| Customization: | Available |
|---|---|
| Certification: | ISO9001 |
| Protection: | Corrosion Resistance |
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When silicon wafers overlap on the carrier, the suction cup of the robot in the loading and unloading process will crush the silicon wafers, causing damage to the silicon wafers. If fragments and foreign objects enter, it will easily contaminate the vacuum chamber after the high-temperature process, affecting production and increasing maintenance costs. Therefore, it is necessary to control the overlapping of silicon wafers on the carrier.
· Overlapping Wafers: Misalignment and overlapping during robot handling cause wafer breakage, leading to increased defects.
· Contamination Hazards: Fragments and foreign particles from broken wafers risk contaminating the vacuum chamber, disrupting production and escalating maintenance costs.
· High-Temperature Sensitivity: Misaligned wafers in high-temperature processes can lead to further damage and operational inefficiencies.
Features:
(1) Ultra-High Resolution Detection: Identifies wafer overlap and edge misalignment with exceptional clarity to improve placement accuracy.
(2) Compact and Integrated Design: Eliminates the need for a separate controller, reducing installation space by over 50% while maintaining efficiency.
(3) High Detection Accuracy: Achieves a missed detection rate as low as 0.002%, minimizing defects and maximizing throughput.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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