High-Precision 20W UV Laser Engraver for Metal and Wood

Product Description

 

Product Description

Brief Description

1. Various metal materials, part of non-metal materials.
2. The fiber optic laser oscillator marker has advantage of high beam quality and high reliability. It is suitable for processing fields that need high marking depth, smoothness and accuracy.

Features:

1.Small and compact size, use common air-cooling system.
2.Fiber output, can apply flexibly, and easy to make 3D processing system.
3.Install backward reflecting isolator, which uses the particularity of wavelength and direction of laser, and the special structure inside the backward reflecting isolator, to block the laser reflected by work piece, in order to avoid the laser enter the laser oscillator again to damage the laser oscillator.

Specification:

Specifications

Model	G20
Laser output power	20W
Focus lens	F160 (standard)   F254(optional)
Lens type	F160 (standard)	F254(optional)
Marking area	3.9''×3.9''	6.3''×6.3''
Marking speed	300 characters/sec, height=0.039''	300 characters/sec, height=0.039''
Min. character size	0.01''	0.02''
Min. line width	50μm	90μm
Wave length	1064nm
Beam quality M2	<1.6
Power stability(8h)	<±1% rms
Pulse repetition frequency	1.6kHz-1000kHz
Marking depth	≤0.016''
Marking speed	≤22.97'/s
Repetition accuracy	±0.0001''
Power consumption	500W
Indication light	Red light wavelength=650nm
Cooling mode	Air cooling
Running temperature	15ºC-35ºC
Electrical source requirement	110-220V/ 50Hz (60Hz) / 4A
Dimensions (L*W*H)	1.8'×2.6'×2.5'
Weight	121 KG

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.