| Customization: | Available |
|---|---|
| After-sales Service: | 7*24 Hours |
| Function: | Abrasion Resistance, Lubrication, High Temperature Resistance, Anti-Corrosion, Anti-Cold |
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Meet all complex planarization process requirements in IC manufacturing. Suitable for mainstream 14nm/28nm logic processes, covering STI/ILD/IMD, FinFET/Metal gate/W/Cu and other processes.
Product Features
This table details the specifications and features of an advanced CMP system designed for complex IC manufacturing at mainstream 14nm/28nm technology nodes.
| Category | Specification / Feature |
|---|---|
| Process Node & Application | Suitable for mainstream 14nm/28nm logic processes. Covers STI, ILD, IMD, FinFET, Metal Gate, Tungsten (W), and Copper (Cu) processes. |
| Core Product Features | • High-Throughput Design: 2×2 polishing tables with dual cleaning stations. • Independent Processing: Dual, independent process and transmission systems for parallel operation. • Superior Uniformity: Opposing grind head and table configuration ensures excellent within-wafer (WIW) and wafer-to-wafer (WTW) uniformity (<3%). • High Productivity: Output (Wafers Per Hour, WPH >60) is significantly higher than comparable international imported equipment. |
| Physical Dimensions | Layout: 5.70m (Length) × 2.80m (Width) × 2.70m (Height) |
Pressurization Method
Utilizes external airbag pressurizationfor nano-level material removal
Constant Temperature System
Features an infrared temperaturemeasurement system to ensurethe polishing plate maintains aconstant temperature
Cleaning Unit
Equipped with double-sided PVA brushes for automaticdouble-sided scrubbing anddrying
Fully Automatic System
Provides fully automatic loadingand unloading with a dry-in, dry-out" workflow
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:Why choose us?
A3:OEM/ODM/Designing.
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