| Customization: | Available |
|---|---|
| After-sales Service: | Provided |
| Function: | High Temperature Resistance |
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This advanced laser processing system is engineered for the precision cutting and slotting of delicate materials used in flexible electronics. Combining a high-performance A-Series laser source with a robust marble-structure platform and intelligent software, it delivers unmatched accuracy, consistency, and efficiency for demanding production environments.
Core Applications:
Ideal for processing a wide range of sensitive and thin materials, including:
Flexible Printed Circuit Assemblies (FPCAs)
Printed Circuit Board Assemblies (PCBAs)
PI (Polyimide) and PET Films
Coverlay and Thin Films
Advanced Control Software:
Independently developed software capable of multi-panel cutting and self-assembly.
Incorporates functions like dynamic zoom and expansion compensation for high-precision machining.
High-Precision Motion & Positioning:
Utilizes a high-precision motion system, scanning galvanometer, and visual positioning system.
Features an all-marble base structure for exceptional thermal and mechanical stability.
Efficient Workflow:
Operates on an offline, single-workstation mode for streamlined operation.
Excellent Beam Quality:
High-quality beam with M² < 1.3 enables finer processing quality, faster speeds, and a wider range of applications.
Exceptional Laser Stability:
Features an optimized laser resonator design for extremely high power stability.
Power instability is less than ±2%, ensuring consistent processing results even on laser-sensitive materials.
Multi-Parameter Output Flexibility:
Acts as a versatile laser platform capable of combined output of different wavelengths, powers, and pulse widths.
This redundant design allows it to meet the complex and demanding requirements of various industrial applications, maximizing performance across different use cases.
| Category | Specification / Description |
| Product Name | High-Precision Laser Processing System for Flexible Electronics |
| Core Function | Precision cutting and slotting of delicate, thin materials. |
| Key Applications | • Flexible Printed Circuit Assemblies (FPCAs) |
| • Printed Circuit Board Assemblies (PCBAs) | |
| • PI (Polyimide) and PET Films | |
| • Coverlay and Thin Films |
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:Why choose us?
A3:OEM/ODM/Designing service.
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