| Customization: | Available |
|---|---|
| After-sales Service: | Provide |
| Function: | High Temperature Resistance |
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| Category | Specification |
|---|---|
| Temperature Range | RT (Room Temperature) to 1100°C |
| Temperature Uniformity | Better than ±2°C across the furnace |
| Network Belt Speed | 20-150 mm/min (stepless adjustable) |
| Heating Rate | Automatically adjustable; maximum rate <2°C/min |
| Atmosphere Control | Nitrogen-oxygen mixed gas; oxygen content adjustable (20-300 ppm) |
| Temperature Zones | 8-10 independent control zones |
| Network Belt Width | 200 mm |
1,Technical indicators
The use of temperature RT-1100 C
The uniformity of the furnace is better than that of 2 C
Network belt running speed 20-150mm/min stepless adjustable
The adjustable heating rate of the automatic heating rate is less than 2 /min
Nitrogen and oxygen mixed gas oxygen content 20-300pp adjustable
8-10 temperature zone in temperature control zone
Network band width 200mm
2,Progressiveness
The oxidation atmosphere is uniform, the atmosphere is segmented and controllable, the temperature uniformity is high (high uniformity), the automatic heating can be adjusted, the safety and protection function is complete, the maintenance operation is convenient, the energy saving and environmental protection, the atmosphere closed loop control, the high temperature anti deformation structure, and the unique temperature control mode are unique.
3,Detail display
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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