Advanced Sic Chip Wafer Splitting Equipment with CCD Technology

Product Description

Wafer splitting machine

Advanced Wafer Splitting Machine – Precision, Reliability, and Zero-Damage Performance Our cutting-edge wafer splitting machine is engineered for ultra-precise processing of fragile materials, including LED, SiC, glass, and ceramic wafers. By combining laser pre-processing for clean, controlled cuts with our patented blade-lifting technology, it ensures perfect separation—no cracking, no damage. The integrated high-resolution CCD system continuously auto-corrects alignment and verifies every split, guaranteeing flawless results batch after batch. Designed for uninterrupted operation, the system runs autonomously—your team simply loads and unloads frames, eliminating the need for constant supervision. Whether you're working with LEDs, SiC, or ceramics, this machine delivers: Ultra-High Precision – Laser-guided accuracy for defect-free splitting Zero Damage Guaranteed – Gentle blade lifting prevents micro-cracks.

Specification

Wafer Splitting System Technical Description

(Optimized for ≤8-inch wafers, 100–400 µm thickness, 24×24 to 60×60 mils chip size)

 
1. System Overview
Key Components:

Vision System: Wide-angle CCD for contour capture, automatic fragment discrimination, and laser path alignment (µm-level precision).
Motion Stages:X-Y Table: 210×210mm stroke, 120mm/sec max speed (servo-driven).
Z-Axis Rotation: 120° range, 0.001° resolution.
F-Axis (Splitting Blade): 55mm travel, 50mm/sec speed.
Support Structure: 9-inch iron ring for wafer handling; 220mm receiver edge/blade length (±3µm straightness).
Core Functionality: Automated wafer positioning, splitting, barcode recording, and parameter-adjusted shifts.

 
2. Splitting Process Workflow
Step 1: Wafer Loading & Alignment

Wafer extracted from cassette → Wide-angle CCD scans contour.
Visual Alignment: CCD locates first cutting position and barcodes; X-Y table adjusts wafer position.
Step 2: Precision Splitting

Blade Action: 6µm-wide blade (±3µm accuracy) applies controlled force along laser scribe line.
Support Mechanism: Symmetrical receiver platform (gap adjustable) with 25µm non-adhesive protective film to minimize edge collapse.
Fracture Dynamics: Blade induces micro-crack propagation via three-point bending (front/rear platforms).
Step 3: Post-Split Inspection

Automated fragment detection (whole vs. broken).
Hammer force/length compensation adjustments based on real-time feedback.
 

Wafer Splitting System Technical Description

3. Critical Technical Specifications
Parameter
Value
Tolerance
Wafer Size
≤8 inches (9-inch iron ring)
N/A
Wafer Thickness
100–400 µm
Suggested range
Blade Width
5–6 µm
±3 µm
Support Table Flatness
5 µm
±3 µm
X-Y Speed
120 mm/sec (max)
Servo-controlled
 
4. Advantages & Innovations
Edge Collapse Reduction: Protective film + three-point bending minimizes stress on non-scribe areas.
Automation:1-click knife/receiver platform calibration.
Barcode-driven parameter shifts (no manual intervention).
Flexibility: Supports forward/reverse splitting modes (auto/manual).
Example Application: Glass-based MEMS devices requiring clean fractures with <5µm edge variation.
 
5. Process Validation
Key Metrics:100% visual inspection of split edges.
Force compensation algorithms to adapt to wafer thickness variations.
Failure Modes Mitigated:Incomplete splits: Adjusted via blade speed/force settings.
Contamination: Non-adhesive film prevents residue transfer.

Loading and Unloading Mechanism
1.1 Positioning Track	Automatic correction for material pieces	-
1.2 Standard Cassette	25-layer cassette	-
1.3 Chip Gripper	Device mechanism	-
1.3.1 Gripper Error	Automatic detection of abnormal material retrieval	-
1.4 Iron Ring (6")	Standard iron ring	-
1.4.1 Ring Tolerance	Appearance dimension tolerance	< 0.3mm
1.5 Wafer Patch	Positioning accuracy	± 5mm
1.6 Wafer Mounting	Angle limitation	≤ 30°
1.7 Iron Ring Deform.	Maximum allowable deformation	< 1mm

2. CCD Automatic Alignment Function
2.1 Edge Finding	Automatic alignment of fragments	Permissible radius < 2mm
2.2 θ Angle Alignment	Servo + teeth mechanism	-
3.1 Splitting Position	Automatic correction & accuracy	0.005mm

Packing & Delivery

Packing
Freight Service
Packaging
Wooden Crate (IPPC Certified)Heavy-duty plywood/wooden case with fumigation compliance (ISPM-15 standard).
Shock-absorbent cushioning (foam, airbags) to protect sensitive components.
Weatherproof & tamper-proof sealing for international shipping.

Freight Options
Air Freight (Recommended for Urgent Shipments)
Sea-freight
Railway Freight (Land-Based Alternative)

Company Profile

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu Himalaya Semiconductor Co., Ltd. is a premier semiconductor equipment manufacturer and global exporter established in 2019. We specialize in providing high-performance, cost-effective semiconductor manufacturing solutions to clients worldwide, with a strong presence in 30+ countries and a network of 200+ satisfied customers and suppliers.
 
Our mission is to deliver the highest value at the final procurement stage, ensuring:
Cost Efficiency – Competitive pricing without compromising quality Risk-Free Transactions – Secure one-time payment solutions for suppliersReliable Integration – End-to-end equipment and technical support

FAQ

Q1: Does it work with phone cases?

A: Yes! Charges through cases up to 8mm thick (plastic, silicone, or TPU).

Q2: Why does my device charge slowly?

A: Ensure your phone supports 15W wireless charging. Lower power may apply for non-Qi devices.

Q3: How do I claim warranty service?

A: Email your order ID and issue description to ***@***.com. We’ll respond within 24 hours.