Advanced Fully Automatic Wafer Marking Machine for 2D and 1d Codes

• Customization: Available
• After-sales Service: Provided
• Warranty: 12 Months
• Model NO.: ME-01
• Laser Visibility: Visible
• Applicable Material: Nonmetal
• Cooling System: Air Cooling
• Technical Class: Continuous Wave Laser
• Laser Wavelength: CO2 Laser
• Laser Classification: Semiconductor Laser
• Type: YAG Laser Marking Machine
• Marking Method: Scanning Marking
• Product Name: Fully Automatic Wafer ID Marking Equipment
• Feature 1: High Precision
• Feature 2: High Efficiency
• After-Sale Service: Provided
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China
• Production Capacity: 100

Product Description

Fully Automatic Wafer ID Marking Equipment Suitable for Marking 2D Codes/One-Dimensional Codes

Product Description

Fully automatic wafer ID marking equipment

Equipment features:
Adopting high-precision two-dimensional linear motor platform, DD motor wafer dual arm handling robot, fully automatic visual positioning, and equipment configuration with marking content verification function.

Application scope:
Suitable for marking 2D codes, one-dimensional codes or characters on wafer substrates of 2-6 inch, 4-8 inch, 8-12 inch Si, SiC, InP, GaSb, GaN, Sapphire, Glass, LT and other materials.

 

Fully Automatic Wafer ID Marking Equipment Summary Table

Category	Specifications
Equipment Name	Fully Automatic Wafer ID Marking System
Core Technology	- High-precision 2D linear motor stage

• Direct Drive (DD) motor dual-arm wafer handling robot
• Fully automated vision alignment system
• Marking content verification function | | Marking Capability | - 2D Codes (QR, Data Matrix)
• 1D Barcodes
• Alphanumeric Characters | | Compatible Wafer Sizes | - 2-6 inch
• 4-8 inch
• 8-12 inch | | Supported Materials | - Semiconductor Wafers: Si (Silicon), SiC (Silicon Carbide), GaN (Gallium Nitride)
• Compound Semiconductors: InP (Indium Phosphide), GaSb (Gallium Antimonide)
• Optical Substrates: Sapphire, Glass
• Specialty Materials: LT (Lithium Tantalate) | | Precision & Repeatability | - Positioning Accuracy: ≤±2 µm
• Marking Repeatability: ≤±1 µm | | Automation Features | - Dual-arm robot for wafer loading/unloading
• Vision-guided alignment
• Automatic verification (OCR/Code readability check) | | Industry Standards | - Compliant with SEMI Standards (e.g., SEMI S2/S8)
• Supports SECS/GEM protocol for fab integration |

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
 

Q3:Why choose us?
A3:OEM/ODM/Designing service.