Professional 550°C High-Performance Ceramic Hot Air Drying Oven
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Product Highlights
- Uniform Heating Structure: Hot air circulation design ensures uniform temperature field and adjustable wind speed.
- Advanced Safety Protection: Includes over/under temperature alarms, explosion-proof system, and automatic power-off.
- Durable Construction: Furnace and trays made of alloy heat-resistant plates for high corrosion resistance.
- Multi-Point Monitoring: Equipped with 6 thermocouples, 5 temperature measurements, and online recording.
- Energy Efficient Insulation: Double-layer convex concave sealing structure prevents heat leakage.
- Flexible Customization: OEM and ODM services available with flexible customization options.
Product Attributes
- Customization
- Available
- After-sales Service
- Provide
- Function
- Abrasion Resistance
- Model NO.
- F-01
- Demoulding
- Pull Core
- Condition
- New
- Certification
- ISO
- Warranty
- 12 Months
- Automatic Grade
- Automatic
- Installation
- Vertical
- Driven Type
- Electric
- Mould Life
- 300,000-1,000,000 Shots
- Product Name
- 600 ° C Hot Air Circulation Furnace
- Working Temperature
- Rt-550 ° C
- Advantage
- Factory Price
- After-Sale Service
- Provided
- Transport Package
- Customized or Wooden Box Packaging
- Specification
- Standard Specifications
- Trademark
- Himalaya
- Origin
- China
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Product Description

Hot air circulation rubber discharge furnace (degreasing furnace)
The hot air circulation dispensing furnace is specifically designed for the dispensing process of ceramics using various molding methods, such as ceramic inserts, ceramic phone shells, MLCC, etc. It can achieve the rubber discharge and secondary purification treatment of waste gas in the product, and can realize the rubber discharge process,
characteristic:
1. Working temperature RT-550 ° C
2. The hot air circulation structure has a uniform temperature field and adjustable wind speed,
3.6 thermocouple layout monitoring, 1 temperature control and 5 temperature measurement, temperature recorder online display and recording,
5. 0.1 level precision program temperature controller for temperature control, PID parameter self-tuning, over temperature, under temperature, and broken coupling alarm protection
6. The furnace and material trays are all made of alloy heat-resistant plates, which are resistant to high temperature and corrosion, and have a high level of cleanliness inside the furnace.
7. Complete protection functions, degreasing and explosion-proof system, over temperature protection function, automatic power off when over temperature occurs.
8. The furnace door adopts a double-layer convex concave sealing structure, which prevents heat from leaking out.
9. Additional optional: exhaust gas treatment secondary purification device.
Mesh Belt Type Adhesive Discharge Sintering Furnace - Technical Specifications
| Feature | Application | Key Technical Advantages |
|---|---|---|
| 1. Thick Film Circuits | Adhesive discharge sintering for ceramic substrate printing (e.g., hybrid circuits, sensors). | - Precise temperature control (±1°C) avoids warping |
- Uniform heating for consistent conductivity | | 2. Honeycomb Carriers | Drying/calcination of metal or ceramic honeycombs (e.g., catalytic converters, filters). | - Programmable multi-zone heating (200-1200°C)
- Low thermal shock to prevent cracking | | 3. SiC/Al Composites | Continuous sintering of silicon carbide-aluminum composites (e.g., aerospace/automotive parts). | - Inert atmosphere (N/Ar) prevents oxidation
- High-temp stability up to 1600°C (optional) | | 4. Powder/Ceramic Fiber | Sintering of powder materials (e.g., piezoelectric ceramics) or NFC magnetic thin sheets. | - Adjustable belt speed (0.1-5 m/min) for dwell time control
- Dust-proof mesh belt design | | 5. Advanced Functions | Industrial control system integration (e.g., PLC/HMI). | - Real-time O2/CO2 monitoring
- Automated alarms for deviations in T°C or atmosphere | | Structural Design | Customizable heating zones with MoSi2 heating elements. | - Energy-efficient insulation (ceramic fiber modules)
- Quick cooling modules optiona


Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
About the Supplier
This supplier has been audited by BV. Verify the report on the official BV website with ID "MIC-ASI2342144". Items marked "" are certified.
Company Profile
Empowering Global Semiconductor Excellence: An Introduction to Jiangsu Himalaya Semiconductor Co., Ltd.
In the rapidly evolving landscape of global electronics, precision and reliability are the cornerstones of success. Since its establishment in 2019, Jiangsu Himalaya Semiconductor Co., Ltd. Has emerged as a pivotal force in the semiconductor industry, specializing in the high-level integration and international trade of advanced manufacturing equipment.
With a footprint extending to over 30 countries and a robust network of more than 200 global customers and suppliers, we serve as the critical link in the semiconductor supply chain. Our mission is clear: To secure the most cost-effective, high-performance solutions for our clients while ensuring seamless, risk-free transactions for our partners.
Comprehensive Equipment Solutions for Semiconductor Manufacturing
We take pride in our diverse portfolio of high-precision machinery designed to meet the rigorous demands of modern wafer processing and packaging.
1. Advanced Bonding & Marking
Precision at the microscopic level is essential for chip integrity. Our core lineup includes:
Die Bonders: Ensuring high-speed, accurate placement of chips.
Wire Bonding: Providing reliable electrical interconnections with industry-leading stability.
Laser Marking: Specialized ID marking for IC wafers to ensure full traceability throughout the lifecycle.
2. Cutting-Edge Laser Processing
As wafers become thinner and materials more complex, our laser solutions provide the necessary finesse without compromising structural integrity:
Laser Grooving & Cutting: Expertly designed for glass, ceramics, and wafer packaging.
Internal Modification Machines: Specialized laser technology for Si/SiC (Silicon Carbide) and LT/LN (Lithium Tantalate/Lithium Niobate) wafers.
Laser Annealing: Optimized for Si/SiC substrates to enhance electrical properties and repair lattice damage.
3. Dicing & Dispensing
Automatic Dicing Saw Machines: High-efficiency dicing for wafer packaging applications.
Automatic Silicone Dispensing Equipment: Precision fluid control for protective coating and encapsulation.
Customized Industrial Solutions
Beyond standard machinery, Jiangsu Himalaya Semiconductor provides specialized engineering solutions tailored to unique factory requirements:
TGV (Through Glass Via) Technology: Offering manual, semi-automatic, and fully automatic equipment for next-generation 3D packaging.
Coating & Plating: Customized machines designed for specific surface treatment and metal deposition needs.
Environmental & Resource Management: Efficient solutions for handling exhausted metal sorter equipment, promoting sustainable manufacturing practices.
Why Partner with Jiangsu Himalaya Semiconductor?
In a market defined by volatility, we offer stability and strategic advantage. We understand that for our customers, the "final stage" of procurement is the most critical. We utilize our deep industry expertise to filter through global options, delivering products that balance cost with cutting-edge performance.
For our suppliers, we are a partner of trust. We strive for one-time payment collection and comprehensive risk avoidance, allowing manufacturers to focus on innovation while we handle the complexities of global distribution.
Contact Us Today
Whether you are scaling your production line or seeking a reliable global export partner, Jiangsu Himalaya Semiconductor Co., Ltd. is ready to elevate your operations.
Explore the peak of semiconductor technology with Himalaya.
About Our Factory & Business Background
- Address
- Room 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
-
Registered Capital
- 100,000,000 RMB
-
Terms of Payment
- LC, T/T, PayPal, Western Union
-
International Commercial Terms(Incoterms)
- FOB, CIF, CFR, EXW
-
Average Lead Time
-
Peak Season Lead Time: 3-6 months
Off Season Lead Time: 1-3 months -
Nearest Port
- Shenzhen Port
-
Minimum Order Quantity
- 1 Set
-
Supply Chain Partners
- 30
Our Production Capability & Technical Expertise
-
Main Products
- Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
-
Inspection Type for Finished Products
- 100% inspection(Visual inspection & Function inspection)
-
Inspection Method for Finished Products
- Finished product checked by packing staff
-
Customization Options
- Flexible customization
-
ODM Service Available
- Yes
-
OEM Service Available
- Yes
-
Traceability of Raw Materials
- No
Our Industry Experience & Global Business Record
-
Year of Establishment
- 2019-09-12
-
Export Year
- 5 Years
-
Main Markets
- Europe
-
Repeat Buyers Choice
- 80%~100%
FAQ
- How to choose a suitable machine?
- You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
- What is the warranty period for the equipment?
- One year warranty and 24 hours online professional technical support.
- What is the minimum order quantity?
- The minimum order quantity is 1 set.
- What are the payment terms?
- We accept LC, T/T, PayPal, and Western Union.
- What is the average lead time?
- Peak season lead time is 3-6 months, while off-season lead time is 1-3 months.
- Do you offer OEM and ODM services?
- Yes, we provide both OEM and ODM services with flexible customization options.
- What is the inspection process for finished products?
- We perform 100% inspection including visual and function inspection checked by packing staff.
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