| Customization: | Available |
|---|---|
| After-sales Service: | 7*24 Hours |
| Warranty: | 12 Month |
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The DSI-G-WMN6021-A is a state-of-the-art, fully automatic system designed for high-precision and high-throughput permanent marking on a wide range of wafer materials. It integrates advanced motion control, vision alignment, and laser marking technologies to deliver reliable traceability for semiconductor and compound semiconductor manufacturing processes.
This system is engineered with several key features for superior performance and reliability:
High-Precision Motion Platform: Utilizes a high-precision 2-axis linear motor stage and a dual-arm wafer handling robot with DD (Direct Drive) motors for exceptional speed and accuracy.
Fully Automatic Visual Alignment: Incorporates a fully automatic vision system for precise wafer positioning and alignment, ensuring every mark is correctly placed.
Integrated Marking Verification: Equipped with a built-in marking content verification function to prevent errors and guarantee data integrity, ensuring a 99.9% yield rate.
Core Technology & Advantages:
Unmatched Precision & Speed: The system is built around a high-precision 2-axis linear motor stage and a high-speed DD Motor dual-arm wafer handling robot. This core architecture enables rapid movement with a marking accuracy of ±10μm and a throughput of over 60 wafers per hour, with a tact time of less than 60 seconds.
Superior Motion Control: The platform guarantees exceptional stability and repeatability, with stage positioning repeatability of ±0.002mm and DD motor repeatability of ±2 arcsec, ensuring every mark is perfectly placed.
Reliable Marking Quality: Equipped with a robust 3W UV nanosecond laser source, the system produces clean, high-contrast, and permanent marks on sensitive materials without causing micro-cracks or thermal damage.
Full Automation & Zero Error: From automated wafer handling and vision-based positioning to post-marking content verification, the entire process is automated. This "closed-loop" verification ensures a remarkable yield rate of 99.9% by preventing mis-marked wafers.
High-Precision Motion Platform: Utilizes a high-precision 2-axis linear motor stage and a dual-arm wafer handling robot with DD (Direct Drive) motors.
Fully Automatic Visual Alignment: Equipped with a fully automatic vision system for precise positioning and alignment.
Marking Verification: Integrated with a marking content verification function to ensure accuracy and prevent errors.
| Category | Specification |
| Compatible Wafer Sizes | 2-6 inch, 4-8 inch, 8-12 inch |
| Throughput (UPH) | ≥ 60 pcs/hour |
| Marking Accuracy | ±10 μm |
| Stage Parameters | Travel Range: 400 mm x 250 mm |
| Positioning Repeatability: ±0.002 mm | |
| DD Motor Repeatability: ±2 arcsec | |
| Laser Specifications | Type: UV Nanosecond Laser |
| Average Power: 3 W | |
| Tact Time | < 60 seconds |
| Yield Rate | 99.90% |
Applications & Compatibility:
This versatile system is engineered to handle standard and advanced materials, including:
Semiconductors: Si (Silicon)
Compound Semiconductors: SiC (Silicon Carbide), GaN (Gallium Nitride), InP (Indium Phosphide), GaSb (Gallium Antimonide)
Specialty Substrates: Sapphire, Glass, LT (Lithium Tantalate)
It is compatible with a full range of wafer sizes from 2-inch up to 12-inch (2-6", 4-8", 8-12"), making it an ideal solution for both R&D pilot lines and high-volume production fabs.
Ideal For:
The DSI-G-WMN6021-A is the optimal solution for manufacturers requiring dependable wafer-level traceability through 1D barcodes, 2D QR codes, or alphanumeric characters, ensuring data integrity throughout the device lifecycle.
Jiangsu Himalaya Semiconductor Co., Ltd. is a leading high-tech enterprise dedicated to the research, development, and manufacturing of advanced laser processing and automation equipment for the global semiconductor industry. Named after the majestic mountain range, we aspire to reach the pinnacle of technological innovation, providing our clients with robust, precise, and intelligent solutions that empower the next generation of microelectronic device manufacturing.
Our mission is to bridge the critical gap between design and mass production by delivering equipment that guarantees exceptional precision, superior yield, and unmatched reliability for the most demanding semiconductor fabrication processes.
1. Question: Given the variety of sensitive materials, how does the laser ensure high-quality marks without causing micro-cracks or thermal damage to our wafers?
Answer: This is a critical concern, and it's addressed by our choice of laser technology. The system is equipped with a 3W UV nanosecond laser. The short wavelength of UV light is naturally absorbed well by most materials, allowing for clean marking with minimal heat input. The nanosecond pulse duration is fast enough to ablate the surface without transferring significant thermal energy into the bulk material. This "cold processing" mechanism is precisely what prevents micro-cracks, sub-surface damage, and thermal alteration, making it safe for even the most challenging materials like SiC, GaN, and sapphire.
2. Question: The spec mentions a 99.9% yield rate. How is this achieved, and what happens if a mis-mark is detected?
Answer: The 99.9% yield is guaranteed by our integrated "closed-loop" marking content verification system. After the laser marks the wafer, the vision system immediately captures an image of the code or character. It then performs a real-time decode and comparison against the intended data from the recipe. If a discrepancy or an unreadable code is detected, the system automatically flags the wafer and can route it to a separate output cassette. This prevents mis-marked wafers from proceeding to the next costly fabrication step, safeguarding your process flow and ensuring data integrity. The error is also logged for operator review.
3. Question: Our production line handles a mix of 6-inch and 8-inch wafers. How quickly can the system switch between these different sizes?
Answer: The DSI-G-WMN6021-A is designed for rapid changeover. The recipe for each wafer size (including 6-inch, 8-inch, and others) is stored in the software. Switching typically involves just selecting the new recipe, which automatically configures the handling parameters. Our dual-arm DD motor robot is highly adaptable and can accommodate the size range without requiring mechanical adjustments. The robust FOUP/LPU load ports and pre-alignment station are designed to handle the entire 2-inch to 12-inch range seamlessly. This allows for a size changeover to be completed in a matter of minutes, maximizing your equipment utilization and production flexibility.
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