Product Description
Discover the H580PLUS High-Speed Fully Automatic Wire Bonder, designed for semiconductor packaging professionals who need speed, accuracy, and flexibility. With advanced vision technology and the ability to handle multiple materials, this wire bonder delivers precise, fast bonding for ICs like BGA, QFP, and COB. Certified to CE, ISO, RoHS, and FDA standards, it comes with a 12-month warranty and yearly technology updates, making the H580PLUS a new standard for performance and reliability.
High Speed Fully Automatic Gold/Copper Wire Bonder
1,New servo system, faster response, higher accuracy, and higher UPH;
2,New zoom lens, wider range, clearer images, and higher structural stiffness;
3,New defense line module to improve consistency in wiring;
4,More stable binding force control, more precise force response;
5,Advanced bonding force calibration capability, fast and accurate, and easy to operate;
6,Intelligent detection function, prompting users to perform timely calibration of bonding force;
7,High precision post weld inspection function (PBI);
8,New line arc algorithm, suitable for more materials and meeting the needs of complex products;
9,The operation control drive system, optical system, and core components with independent intellectual property represent the leading level of the industry;
10,Applicable to IC products:TO, SOT, SOP, SSOP, TSSOP, SOLC, QFP, DIP, BGA, COB, optocoupler, etc
11,Soldering cycle: 45ms/line;
12,XY table:
Driving method:Linear motor drive;
Drive:Linear motor drive;
Maximum welding line area:X:56mm,Y:80mm;
Max bonding area:X:56mm,Y:80mm;
repeatability:±3μm@3sigma;
Position accuracy:±3μm@3sigma;
13,Bonding parameters:
Applicable wire diameter:Φ15~ Φ50μm;
Wire diameter:Φ15~ Φ50μm;
Soldering cycle:45ms/line;
Bonding cycle:45ms/wire;
14,Material handling system:
Material inlet and outlet structure:Vertical Stacked;
Material handling:mechanism;
Equipment material box:2-3;
No of buffered magazine:2-3;
15,Applicable magazine:
Length:100~275mm;
Width:30~90mm;
Height:65~180mm;
Magazine Pitch:1.5~10mm;
16,Size(Width*Depth*Height):
Weight:≈660Kg;
Size(Width*Depth*Height):985mm*960mm*1770mm;
Product Parameters
| Feature/Specification |
Detail |
| Model Number |
H580PLUS |
| Condition |
New |
| Certifications |
CCC, PSE, FDA, RoHS, ISO, CE |
| Warranty |
12 Months |
| Automatic Grade |
Automatic |
| Installation |
Vertical |
| Driven Type |
Pneumatic |
| Mould Life |
>1,000,000 Shots |
| Online Technical Guidance |
Once Every Month |
| Customer Production/Use Visits |
2-4 Times/Year |
| Customer Technical Personnel Invitations |
2 Per Year (S2 Opportunities) |
| Introduction of Domestic Advanced Technology/Updates |
Every Year |
| Transport Package |
International Trade Standard |
| Specification (Dimensions) |
985mm * 960mm * 1770mm |
| Trademark |
Himalaya |
| Origin |
China |
| HS Code |
8486402200 |
Exhibition & Customers
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Applications
Applications of Wire Bonding
-
Semiconductor Packaging
- Connects IC chips to lead frames (e.g., QFP, SOP, DIP packages).
- Used in memory devices (DRAM, NAND Flash), microcontrollers, and sensors.
-
Power Electronics
- High-current applications (e.g., IGBTs, MOSFETs) often use thick aluminum or copper wires.
- Automotive and industrial power modules rely on heavy wire bonding (>500μm diameter).
-
RF & Microwave Devices
- Low-inductance gold wire bonding in 5G modules, RF amplifiers, and microwave ICs.
-
LED Packaging
- Gold or aluminum wires connect LED dies to substrates (e.g., in COB-Chip-on-Board LEDs).
-
Medical & Aerospace Electronics
- High-reliability bonding for implantable devices (pacemakers) and avionics.
Packaging & Shipping
Wire Bonding Machine Packaging & Freight Options
Packaging
- Wooden Crate (IPPC Certified)
- Heavy-duty plywood/wooden case with fumigation compliance (ISPM-15 standard).
- Shock-absorbent cushioning (foam, airbags) to protect sensitive components.
- Weatherproof & tamper-proof sealing for international shipping.
Freight Options
-
Air Freight (Recommended for Urgent Shipments)
Best For: High-value, low-volume shipments (e.g., single machines).
-
Sea Freight (Cost-Effective for Bulk Shipments)
Best For: Full-container-load (FCL) or less-than-container-load (LCL) shipments.
Considerations: Requires customs clearance & inland logistics coordination.
-
Railway Freight (Land-Based Alternative)
- Delivery for cross-continent shipments, e.g., China-Europe rail.
- Best For: Heavy equipment moving between inland industrial hubs.
- Considerations: More eco-friendly than air but slower than express shipping.
FAQ
Q1: How to choose a suitable machine?
A1: You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2: What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3: How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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