High Precision Wafer Die Bonder for Superior Dispensing Accuracy

• Customization: Available
• After-sales Service: Provided
• Condition: New
• Model NO.: SHD8120S
• Speed: High Speed
• Precision: High Precision
• Certification: RoHS, ISO, CE
• Warranty: 12 Months
• Automatic Grade: Automatic
• Type: Ultra High-speed Chip Mounter
• X/Y/θ Accuracy: ±0.035mm, ≤±3°
• Uph (Units/Hour): 4,000–8,000
• Soldering Head Load: 30g–300g
• Loading Method: Wafer Stacking + Tray
• Frame Size Range: L: 110–300mm, W: 12–100mm, H: 0.1
• Chip Size Range: 0.5 × 0.5mm – 14 × 14mm
• Wafer Size: 12 Inch
• Tin Wire Diameter: 0.25–1mm
• Heating Track: 8 Zones; Max 450°C (±3°C)
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China

Product Description

High Precision Wafer Die Bonder Dispensing Equipment 

Product Description

Equipment Specifications
DIE BONDER	SHD8120S
Loading method	Wafer stacking and tray
Frame size	L:110-300mm   W:12-100mm     H:0.1-1mm
Chip size	0.5X0.5-14X14mm
Wafer size	12 inches (8-inch kit optional)
X/Y/θ	±0.035mm,≤±3°
UPH	4-8K
Soldering head load	30g~300g
Soldering head rotation	0~360
Wafer rotation	0~360
Tin wire diameter	0.25~1mm
Tin delivery mode	Dot tin,paint tin
Heating track	8 temperature zones;max 450ºC(±3ºC)
Solder voids	2%(single void)&5%(total chip area)
Mixed gas	15%H2+85%N2
Compressed air	≥0.4Mpa
Power supply	220V/50Hz,Power about 2.2KW
Machine size	2150mm*1520*1550mm(Length*Width*Height)
Equipment weight	About 1700kg
Mapping	Y
Data statistics	Y
Data records	Y

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:Why choose us?
A3:OEM/ODM/Designing service.