High-Performance Dqx Series RF Plasma Cleaner for Precision Applications

• Customization: Available
• After-sales Service: Provided
• Warranty: 12 Months
• Model NO.: DQX
• Product Name: Plasma Cleaning Machine
• Function: Plasma Cleaning
• Certification: ISO
• Condition: New
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

Dqx Series Radio Frequency Plasma Cleaning Machine

Product Description

 

The principle of plasma cleaning is to from high frequency alternating electrodes in vacuum condition, so that the gas in this area will from to be plasma by agitating of alternnting electric field. And then active plasma act both physical bombardment & chemical reaction on the cleared objects to make surface materials of the objects become particles and gaseous materials, so as to achieve cleaning by vacuum exhausting.

Aspect	Description
Basic Principle	Utilizes active particles generated by plasma discharge to react with and remove surface contaminants.
Reaction Process - Chemical	Active particles react with organic contaminants, breaking their chemical bonds and converting them into volatile by-products like CO2 and H2O.
Reaction Process - Physical	Energetic particles bombard the surface, physically sputtering contaminants and causing them to decompose or detach.
Key Features	- Material Versatility: Effective on metals, semiconductors, oxides, and most polymers.
	- Efficiency: Operates with very low gas flow rates.
	- Precision: Capable of overall, local, and complex structure cleaning.
	- Eco-Friendly: No chemical solvents, making it a dry and clean process.
	- Economic & Scalable: Low production cost, excellent uniformity, repeatability, and suitability for batch production.

Application

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:Why choose us?
A3:OEM/ODM/Designing service.