Advanced Picosecond Laser Glass Cutter for Precision Efficiency

Product Details
Customization: Available
After-sales Service: Online Service
Function: Abrasion Resistance, High Temperature Resistance, Anti-Corrosion
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  • Advanced Picosecond Laser Glass Cutter for Precision Efficiency
  • Advanced Picosecond Laser Glass Cutter for Precision Efficiency
  • Advanced Picosecond Laser Glass Cutter for Precision Efficiency
  • Advanced Picosecond Laser Glass Cutter for Precision Efficiency
  • Advanced Picosecond Laser Glass Cutter for Precision Efficiency
  • Advanced Picosecond Laser Glass Cutter for Precision Efficiency
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  • Overview
  • Product Description
  • Exhibition & Customers
  • Packaging & Shipping
  • FAQ
Overview

Basic Info.

Model NO.
PICOS-01
Demoulding
Pull Core
Condition
New
Certification
ISO, CE
Warranty
Provided
Automatic Grade
Manual
Installation
Vertical
Driven Type
Pneumatic
Mould Life
<300,000 Shots
Product Name
Glass Cutting & Lobing
Feature 1
Guaranteed Quality
Feature 2
Customized According to Needs
After-Sale Service
Provided
Transport Package
Customized or Wooden Box Packaging
Specification
Standard Specifications
Trademark
Himalaya
Origin
China
Production Capacity
50000

Product Description

High quality Ultra-Fast Pulsed Picosecond Laser Glass Cutting & Lobing Machine with High Peak Power
 
Product Description
 
Advanced Picosecond Laser Glass Cutter for Precision Efficiency
Product Features
  • Ultra-fast pulsed picosecond laser with high peak power, stable and reliable

  • Self-developed cutting process technology patent, excellent kerf quality, no surface damage

  • High dimensional accuracy, small chipping, low thermal impact, excellent processing quality

  • Automatic loading and unloading, inspection, sorting and lobe functions

Application
Cutting of full-screen glass,
sapphire, digital 3D front and
back cover glass, various
optical glass, and filter glass
echnical specification  
Cutting Laser Picosecond 1064nm Laser
Lobe Laser CO2
Cutting Laser Power 70W
Lobe Laser Power 55W
Laser Life >20000h
Platform Speed 1000mm/s
Control System Software Integrated vision, laser and motion
 
 
Exhibition & Customers

Advanced Picosecond Laser Glass Cutter for Precision EfficiencyAdvanced Picosecond Laser Glass Cutter for Precision EfficiencyJiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping
Advanced Picosecond Laser Glass Cutter for Precision Efficiency
Advanced Picosecond Laser Glass Cutter for Precision Efficiency

Our semiconductor equipment is packed with bubbled foam inside and crate outside to prevent any possible damage.

We provide multiple transportation service such as sea-freight, air-freight or road transportation.

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.


Q3:Why choose us?
A3:OEM/ODM Designing.

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