| Customization: | Available |
|---|---|
| Certification: | ISO9001 |
| Protection: | Corrosion Resistance |
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After the silicon wafer is produced, it needs to be tested by a sorting machine for multiple indicators such as thickness, linear marks, TTV, warpage, etc. to determine whether the silicon wafer meets the set requirements, and then sorted into the corresponding bin box according to the test data, and finally the silicon wafer is sorted into different grades.
Key challenges include:
· Thickness Variation: Even slight deviations in wafer thickness can affect performance and production efficiency.
· Line Mark and TTV Defects: Linear marks and high total thickness variation (TTV) reduce wafer quality and usability.
· High-Speed, High-Accuracy Testing: Traditional methods often fail to meet the speed and precision required for sorting wafers into grades.
(1) Precise Thickness Measurement: Achieves repeatability within 0.5µm, ensuring accurate wafer thickness evaluation.
(2) TTV and Line Mark Inspection: Detects TTV and line marks with repeatability within 1.5µm, ensuring comprehensive quality assessment.
(3) High-Speed Detection: Combines ultra-high-profile point density and rapid scanning for efficient and accurate wafer sorting.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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