Semiconductor Vertical Collating Machine (Wafer/Disc Handling System)

• After-sales Service: Online Service
• Warranty: 12 Month
• Plate: Gravure Printing
• Model NO.: C-150
• Structure: Rotary Letterpress
• Color & Page: Multi-Colour Printing Press
• Usage: Paper Printer
• Automatic Grade: Semi-Automatic
• Printing Interface: USB2.0
• Printing Speed: 7.5CPI
• System Supported: Windowsxp32
• Application: Wafer/Substrate Collation for Semiconductor Produc
• Detection Sensitivity: Adjustable Sensitivity for Wafer Alignment and De
• Feeding Mode: Single/Double-Number Switching
• Feeding Mechanism: Rubbing Wheel for Gentle Wafer Handling
• Alarm Functions: Double Sheet / Paper Jam / Feeding Failure
• Collation Speed: 70 Sets/Minute
• Material Thickness: Standard Grids (2-9): 35–160G/M²
• Precision Alignment: ≤0.5µm Wafer Positioning Accuracy
• Transport Package: Wooden Package
• Specification: 0.5 Square Meter
• Trademark: Himalaya
• Origin: China
• HS Code: 8541590000
• Production Capacity: 300

Product Description

Product Description

Semiconductor Vertical Collating Machine (Wafer/Disc Handling System)
 

Key Features for Semiconductor Production:

1. Ultra-Clean Material Handling

   • Class 1000 cleanroom-compatible design
   • Anti-static components for sensitive wafer processing
   • Contamination-free collating mechanism

2. Precision Alignment System

   • Sub-micron alignment accuracy (≤0.5μm)
   • Vision-assisted positioning for wafer/disc stacking
   • Multi-sensor feedback control

3. Specialized Material Compatibility

   • Processes silicon wafers (100mm-300mm)
   • Handles glass substrates and ceramic discs
   • Customizable for semiconductor packaging materials

4. Smart Factory Integration

   • SECS/GEM protocol support
   • Real-time production data tracking
   • Automated lot tracking and traceability

5. Advanced Safety Features

   • Fragile material protection system
   • Vibration-dampened operation
   • Emergency wafer protection mode

Machine features
This machine is mainly used for fast printing machines to complete the night pairing function of multiple identical sheets of paper. Support numbered paper feeding
The paper feeding method adopts a rubbing wheel, and it is prohibited to adjust the pressure of different thicknesses of paper in four levels.
The EC-4800 page matching machine has a brand new operation panel that reflects the operating status, error mode, and error location, making it easy to quickly check and correct, and intuitive and clear. Error indicates paper jam, while error indicates that paper jam, double sheet, no paper, or full paper tray can all be displayed through the indicator light. There is a fault relief button on the device, which can be used to automatically resolve the fault.

 

Product Parameters

 

Technical Specification Table: EC-4800 Vertical Collating Machine (Wafer/Substrate Handling)

Category	Specification
Model	EC-4800
Application	Wafer/substrate collation for semiconductor production
Storage & Data	Supports insert mode data storage (up to 4 sets)
Detection Sensitivity	Adjustable sensitivity for wafer alignment and defect tracking
Feeding Mode	Single/Double-number switching (13579/246810 sequencing)
Feeding Mechanism	Rubbing wheel for gentle wafer handling
Delivery Method	Cross delivery / Upright delivery
Alarm Functions	Double sheet / Paper jam / Feeding failure / No paper (wafer) detection
Max. Wafer Size	328 × 469mm (supports up to 300mm wafers)
Min. Wafer Size	90 × 100mm
Collation Speed	70 sets/minute (adjustable for fragile materials)
Material Thickness	Standard grids (2-9): 35-160g/m²
Edge grids (1 & 10): 35-210g/m²
Paper Capacity	High-capacity input hopper for reduced manual reloading
Automation	SECS/GEM-compatible for smart factory integration
Precision Alignment	≤0.5µm wafer positioning accuracy
Safety Features	Anti-static, vibration damping, emergency stop

Support insert mode data storage, capable of storing up to 4 sets.
The detection sensitivity can be adjusted according to the needs.
It is possible to switch between single and double number paper feeding, namely 13579 and 246810, without the need for frequent paper addition, effectively improving efficiency.
Technical parameters: Model EC-4800
Number of cells: 10 cells
Paper feeding method: Rubbing wheel
Paper delivery method: Cross delivery, upright delivery
Alarm function for double/paper jam/paper feeding failure/no paper
Maximum paper feeding 328X469mm
Minimum paper feed size 90X100mm
Page speed: 70 sets/minute
Paper thickness: 35-160g/m2 (2-9 grids)
35~210g/m2 (1 and 10 grids) high-quality paper
Paper capacity 
 

Packaging & Shipping

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.