High-Precision Fiber Laser Engraver for Durable Plastic Cards

• Customization: Available
• After-sales Service: Provided
• Warranty: Provided
• Model NO.: FMM-04
• Laser Visibility: Visible
• Applicable Material: Metal
• Cooling System: Air Cooling
• Technical Class: Continuous Wave Laser
• Laser Wavelength: Fiber Laser
• Laser Classification: Semiconductor Laser
• Type: Semiconductor Laser Marking Machine
• Marking Method: Scanning Marking
• Wavelength: 1064nm
• Power: 20W
• Stability: ≤5%
• Single Pulse Energy: 1mj
• Working Frequency: 20 to 200kHz
• Minimum Code Width: 0.1mm
• Standard Range: 100mm × 100mm
• Standard Focal Length: 188±2mm
• Power Requirement: AC 220V/50Hz/3A
• Cooling Mode: Air Cooling
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

 

Product Description

Brief Description

Fiber Laser mainly applicable to metal materials, partial plastic materials and coated non-metal materials by high-speed flight marking. Such as aluminum,stainless steel,copper etc., and few plastic material, metal can with coating layer, color printing paper etc.

 

Main Parameter

Item	Parameter
Wavelength	1064nm
Power	20W
Stability	≤5%
Single Pulse Energy	1mJ
Working Frequency	20-200KHz
Minimum Code Width	0.1mm
Minimum Character Size	0.30mm
Repeatability Accuracy	±0.01mm
Standard Marking Range	100mm×100mm
Standard Focal Length	188±2mm(From laserhead baseboard to focus area)
Optional Marking Range	70mm×70mm to 400mm×400 mm
Nominal Line Speed	≥10000mm/s
Printing Code	>700 Chars/Sec
Power Requirement	AC 220V/50HZ/3A
Overall Power Consumption	Peak≤0.5KW,Average≤0.25KW
Cooling Mode	Air Cooling
Level of Protection	IP54
Cable Length	3m
Machine Size	main beam:578mm×96.5mm×124mm
	main control cabinet:515mm×220mm×456mm
	lifting platform:450mm×450mm×1100mm(Customized)

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.