Advanced Die Bonding Machine for Diodes and Transistors

Product Details
Customization: Available
After-sales Service: Free Training
Condition: New
Gold Member Since 2023

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  • Advanced Die Bonding Machine for Diodes and Transistors
  • Advanced Die Bonding Machine for Diodes and Transistors
  • Advanced Die Bonding Machine for Diodes and Transistors
  • Advanced Die Bonding Machine for Diodes and Transistors
  • Advanced Die Bonding Machine for Diodes and Transistors
  • Advanced Die Bonding Machine for Diodes and Transistors
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  • Overview
  • Product Description
  • Parameter
  • Company Profile
  • Exhibition & Customers
  • Packaging & Shipping
Overview

Basic Info.

Model NO.
WBM-0131-1
Speed
Super High Speed
Precision
High Precision
Certification
RoHS, CE
Warranty
24 Months
Automatic Grade
Automatic
Type
Ultra High-speed Chip Mounter
Product Name
Die Bonding Machine
Feature
Mtba, Enhanced Track Design, Easy to Operate
Item Number
Xk-8inch
Motion (X, Y Axis)
Linear Motor, 0.5 μm Resolution
Z Axis
Linear Motor, 0.5 μm Resolution; 40 mm Travel
Die Bonding Size
0.2 mm X 0.2 mm ~ 1 mm X 1 mm
Case Size (L x W x H)
115 to 305 mm X 20 To115 mm X 50 to 200 mm
Track Temperature Zone
8 Temperature Zones
Protective Air
0.1 MPa
Transport Package
Wooden Box by Sea Shipping
Specification
standard package
Trademark
Himalaya
Origin
China
Production Capacity
5000

Product Description

Diodes and transistors die bonding machine eutectic straight arm welding head die bonding machine sot sod patch equipment
Product Description

Product advantages
This is a high-speed thermal bonder designed for thermal bond encapsulation of low-power devices. The welding head, wafer platform, and positioning camera all use a linear drive system. The core components such as the extended pattern recognition function have been verified by a large amount of reliability data, which can bring industry-leading productivity and reliability to customers.
 

Advanced Die Bonding Machine for Diodes and TransistorsAdvanced Die Bonding Machine for Diodes and Transistors
Parameter

Product performance
MTBA improves - optimized image recognition capabilities
·Optimized and improved hardware equipment
·High-resolution digital camera
·Optimized optical system design, clearer images
Enhanced track design
·Supports lead frame 100mm
·Advanced constant temperature control system
Easy to operate
·No need to use Gauge to replace nozzles
Improve the speed of nozzle replacement
·Simple three-point alignment
·Even on-site operators can easily use this function with simple training

Control and monitoring of welding quality
·Pick tool wear monitoring function helps to monitor the process of the nozzle
·Post Bond function can intuitively evaluate the welding quality
·Can be turned on or off as needed
·Post-weld data collection and analysis helps quality control
·Welding pressure continuous switching Coring and fixing can use different pressures
·Welding process monitoring function (BPM) can effectively set the monitoring range
Equipment maintenance and reliability
·Reduce maintenance
·Use fewer moving parts Platform X, Y, rear camera Y motor direct drive
·Modular design makes equipment maintenance and maintenance more convenient
·Proven performance

 
XK-Marlin Die Bonder - Specifications
Category Specification Details
General Information Item Number XK-Marlin
Power Supply 180-240 VAC, Single-phase, 50/60 Hz, 3.0 kVA
Compressed Air 85 liter/min @ 5.5 bar
Floor Space (W x D x H) 1,828 mm x 1,219 mm x 1,676 mm
Weight 800 kg
Motion & Accuracy X, Y Axis Linear Motor, 0.5 μm Resolution
Z Axis Linear Motor, 0.5 μm Resolution; 40 mm Travel
Welding (Bonding) Area 10 mm (X) x 100 mm (Y)
Die Bonding Accuracy XY ±38 μm @ 3 sigma
Welding (Bonding) Pressure 30 g ~ 300 g
Vision & Handling Vision System XK
Image Recognition Mode Feature Find, Single Point PR with Angle
Die Bonding Size 0.2 mm x 0.2 mm ~ 1 mm x 1 mm
Case Size (L x W x H) 115-305 mm x 20-115 mm x 50-200 mm
Lead Frame Size (Coil) (L) x 20-100 mm (W) x 0.1 mm-0.2 mm max. (H)
Process Track Temperature Zone 8 temperature zones
Protective Air 0.1 MPa
Optional Features MAP Function The workstation corresponding to each welding head
8-inch compatible with 6-inch Requires corresponding hardware
Ion Blower Kit Requires corresponding hardware
Welding Process Monitoring (BPM) Requires corresponding dongle
Pick Tool Wear Monitoring Requires support data mode version
Visual Dispensing Function Requires corresponding hardware and software

Advanced Die Bonding Machine for Diodes and Transistors

 

Company Profile

 

Advanced Die Bonding Machine for Diodes and Transistors

 
Exhibition & Customers

Advanced Die Bonding Machine for Diodes and TransistorsAdvanced Die Bonding Machine for Diodes and Transistors
Packaging & Shipping
Advanced Die Bonding Machine for Diodes and Transistors
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.


Q3:Why choose us ?
A3:OEM/ODM/Designing.
 

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