| Customization: | Available |
|---|---|
| After-sales Service: | Provided |
| Warranty: | Provided |
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Our fiber optic laser marking machine is an advanced industrial solution designed for high-speed, ultra-precise, and durable marking on a wide range of materials. Utilizing a high-quality fiber laser oscillator, this system delivers exceptional beam quality, reliability, and efficiency, making it ideal for industries requiring deep, smooth, and highly accurate engravings.
High Precision & Fine Detail: Achieves incredibly fine details with a minimum character size of 0.15mm and a line width as small as 0.012mm, perfect for serial numbers, QR codes, and complex logos.
Blazing Fast Speed: With a maximum marking speed of up to 7000 mm/s, it significantly boosts production throughput and efficiency.
Exceptional Reliability: Featuring a maintenance-free, air-cooled fiber laser system with a long operational lifespan (typically 100,000 hours).
Superior Beam Quality (M²<2): Ensures a focused, high-quality beam that results in clean, sharp, and consistent marks every time.
User-Friendly Software: Intuitive Windows-based software includes a powerful graphic editor and supports direct file conversion from popular design programs like AutoCAD and CorelDraw.
Compact & Robust Design: Its static desktop design saves space while providing a stable platform for precise engraving.
The included dedicated marking software provides a comprehensive suite of tools:
Self-Editor: Create and edit designs directly within the software.
Text & Font Tools: Input and manipulate text with various fonts and styles.
Advanced Layout: Functions for plane circumference, fan-shape distribution, and array patterns.
File Import & Conversion: Seamlessly import and convert vector files from industry-standard programs like AutoCAD, CorelDRAW, and CAXA.
Parameter Control: Precisely adjust power, speed, frequency, and pulse width for optimal results on any material.
Specification:
| Technical Specifications | |
| Category | Specification Details |
| Product Name | Static Fiber Desktop Laser Engraving & Marking Machine |
| Laser Power | 20W, 30W, or 50W (Select based on material and depth requirements) |
| Laser Wavelength | 1060 nm (Fiber Laser) |
| Beam Quality (M²) | < 2 (Excellent focusability) |
| Laser Type | Pulse or Continuous Wave |
| Cooling System | Air Cooling (No external water chiller required) |
| Power Supply | 200V, 50Hz |
| Operating Environment | Temperature: -20ºC to 45ºC / Relative Humidity: ≤ 80% |
| Marking Depth | 10W: ≤ 0.3mm / 20W: ≤ 0.5mm / 30W: ≤ 0.7mm (Depth varies by material and settings) |
| Marking Speed | ≤ 7000 mm/s |
| Marking Area (Standard) | 110mm x 110mm (Larger areas available by customization) |
| Minimum Character Size | 0.15 mm |
| Minimum Line Width | 0.012 mm |
| Repeat Precision | ± 0.002 mm |
| Supported OS | Windows 98 / 2000 / XP / 7 (Likely compatible with Windows 10/11) |
| Software Features | Built-in graphic editor, computer input, plane circumference, fan-shape distribution, and more. |
| File Format Support | Auto CAD (DWG, DXF), Corel Draw (CDR), CAXA, and other standard graphic files. |
Industrial Part Marking (Serial numbers, logos, QR codes)
Electronics & Semiconductor (PCB, IC chips)
Medical & Dental Devices (Surgical tools, implants)
Automotive & Aerospace (Engine components, VIN marking)
Jewelry & Luxury Goods (Custom engravings, branding)
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Customer Commitment & After-Sales Support:
1-Year Comprehensive Warranty
Coverage: Full protection against manufacturing defects (parts/labor included).
Extensions: Optional extended warranty plans available for critical applications.
24/7 Global Technical Support
Response: ≤1-hour emergency response via dedicated hotline/TeamViewer.
Languages: Multilingual engineers (English/Chinese/German/Japanese).
On-Site: Rapid dispatch for unresolved issues (72hrs max for Tier-1 regions).
Value-Added Services
We are an ISO 9001-certified manufacturer and innovator specializing in semiconductor equipment, with 6 registered utility model patents (UM Patents) in China. Our patented technologies cover:
Semiconductor annealing systems
Cleaning equipment for semiconductor etching
UV debonding machines
And more .
Backed by ISO 9001 quality management, we ensure high precision, reliability, and efficiency in semiconductor manufacturing processes. Our R&D-driven solutions enhance production yield and cost-effectiveness for global clients in IC packaging, MEMS, and advanced wafer processing.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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