Innovative Marking Solutions for Efficient PCBA and IC Production
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Product Highlights
- Multi-Laser Source Options: Supports 20W fiber, green, UV, and CO2 laser sources for diverse marking needs.
- Intelligent Vision Inspection: Features direction inspection and sampling inspection functions for guaranteed quality.
- High-Speed Automation: Fully-automatic loading/unloading with UPH up to 1200 pieces per hour.
- Flexible Customization: Customized according to needs with flexible customization options available.
- Advanced Fume Removal: Special device quickly extracts fume and dust to protect the marking environment.
- Versatile Marking Capabilities: Supports 1D barcodes, 2D Matrix, QR codes, logos, and batch numbers on rigid and flexible PCBAs.
- Comprehensive Warranty: Includes one-year warranty and 24-hour online professional technical support.
Product Attributes
- Customization
- Available
- After-sales Service
- Provided
- Warranty
- Provided
- Model NO.
- PCBA-001A
- Laser Visibility
- Visible
- Applicable Material
- Metal
- Cooling System
- Water Cooling
- Technical Class
- Continuous Wave Laser
- Laser Wavelength
- UV Laser, CO2 Laser
- Laser Classification
- Semiconductor Laser
- Type
- YAG Laser Marking Machine
- Marking Method
- Scanning Marking
- Product Name
- PCBA & IC & Wafer Marking Machine
- Feature 1
- Guaranteed Quality
- Feature 2
- Customized According to Needs
- After-Sale Service
- Provided
- Transport Package
- Customized or Wooden Box Packaging
- Specification
- Standard Specifications
- Trademark
- Himalaya
- Origin
- China
Product Images of Innovative Marking Solutions for Efficient PCBA and IC Production
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Innovative Marking Solutions for Efficient PCBA and IC Production -
Innovative Marking Solutions for Efficient PCBA and IC Production -
Innovative Marking Solutions for Efficient PCBA and IC Production -
Innovative Marking Solutions for Efficient PCBA and IC Production -
Innovative Marking Solutions for Efficient PCBA and IC Production -
Innovative Marking Solutions for Efficient PCBA and IC Production -
Innovative Marking Solutions for Efficient PCBA and IC Production
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Product Description
Marking on the Rigid and flexible printed circuit board (PCBAs).
Support 1D barcodes, 2D Matrix, QR codes, logo, batch number marking.
1. Fully-automatic loading and unloading from hanging basket to hanging basket, stable laser output, direction inspection function of intelligent vision system, sampling inspection function of marking effect
2. Friendly HMI
3. Imported double-head 20W fiber laser marking system; the green laser, UV laser, CO2 laser and other laser sources are optional
4. With special fume removal device, it can quickly extract the fume and dust produced during marking to protect the marking area environment
5. It complies with CE MARK and SEMI standard
| Machine model | HDZ-SIC100 | HDZ-SIC200 |
| Marking scope | 320mm*160mm | 320mm*160mm |
| Product specification | L: 160-320mm; W: 30-80mm | L: 160-320mm; W: 30-80mm |
| Font | TFT and SHX; with font library module modification program | |
| Final processing repeated positioning precision | ±0.1mm | ±0.1mm |
| UPH | 1200 pieces/h (idle) | 1200 pieces/h (idle) |
| Power supply | AC 220V, 50/60Hz | AC 220V, 50/60Hz |
| Air source | 0.6-0.8 MPa | 0.6-0.8 MPa |
| Overall dimension | 2525mm*1665mm*2000mm | 2515mm*1420mm*2000mm |
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:Why choose us ?
A3:OEM/ODM/Designing
About the Supplier
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Company Profile
Empowering Global Semiconductor Excellence: An Introduction to Jiangsu Himalaya Semiconductor Co., Ltd.
In the rapidly evolving landscape of global electronics, precision and reliability are the cornerstones of success. Since its establishment in 2019, Jiangsu Himalaya Semiconductor Co., Ltd. Has emerged as a pivotal force in the semiconductor industry, specializing in the high-level integration and international trade of advanced manufacturing equipment.
With a footprint extending to over 30 countries and a robust network of more than 200 global customers and suppliers, we serve as the critical link in the semiconductor supply chain. Our mission is clear: To secure the most cost-effective, high-performance solutions for our clients while ensuring seamless, risk-free transactions for our partners.
Comprehensive Equipment Solutions for Semiconductor Manufacturing
We take pride in our diverse portfolio of high-precision machinery designed to meet the rigorous demands of modern wafer processing and packaging.
1. Advanced Bonding & Marking
Precision at the microscopic level is essential for chip integrity. Our core lineup includes:
Die Bonders: Ensuring high-speed, accurate placement of chips.
Wire Bonding: Providing reliable electrical interconnections with industry-leading stability.
Laser Marking: Specialized ID marking for IC wafers to ensure full traceability throughout the lifecycle.
2. Cutting-Edge Laser Processing
As wafers become thinner and materials more complex, our laser solutions provide the necessary finesse without compromising structural integrity:
Laser Grooving & Cutting: Expertly designed for glass, ceramics, and wafer packaging.
Internal Modification Machines: Specialized laser technology for Si/SiC (Silicon Carbide) and LT/LN (Lithium Tantalate/Lithium Niobate) wafers.
Laser Annealing: Optimized for Si/SiC substrates to enhance electrical properties and repair lattice damage.
3. Dicing & Dispensing
Automatic Dicing Saw Machines: High-efficiency dicing for wafer packaging applications.
Automatic Silicone Dispensing Equipment: Precision fluid control for protective coating and encapsulation.
Customized Industrial Solutions
Beyond standard machinery, Jiangsu Himalaya Semiconductor provides specialized engineering solutions tailored to unique factory requirements:
TGV (Through Glass Via) Technology: Offering manual, semi-automatic, and fully automatic equipment for next-generation 3D packaging.
Coating & Plating: Customized machines designed for specific surface treatment and metal deposition needs.
Environmental & Resource Management: Efficient solutions for handling exhausted metal sorter equipment, promoting sustainable manufacturing practices.
Why Partner with Jiangsu Himalaya Semiconductor?
In a market defined by volatility, we offer stability and strategic advantage. We understand that for our customers, the "final stage" of procurement is the most critical. We utilize our deep industry expertise to filter through global options, delivering products that balance cost with cutting-edge performance.
For our suppliers, we are a partner of trust. We strive for one-time payment collection and comprehensive risk avoidance, allowing manufacturers to focus on innovation while we handle the complexities of global distribution.
Contact Us Today
Whether you are scaling your production line or seeking a reliable global export partner, Jiangsu Himalaya Semiconductor Co., Ltd. is ready to elevate your operations.
Explore the peak of semiconductor technology with Himalaya.
About Our Factory & Business Background
- Address
- Room 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
-
Registered Capital
- 100,000,000 RMB
-
Terms of Payment
- LC, T/T, PayPal, Western Union
-
International Commercial Terms(Incoterms)
- FOB, CIF, CFR, EXW
-
Average Lead Time
-
Peak Season Lead Time: 3-6 months
Off Season Lead Time: 1-3 months -
Nearest Port
- Shenzhen Port
-
Minimum Order Quantity
- 1 Set
-
Supply Chain Partners
- 30
Our Production Capability & Technical Expertise
-
Main Products
- Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
-
Inspection Type for Finished Products
- 100% inspection(Visual inspection & Function inspection)
-
Inspection Method for Finished Products
- Finished product checked by packing staff
-
Customization Options
- Flexible customization
-
ODM Service Available
- Yes
-
OEM Service Available
- Yes
-
Traceability of Raw Materials
- No
Our Industry Experience & Global Business Record
-
Year of Establishment
- 2019-09-12
-
Export Year
- 5 Years
-
Main Markets
- Europe
-
Repeat Buyers Choice
- 80%~100%
FAQ
- How to choose a suitable machine?
- You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
- What is the warranty period for the equipment?
- One year warranty and 24 hours online professional technical support.
- Why choose us?
- OEM/ODM/Designing
- What materials can be marked?
- The machine is applicable for metal, rigid and flexible printed circuit boards (PCBAs), PCBA, FPC, and wafer marking.
- What are the available laser types?
- The system supports imported double-head 20W fiber laser, green laser, UV laser, and CO2 laser sources.
- What is the minimum order quantity?
- The minimum order quantity is 1 set.
- What are the payment terms?
- We accept LC, T/T, PayPal, and Western Union.
- What is the lead time for production?
- Peak season lead time is 3-6 months, and off-season lead time is 1-3 months.
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