8-Inch Stainless Steel Wafer Frame Dicing Ring for Semiconductor Use
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Product Details
| Customization: | Available |
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| After-sales Service: | 7*24 Hours |
| Function: | Abrasion Resistance, Lubrication, High Temperature Resistance, Abrasion Resistance, Lubrication, High Temperature Resistance |
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Basic Info.
- Model NO.
- FR-01
- Demoulding
- Pull Core, Pull Core
- Condition
- New, New
- Certification
- ISO, CE, ISO, CE
- Warranty
- 12 Months, 12 Months
- Automatic Grade
- Automatic, Automatic
- Installation
- Vertical, Vertical
- Driven Type
- Electric, Electric
- Mould Life
- <300,000 Shots, <300,000 Shots
- After-Sales Service
- 7*24 Hours
- Material
- Metal
- Type
- Case
- Size
- Small
- Waterproof
- Waterproof
- Hardness
- Medium Soft
- Gender
- Unisex
- Usage
- Wafer
- Inside Material
- Stainless Steel
- Logo Printing
- Customized
- Color
- Silver
- Item Name
- Water Ring Frame; 6" 8" 12" Steel Metal Wafer Fram
- Physical Material
- Dura420; SUS420J2; Stainless Steel; Metal
- Sample Hardness
- HRC48-55, HRC47
- Flatness
- <0.2mm; 0.2mm or Less (for 6"/8")
- Surface Treatment
- Mechanical Polishing
- Application
- Semiconductor Laboratory Equipment; Semiconductor
- Customized Service
- Customized
- Marking and Logi
- Customized
- Transport Package
- Crate
- Specification
- 6, 8, 10, 12 inch
- Trademark
- Himalaya
- Origin
- China
- Production Capacity
- 10000
Product Description
Product Description
Introduce Our Stainless Steel Wafer Frame
Our Stainless Steel Wafer Frame is a high-performance solution tailored for semiconductor manufacturing, engineered to meet the rigorous demands of wafer grinding and cutting processes. Crafted from top-grade stainless steel (including SUS420J2/Dura420 variants), this wafer ring combines exceptional durability with precise engineering, ensuring consistent performance across repeated use—making it a reliable choice for semiconductor labs and production facilities worldwide.
Key Application
Ideal for semiconductor laboratory equipment and industrial semiconductor production, our wafer frame supports the processing of
Wafers (silicon, sapphire, and other materials)
Semiconductor chip
Microelectronic component
It is specifically optimized for
Wafer grindind
Wafer dicing/cutting
Post-processing shipping and handling
Ideal for semiconductor laboratory equipment and industrial semiconductor production, our wafer frame supports the processing of
Wafers (silicon, sapphire, and other materials)
Semiconductor chip
Microelectronic component
It is specifically optimized for
Wafer grindind
Wafer dicing/cutting
Post-processing shipping and handling
Product Overview
Our wafer rings are precisely engineered from high-qualitystainless steel, offering superior flatness and hardnessDesigned specifically for use with wafer cutting machinesthey ensure stable fixation of the outer frame during wafeigrinding and cutting processes, and can be shipped directlypost-cutting.
The stainless steel material provides excellent anti.warping, anti-corrosion, and scratch-resistant propertiesensuring durability and long-lasting performance. Additionally, the wafer rings are reusable and can berepeatedly cleaned, making them both environmentallyfriendly and cost-effective.
Key Advantage
CUSTOMIZED SERVICE
Compatible with BLUE TAPE, offeringreusable cleaning services for environmental and economic benefits.High strength and resilience, ideal for thegrinding and cutting of wafers, chips, andsemiconductors.
Constructed to be used with wafer cuttingequipment, reducing contamination risk. Stable product quality and reliable performance with repeated use.
Constructed to be used with wafer cuttingequipment, reducing contamination risk. Stable product quality and reliable performance with repeated use.
We provide flexible OEM and ODM services to meet the unique needs of
our global clients.With over 10 years of experience, we design and manufacture tailored waferring solutions, ensuring yourspecifications and brand standards are met with the highest quality.
Key Functions of Wafer Ring Frame | |
Mechanical Support | Prevents warpage, bending, and cracking of thin wafers (especially those below 100µm thickness) during mechanical processes like back-grinding and transportation. |
Tape Integration Platform | Provides a rigid, stable, and standardized surface for mounting various process-specific tapes, including dicing tape, back-grinding tape, and UV-release tape. |
Automation Compatibility | Manufactured in standardized outer diameters (6", 8", 12") to ensure compatibility with automated robotic handling, pick-and-place systems, and processing equipment. |
Thermal & Chemical Stability | Constructed from materials like stainless steel or advanced engineering plastics (PEEK, CFRP) to resist warping, expansion, and degradation under high temperatures and harsh chemicals. |
Process Integration | Enables seamless transitions between sequential manufacturing steps (e.g., back-grinding → dicing → die ejection) without the need to remount the wafer, improving throughput and reducing handling damage. |
Specification
Product Name | Wafer Frame |
Shape | Ring |
Raw Material | SUS 420J2 |
Surface Finish | Surface Polishing |
MOQ | 100 pcs |
Specification | Can be customized, Factory direct sales complete specifications |
Feature | Corrosion Resistance/ Scratch-Resistant/ Anti-Static/ Reusable |
Application | Semiconductor/ Optoelectronics/ Medical/ Precision Machining |
Packing | Carton |
Packing & Delivery
1. Core Packaging Solutions
Inner Layer: Each frame in static-free/lint-free PE bags (with desiccant) + custom EVA/corrugated dividers (no shifting).
Middle Layer: Reinforced corrugated cartons (max 20kg/box) with QR code traceability.
Outer Layer: Waterproof fiberboard/plastic crates (ISTA 3A shockproof) + compliance markings (HS Code 7326901900, origin).
Inner Layer: Each frame in static-free/lint-free PE bags (with desiccant) + custom EVA/corrugated dividers (no shifting).
Middle Layer: Reinforced corrugated cartons (max 20kg/box) with QR code traceability.
Outer Layer: Waterproof fiberboard/plastic crates (ISTA 3A shockproof) + compliance markings (HS Code 7326901900, origin).
2. Streamlined Transportation
Partners: DHL/FedEx/Sinotrans (semiconductor logistics expertise).
Controls: Climate-controlled containers (15–25℃, 20–40% RH) + real-time temp/humidity tracking.
Support: 24/7 shipment tracking, full docs (CoC, cleanroom cert), post-delivery unpacking guidance.
Company Profile
Company Name
Jiangsu Himalaya Semiconductor Co., Ltd
As a professional player in the global semiconductor industry, Jiangsu Himalaya Semiconductor Co., Ltd. integrates R&D, manufacturing, and customization to deliver high-performance stainless steel wafer ring frames. Tailored for critical semiconductor processes—including wafer grinding, dicing, and post-process shipping—our products combine precision engineering with long-lasting durability, trusted by semiconductor manufacturers worldwide.
FAQ
1. What's a wafer frame for?
It holds wafers steady during grinding, dicing, and shipping in semiconductor manufacturing.
It holds wafers steady during grinding, dicing, and shipping in semiconductor manufacturing.
2. Material?
Mainly high-quality stainless steel (e.g., SUS420J2) for durability.
3. Reusable?
Yes—clean and reuse, saving cost and being eco-friendly.
Yes—clean and reuse, saving cost and being eco-friendly.
4. Sizes?
Common: 6", 8", 12"; custom sizes available.
5. Customizable?
Yes—OEM/ODM for size, surface, branding.
Compatible with tape?
Works with tapes like BLUE TAPE for dicing.
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