High Precision Automatic Die Bonding Machine for Semiconductors

• Customization: Available
• After-sales Service: Yes
• Condition: New
• Model NO.: DB001
• Speed: High Speed
• Precision: High Precision
• Certification: RoHS, ISO, CE
• Warranty: 12 Months
• Automatic Grade: Automatic
• Type: High-speed Chip Mounter
• Product Name: COB Smart Die Bonding Machine
• High Placement Accuracy: +/- 50um @3σ
• Theta Placement Accuracy: +/- 3° @3σ
• High Throughput: up to 20 Clips / Cycle
• Automation Level: Fully Automatic Loading & Unloading
• Target Products: SMD, 1W & High-Power COB Surface Light Sources
• Pin Processing Capability: Ultra-Long Pin (65ms)
• Minimum Chip Size: 5 Mil (127 Micrometers)
• Transport Package: Air Freight
• Specification: 1500kg
• Trademark: Himalaya
• Origin: China
• Production Capacity: 200

Product Description

High Precision Semiconductor manual COB Smart Die Bonding Machine Automatic Dispensing industrial equipment manufacturer
 

Product Description

 

High-Speed Clip Bonder & Die Attach System: A Unified Precision Bonding Solution

This integrated solution combines a state-of-the-art Clip Bonder with a high-precision Die Attach system, designed for advanced semiconductor packaging. It enables a complete, automated process for attaching dies and clips with exceptional speed and accuracy, ideal for power discrete, MOSFET, and other demanding devices.

 

Precision	High Precision	Condition	New
Certification	ISO	Warranty	12 Months
Automatic Grade	Automatic	Installation	Vertical
Driven Type	Electric	Transport Package	Customized or Wooden Box Packaging
Trademark	Himalaya	Production Capacity	1

Automatic loading and unloading crystal fixing machine
Fully automatic loading and unloading, suitable for SMD, 1W and integrated high-power COB surface light source, triode and other flat support products

Modular design, new optimized layout, focus on quality, with the best stable performance
You can flexibly choose different configurations such as four crystal rings, double dispensing heads, double glue plates, 25cm long brackets, etc., to create the most suitable products for customers
Brand-new tying head design, fast die bond cycle up to 180ms

Patented head binding, accurate positioning and more stable operation;
5mil small chip processing capacity
Design a variety of chip search methods, suitable for the search of various shapes of wafers
Ultra-long PIN (65ms) processing capability to meet different customer needs
 

Clip Bonder: High-Speed Clip Bonding System

This system is engineered for the high-precision, high-throughput placement and bonding of conductive clips, a critical step in creating robust electrical and mechanical interconnections.

Core Features & Specifications:

• High Placement Accuracy: ±50µm @3σ

• Theta Placement Accuracy: ±3° @3σ

• High Throughput: Up to 20 Clips / Cycle

• Integrated Bonding Process: Pre-bond and Post-bond functions for a secure attachment.

• Solder Inspection: Integrated solder patch & solder paste inspection to ensure joint quality and prevent defects.

• Precision Mechanics:

  • High-precision linear drive die bond head.

  • High-precision clip punching system for consistent clip formation.

• Advanced Dispensing & Control:

  • Multi-dispensing independent control system for precise adhesive/epoxy application.

  • Equipped with glue detection and automatic glue filling function.

• Flexibility & Integration:

  • Freely matches various types of reflow equipment.

  • Multiple configurations and customizations available to meet specific process demands.

 

Detailed Photos

Clip Bonder High-speed Clip Bonding System

placement accuracy: ±50µm @3σ, theta placement accuracy: ±3°@3σ;

Up to 20Clips / Cycle;

Prebond & Posbond function;

Solder patch & solder paste inspection function;

High precision linear drive die bond head;

High precision clip punching system;

The multi dispensing independent control system provides more accurate glue control, equipped with glue detection, with automatic glue filling function;

Multiple configurations meet various market demands, as well as customization according to special demands;

Freely match various types of reflow equipment.

Advantages of Die Attach
DA801/DA1201 can be configured;
Placement accuracy: ±10-25μm@3σ;
Theta placement accuracy: ±1°@3σ;
Stable force control system;
Dual dispensing system, support dipping / jetting / writing epoxy process.
 

Exhibition & Customers

Field Application

 

FAQ

Q1: How to choose a suitable machine?
A1: You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2: What is the warranty period for the equipment?
A2: One year warranty and 24 hours online professional technical support.

Q3: Why choose us ?
A3: OEM/ODM/Designing.