Advanced Modular Laser Annealing System for Sic Technologies
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Product Highlights
- Modular Design Compatibility: Supports 4, 6, and 8-inch thin chip wafers with flexible integration.
- Advanced Laser Technology: Self-developed laser shaping ensures uniform and stable spot energy.
- High Precision Annealing: Produces uniform, flat surfaces with excellent electrical properties.
- Strict Process Control: Controls oxygen content and carbon precipitation for minimized defects.
- SEMI Standard Compliance: Equipped with EFEM system supporting SECS-GEM communication.
- Comprehensive Warranty: 12-month warranty coverage with 24-hour online technical support.
- Flexible Customization: Offers OEM, ODM, and design services for tailored solutions.
- High Mould Life: Durable mould life ranging from 300,000 to 1,000,000 shots.
Product Attributes
- Customization
- Available
- After-sales Service
- Provided
- Function
- High Temperature Resistance
- Model NO.
- LAM-01
- Demoulding
- Automatic
- Condition
- New
- Certification
- RoHS, ISO, CE
- Warranty
- 12 Months
- Automatic Grade
- Automatic
- Installation
- Vertical
- Driven Type
- Electric
- Mould Life
- 300,000-1,000,000 Shots
- Product Name
- Semiconductor Equipment
- Feature 1
- High Precision
- Feature 2
- High Efficiency
- After-Sale Service
- Provided
- Transport Package
- Customized or Wooden Box Packaging
- Specification
- Standard Specifications
- Trademark
- Himalaya
- Origin
- China
- Production Capacity
- 100
Product Images of Advanced Modular Laser Annealing System for Sic Technologies
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Advanced Modular Laser Annealing System for Sic Technologies -
Advanced Modular Laser Annealing System for Sic Technologies -
Advanced Modular Laser Annealing System for Sic Technologies -
Advanced Modular Laser Annealing System for Sic Technologies -
Advanced Modular Laser Annealing System for Sic Technologies -
Advanced Modular Laser Annealing System for Sic Technologies -
Advanced Modular Laser Annealing System for Sic Technologies
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Product Description
Hot Selling Modular Design and Integration Laser Annealing Machine for Sic
Equipment features:
1. Modular design and integration of the entire machine, compatible with 4, 6, and 8-inch thin chip wafers.
2. Integrated self-developed advanced laser shaping technology, with highly uniform and stable spot energy.
3. After annealing, the surface is uniform and flat, exhibiting excellent electrical and surface morphology characteristics.
4. Strictly control the oxygen content in the cavity, effectively control the amount and distribution of surface carbon precipitation.
5. Configure a monitoring and compensation system to monitor optical energy stability and non annealed surface temperature.
6. Equipped with EFEM transmission system, the whole machine complies with SEMI standards and supports SECS-GEM communication.
Laser Annealing Machine for SiC - Feature Overview
| Category | Specifications & Features |
|---|---|
| Compatibility | Supports 4", 6", 8" thin-chip SiC wafers (modular design for flexible integration). |
| Laser Technology | • Self-developed laser shaping for uniform, stable spot energy. |
| • Precise control of energy distribution for consistent annealing results. | |
| Annealing Quality | • Uniform, flat surface post-annealing. |
| • Excellent electrical properties & surface morphology. | |
| • Controlled carbon precipitation (minimized surface defects). | |
| Process Control | • Oxygen content regulation in chamber for optimized annealing environment. |
Application scope: Annealing transition metals deposited on heavily doped silicon carbide (SiC) surfaces to form good Ohmic contacts
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:Why choose us?
A3:OEM/ODM/Designing service.
About the Supplier
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Company Profile
Empowering Global Semiconductor Excellence: An Introduction to Jiangsu Himalaya Semiconductor Co., Ltd.
In the rapidly evolving landscape of global electronics, precision and reliability are the cornerstones of success. Since its establishment in 2019, Jiangsu Himalaya Semiconductor Co., Ltd. Has emerged as a pivotal force in the semiconductor industry, specializing in the high-level integration and international trade of advanced manufacturing equipment.
With a footprint extending to over 30 countries and a robust network of more than 200 global customers and suppliers, we serve as the critical link in the semiconductor supply chain. Our mission is clear: To secure the most cost-effective, high-performance solutions for our clients while ensuring seamless, risk-free transactions for our partners.
Comprehensive Equipment Solutions for Semiconductor Manufacturing
We take pride in our diverse portfolio of high-precision machinery designed to meet the rigorous demands of modern wafer processing and packaging.
1. Advanced Bonding & Marking
Precision at the microscopic level is essential for chip integrity. Our core lineup includes:
Die Bonders: Ensuring high-speed, accurate placement of chips.
Wire Bonding: Providing reliable electrical interconnections with industry-leading stability.
Laser Marking: Specialized ID marking for IC wafers to ensure full traceability throughout the lifecycle.
2. Cutting-Edge Laser Processing
As wafers become thinner and materials more complex, our laser solutions provide the necessary finesse without compromising structural integrity:
Laser Grooving & Cutting: Expertly designed for glass, ceramics, and wafer packaging.
Internal Modification Machines: Specialized laser technology for Si/SiC (Silicon Carbide) and LT/LN (Lithium Tantalate/Lithium Niobate) wafers.
Laser Annealing: Optimized for Si/SiC substrates to enhance electrical properties and repair lattice damage.
3. Dicing & Dispensing
Automatic Dicing Saw Machines: High-efficiency dicing for wafer packaging applications.
Automatic Silicone Dispensing Equipment: Precision fluid control for protective coating and encapsulation.
Customized Industrial Solutions
Beyond standard machinery, Jiangsu Himalaya Semiconductor provides specialized engineering solutions tailored to unique factory requirements:
TGV (Through Glass Via) Technology: Offering manual, semi-automatic, and fully automatic equipment for next-generation 3D packaging.
Coating & Plating: Customized machines designed for specific surface treatment and metal deposition needs.
Environmental & Resource Management: Efficient solutions for handling exhausted metal sorter equipment, promoting sustainable manufacturing practices.
Why Partner with Jiangsu Himalaya Semiconductor?
In a market defined by volatility, we offer stability and strategic advantage. We understand that for our customers, the "final stage" of procurement is the most critical. We utilize our deep industry expertise to filter through global options, delivering products that balance cost with cutting-edge performance.
For our suppliers, we are a partner of trust. We strive for one-time payment collection and comprehensive risk avoidance, allowing manufacturers to focus on innovation while we handle the complexities of global distribution.
Contact Us Today
Whether you are scaling your production line or seeking a reliable global export partner, Jiangsu Himalaya Semiconductor Co., Ltd. is ready to elevate your operations.
Explore the peak of semiconductor technology with Himalaya.
About Our Factory & Business Background
- Address
- Room 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
-
Registered Capital
- 100,000,000 RMB
-
Terms of Payment
- LC, T/T, PayPal, Western Union
-
International Commercial Terms(Incoterms)
- FOB, CIF, CFR, EXW
-
Average Lead Time
-
Peak Season Lead Time: 3-6 months
Off Season Lead Time: 1-3 months -
Nearest Port
- Shenzhen Port
-
Minimum Order Quantity
- 1 Set
-
Supply Chain Partners
- 30
Our Production Capability & Technical Expertise
-
Main Products
- Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
-
Inspection Type for Finished Products
- 100% inspection(Visual inspection & Function inspection)
-
Inspection Method for Finished Products
- Finished product checked by packing staff
-
Customization Options
- Flexible customization
-
ODM Service Available
- Yes
-
OEM Service Available
- Yes
-
Traceability of Raw Materials
- No
Our Industry Experience & Global Business Record
-
Year of Establishment
- 2019-09-12
-
Export Year
- 5 Years
-
Main Markets
- Europe
-
Repeat Buyers Choice
- 80%~100%
FAQ
- How to choose a suitable machine?
- You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
- What is the warranty period for the equipment?
- One year warranty and 24 hours online professional technical support.
- Why choose us?
- OEM/ODM/Designing service.
- What wafer sizes does the machine support?
- The machine supports 4, 6, and 8-inch thin chip SiC wafers with a modular design.
- What is the lead time for orders?
- Peak season lead time is 3-6 months, while off-season lead time is 1-3 months.
- What payment terms are accepted?
- We accept LC, T/T, PayPal, and Western Union.
- Is customization available for this equipment?
- Yes, flexible customization is available including OEM and ODM services.
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