCD vision functions, and dynamic autofocus to deliver stable internal dicing performance at production speed.
For fabs and packaging lines in Asia (China, Taiwan, Japan, South Korea), Southeast Asia (Malaysia, Singapore, Vietnam, Thailand), India, Europe (Germany, UK, France), and the Americas (USA, Canada, Mexico, Brazil), the goal is the same: improve yield, reduce process steps, and keep throughput high-especially on harder materials like SiC and sapphire.
Processing Speed
Maximum 1000mm/s. That's fast. But remember, actual throughput depends on your material, thickness, and how many passes you need. Still, the speed ceiling gives you headroom.
These are solid numbers. For reference, most production environments need positioning accuracy in the low single-digit micron range. This system delivers that.
Here's where it gets interesting. The SD layer cutting depth error is rated at ≤±3μm. That consistency matters because stealth dicing relies on precise internal modification. If your focus depth wanders, your separation quality suffers.
The system uses an automatic follow-focus mechanism with real-time surface detection. As the wafer surface height varies (and it always does), the focus point adjusts dynamically. That's not a luxury feature-it's essential for consistent results.
430mm × 550mm × 30mm travel range. Plenty of room for 12-inch wafers with margin to spare.
This system is intended for internal modification cutting processes across a broad "pan-semiconductor" range, including:
It also includes features aimed at real factory conditions, such as the ability to handle damaged or partial wafers via wide-angle contour correction and automatic vision processing.
Motion Platform Details
The motion system specs are worth examining:
| Parameter | Specification |
|---|---|
| X/Y Travel | 430mm × 550mm |
| Maximum Speed | 1000mm/s |
| Repeat Positioning | ±0.001mm |
| Straightness | 0.001mm per 200mm |
| Parallelism | ≤10μm |
| Rotary Stage Flatness | ≤2μm |
| θ Axis Rotation | 210° |
| θ Resolution | 15 arc-sec |
The rotary DD motor with 2μm flatness is notable. Precise rotation matters for accurate street alignment, especially on wafers with slight orientation variations.
A few practical features stand out:
Automatic barcode scanning - Links to your production database for automatic recipe loading. Reduces setup errors and speeds changeovers.
Multi-CCD vision system - Handles angle correction, leveling, reference point calibration, and automatic brightness adjustment. Can identify and process damaged wafers automatically.
Automatic loading/unloading - Uses standard wafer frames. One operator can monitor multiple machines.
Wide-angle contour correction - Accommodates imperfect wafer shapes without manual intervention.
These aren't flashy features, but they add up to smoother production flow and less babysitting.
Before you get excited, make sure your facility can support this:
| Requirement | Specification |
|---|---|
| Temperature | 22°C ± 2°C |
| Humidity | 30-60% |
| Cleanliness | Class 1000 or better |
| Compressed Air | 0.5-0.8 MPa (CDA) |
| Power | Single phase 220V, 50Hz, 20A+ |
| Grid Fluctuation | <5% |
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products: Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Packaging & Freight Services
We ensure your semiconductor equipment arrives in perfect condition, anywhere in the world.
Secure Packaging: Protected with shock-absorbing bubble foam inside a robust wooden crate for maximum transit safety.
Global Logistics: We arrange and manage reliable shipping via road, sea, and air freight to meet your timeline and budget needs.
Your precision equipment is handled with care from our door to yours.
Q1: How to choose a suitable machine?
A1: You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2: What is the warranty period for the equipment?
A2: One year warranty and 24 hours online professional technical support.
Q3: How to choose a suitable machine?
A3: You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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