Advanced High-Precision Fiber Laser Cutting Machine with Intelligent Sensors
| Customization: | Available |
|---|---|
| After-sales Service: | Provide |
| Warranty: | 12 Months |
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Basic Info.
- Model NO.
- HTS600
- Laser Type
- Fiber Laser/UV Laser
- Certification
- ISO
- Condition
- New
- Function
- Laser Resistor Trimming
- Transport Package
- Customized or Wooden Box Packaging
- Specification
- Standard Specifications
- Trademark
- Himalaya
- Origin
- China
Product Description
| System Construction | |||
| The equipment consists of optical system,laser beam positioning system,vision positioning system,measurement control system,manual platform,etc. |
|||
| System Parameters | |||
| Proximity Switch Laser Trimming Machine Parameters | |||
| Configurations | HTS600-RH | HTS601-RH | |
| Laser system | Laser type | Fiber laser | UV laser |
| Central wavelength | 1064nm | 355nm | |
| Output powe | 20W | 3W | |
| Repeat frequency | 30-60kHz | 20-1000kHz | |
| Pulse width | 120-150ns | 10-100ns | |
| Focusing mode | Manual | ||
| Laser beam positioning | Scan range | 100mm*100mm | |
| Scan resolution | 1μm | ||
| Repeat positioning | ±1μm | ||
| Positioning mode | Coaxial monitoring system | Coaxial imaging visual positioning | |
| Loading/unloading syste | Loading/unloading mode | Manual | |
| Work platform | Moving platform | Manual platform | |
| Moving range | 150mm*80mm | ||
| Measurement system | Proximity switch type | 3-wire DC PNP/NPN,2-wire DC normally open/closed,2-wire AC | |
| Dutput voltage signa | 5V DC,24V DC,220V AC | ||
| Measurement signal access | Manual | ||
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment
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