Intelligent Dispensing Station with Advanced Ai Vision Recognition

Product Description

Product Description

 

 

Standard Features 

1. Computer control with Windows OS

2. CCD visual positioning system

3. Servo motor with ball screw

4. Inline CCD visual programming or gerber upload

5. UPS and voltage stabilizer

6. ESD grounding point

7. CE certified

 

Optional Features 

1. Heated valves for viscosity control

2. 35 degree tilt and 360 degree rotation

3. PCB heater enhances material flow for underfill applications

4. Precision weight measurement ensures accurate volumetric dispensing

5. Multiple valves available: Pneumatic jet valve, Slide valve and Screw valve

6. Laser height detection to calibrate Z axis automatically for component deformation

Product advantage:

 

1.Cost-effective with high-performance.

2.Non-contact injection valve to achieve a smaller dispensing diameter and a wider application field.

3.The injection valve improves the reliability and consistency of dispensing, also increases productivity and material utilization

4.The minimum overflow width of Underfill is only 0.2mm (related to configuration and glue)

5.Recognize the chip body, which is more accurate than Mark point recognition and positioning

6.Identity recognition, automatic program call, foolproof, data statistics and other functions to realize intelligent manufacturing
 

Specifications	iJet-10 Dispensing Machine
Dimension(mm)	L761×W1350×H1560
Dispensing Area(mm)	X: 320  Y: 400 Z: 30
Repeatability (mm)	±0.005
Maximum moving speed (mm/s)	1300
Maximum acceleration (g)	1.3
Standard configuration	Three axes motion platform;  Visual recognition system; Vacuum cleaning device;  Laser altimeter; Low liquid level detection device; Sound and light alarm device; Single conveyor module
Optional configuration	Piezoelectric injection module; Weighting module; Lane tooling heating module;  Automatic loading and unloading module; Dual-valve module;  Rotating R-axis module;  3D dispensing module

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.