Advanced Wafer Bonding Equipment for High-Performance Melt Solutions
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Product Highlights
- Multi-Model Versatility: Offers JYJ-200A, 200B, and 200C models for diverse bonding needs.
- Wide Material Compatibility: Supports SiC, metals, ceramics, polymers, and MEMS wafer bonding.
- High Precision Performance: Features high bonding pressure and excellent temperature uniformity.
- Flexible Customization: Provides OEM/ODM services with flexible customization options.
- Global Supply Chain: Exported to over 30 countries with a robust supplier network.
- Quality Assurance: 100% inspection including visual and function checks before shipping.
- Professional Support: 24-hour online technical support and one-year warranty included.
- Cost-Effective Solutions: Aims to provide the highest cost-effective products for customers.
Product Attributes
- Customization
- Available
- After-sales Service
- Provide
- Warranty
- 12 Months
- Model NO.
- JYJ-200A/JYJ-200B/JYJ-200C
- Product Name
- Wafer Bonding Equipment
- Application
- for Hot Pressing Bonding
- Certification
- ISO
- Condition
- New
- Transport Package
- Customized or Wooden Box Packaging
- Specification
- Standard Specifications
- Trademark
- Himalaya
- Origin
- China
Product Images of Advanced Wafer Bonding Equipment for High-Performance Melt Solutions
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Advanced Wafer Bonding Equipment for High-Performance Melt Solutions -
Advanced Wafer Bonding Equipment for High-Performance Melt Solutions -
Advanced Wafer Bonding Equipment for High-Performance Melt Solutions -
Advanced Wafer Bonding Equipment for High-Performance Melt Solutions -
Advanced Wafer Bonding Equipment for High-Performance Melt Solutions -
Advanced Wafer Bonding Equipment for High-Performance Melt Solutions -
Advanced Wafer Bonding Equipment for High-Performance Melt Solutions
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Product Description
It is mainly used for SiC seed crystal
It is mainly used for hot pressing bonding,
JYJ-200C
It is mainly used for wafer level packaging of
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
About the Supplier
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Company Profile
Empowering Global Semiconductor Excellence: An Introduction to Jiangsu Himalaya Semiconductor Co., Ltd.
In the rapidly evolving landscape of global electronics, precision and reliability are the cornerstones of success. Since its establishment in 2019, Jiangsu Himalaya Semiconductor Co., Ltd. Has emerged as a pivotal force in the semiconductor industry, specializing in the high-level integration and international trade of advanced manufacturing equipment.
With a footprint extending to over 30 countries and a robust network of more than 200 global customers and suppliers, we serve as the critical link in the semiconductor supply chain. Our mission is clear: To secure the most cost-effective, high-performance solutions for our clients while ensuring seamless, risk-free transactions for our partners.
Comprehensive Equipment Solutions for Semiconductor Manufacturing
We take pride in our diverse portfolio of high-precision machinery designed to meet the rigorous demands of modern wafer processing and packaging.
1. Advanced Bonding & Marking
Precision at the microscopic level is essential for chip integrity. Our core lineup includes:
Die Bonders: Ensuring high-speed, accurate placement of chips.
Wire Bonding: Providing reliable electrical interconnections with industry-leading stability.
Laser Marking: Specialized ID marking for IC wafers to ensure full traceability throughout the lifecycle.
2. Cutting-Edge Laser Processing
As wafers become thinner and materials more complex, our laser solutions provide the necessary finesse without compromising structural integrity:
Laser Grooving & Cutting: Expertly designed for glass, ceramics, and wafer packaging.
Internal Modification Machines: Specialized laser technology for Si/SiC (Silicon Carbide) and LT/LN (Lithium Tantalate/Lithium Niobate) wafers.
Laser Annealing: Optimized for Si/SiC substrates to enhance electrical properties and repair lattice damage.
3. Dicing & Dispensing
Automatic Dicing Saw Machines: High-efficiency dicing for wafer packaging applications.
Automatic Silicone Dispensing Equipment: Precision fluid control for protective coating and encapsulation.
Customized Industrial Solutions
Beyond standard machinery, Jiangsu Himalaya Semiconductor provides specialized engineering solutions tailored to unique factory requirements:
TGV (Through Glass Via) Technology: Offering manual, semi-automatic, and fully automatic equipment for next-generation 3D packaging.
Coating & Plating: Customized machines designed for specific surface treatment and metal deposition needs.
Environmental & Resource Management: Efficient solutions for handling exhausted metal sorter equipment, promoting sustainable manufacturing practices.
Why Partner with Jiangsu Himalaya Semiconductor?
In a market defined by volatility, we offer stability and strategic advantage. We understand that for our customers, the "final stage" of procurement is the most critical. We utilize our deep industry expertise to filter through global options, delivering products that balance cost with cutting-edge performance.
For our suppliers, we are a partner of trust. We strive for one-time payment collection and comprehensive risk avoidance, allowing manufacturers to focus on innovation while we handle the complexities of global distribution.
Contact Us Today
Whether you are scaling your production line or seeking a reliable global export partner, Jiangsu Himalaya Semiconductor Co., Ltd. is ready to elevate your operations.
Explore the peak of semiconductor technology with Himalaya.
About Our Factory & Business Background
- Address
- Room 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
-
Registered Capital
- 100,000,000 RMB
-
Terms of Payment
- LC, T/T, PayPal, Western Union
-
International Commercial Terms(Incoterms)
- FOB, CIF, CFR, EXW
-
Average Lead Time
-
Peak Season Lead Time: 3-6 months
Off Season Lead Time: 1-3 months -
Nearest Port
- Shenzhen Port
-
Minimum Order Quantity
- 1 Set
-
Supply Chain Partners
- 30
Our Production Capability & Technical Expertise
-
Main Products
- Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
-
Inspection Type for Finished Products
- 100% inspection(Visual inspection & Function inspection)
-
Inspection Method for Finished Products
- Finished product checked by packing staff
-
Customization Options
- Flexible customization
-
ODM Service Available
- Yes
-
OEM Service Available
- Yes
-
Traceability of Raw Materials
- No
Our Industry Experience & Global Business Record
-
Year of Establishment
- 2019-09-12
-
Export Year
- 5 Years
-
Main Markets
- Europe
-
Repeat Buyers Choice
- 80%~100%
FAQ
- What are the main applications of this wafer bonding equipment?
- It is used for SiC seed crystal preparation, hot pressing bonding of dissimilar materials, wafer level packaging for MEMS, and bonding of aluminum alloys, stainless steel, and ceramics.
- What is the warranty period for the equipment?
- We provide a one-year warranty along with 24-hour online professional technical support.
- How can I choose the most suitable machine model?
- Please provide the working piece material, size, and specific functional requirements. Our team will recommend the best model based on our experience.
- Does the equipment support customization or OEM/ODM services?
- Yes, we offer flexible customization options, including OEM and ODM services, to meet specific customer needs.
- What are the payment terms and minimum order quantity?
- The minimum order quantity is 1 set. Payment terms include LC, T/T, PayPal, and Western Union.
- What is the average lead time for production and shipping?
- Lead times vary by season: 3-6 months during peak season and 1-3 months during off-season.
- What quality inspection processes are performed before shipping?
- Every finished product undergoes 100% inspection, including both visual and functional checks, before packing.
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US$100,000.00-1,000,000.00 / Piece
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