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3D Digital Microscope for PCB/Microelectronic/Circuit/Machining Inspection

Product Details
After-sales Service: Available
Warranty: 1 Year
Magnification: <50X
3D Digital Microscope for PCB/Microelectronic/Circuit/Machining Inspection pictures & photos
3D Digital Microscope for PCB/Microelectronic/Circuit/Machining Inspection pictures & photos
3D Digital Microscope for PCB/Microelectronic/Circuit/Machining Inspection pictures & photos
3D Digital Microscope for PCB/Microelectronic/Circuit/Machining Inspection pictures & photos
  • 3D Digital Microscope for PCB/Microelectronic/Circuit/Machining Inspection
  • 3D Digital Microscope for PCB/Microelectronic/Circuit/Machining Inspection
  • 3D Digital Microscope for PCB/Microelectronic/Circuit/Machining Inspection
  • 3D Digital Microscope for PCB/Microelectronic/Circuit/Machining Inspection

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Overview

Basic Info.

Model NO.
R375/3D
Type
Stereomicroscope
Number of Cylinder
Monocular
Mobility
Desktop
Stereoscopic Effect
Stereoscopic Effect
Shape
Single-lens
Principle
Optics
Transport Package
Wooden Box
Specification
330*300*328
Trademark
INTEC
Origin
Japan
HS Code
9011100000
Production Capacity
5000

Product Description

3D Digital Microscope for PCB/Microelectronic/Circuit/Machining Inspection
3D Digital Microscope for PCB/Microelectronic/Circuit/Machining Inspection
3D Digital Microscope for PCB/Microelectronic/Circuit/Machining Inspection
3D Digital Microscope for PCB/Microelectronic/Circuit/Machining Inspection
Product Description
Features
(1) 0.6-4.5X zoom, operational distance 86mm, based on the infinite optical system.
(2) 3D observation supports manual switch, 360-degree rotation and objective lens 45-degree range, keeps focus to ensure a high pixels of graph upon continous zooms.
(3) CCD interface with micro-tunning function to be compatible with any type of CCD camera. No need to rotate the lens body and camera at the time of micro-tunning.
(4) Vision filed by the minimum zoom is full of flame of camera, without black bargin, with high pixel and large vision depth.
(5) Widely applied in microelectronic, precision circiut, precision mechanical parts, deep hole wall, biologists, animal/plant status, criminal investigation etc.
Specification
Lens parameters
Optical zoom
0.6-4.5X
Total zoom
11-95X based on 12.5" monitor
Operational distance
86mm
Zoom rate
1:8.3
Vision field
24*13.5-2.88*1.62mm
Interface
Type-C
3D rotary observation
3D manual switch
Refocusing not needed, without distance change at the time of 3D switch
Without focus change at the time of 3D switch 
360-degree rotation, 45-degree range objective lens
Camera parameters
Graphic sensor
1/2" SONY CMOS
Solution
1920*1080
Pixel dimension
3.75μm*3.75μm
White balance
Manual/automatic
Explosion
Manual/automatic
Recording format
pictures on USB flash disk
Format: JPG/BMP   Solution: 1920*1080
Optical parameters
Range control
Brightness 0-100% setting
Ray color
White
LED QTY
LED
Lux
15000 Lux
Wave length
455-457.5
Output voltage
12V
Output power
8-10 Watt
Operational distance
35-110mm
Material
Alluminium alloy
Dimensions
Inner diameter: 40mm   Outter diameter: 106mm  Height: 19mm
Bracket parameters
Bracket
Cylindrical beam micro-tunning bracket
Base size
330*300mm
Cylindrical beam height
328mm
Main body size
50mm
Packing & Delivery
3D Digital Microscope for PCB/Microelectronic/Circuit/Machining Inspection
3D Digital Microscope for PCB/Microelectronic/Circuit/Machining Inspection
Company Profile
Jiangsu Himalaya Semicondutor Co., Ltd.
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in exporting business and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
We manufacture equipments for Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting(Glass Ceramics Wafers Packaging, Laser Internal Modification Machine Si /Sic Wafe, Laser Internal Modification Machine Lt/Ln Wafer, Laser Annealing Machine for Si/Sic, Automatic Dicing Saw Machine(Wafer Packaging)), Automatic Silicone Dispensing Equipment.
As well as we provide some solutions for handling exhausted metal sorter equipments, customized coating and plating machine, TGV & manual/semiautomatic/automatic equipments, so on. 
3D Digital Microscope for PCB/Microelectronic/Circuit/Machining Inspection
3D Digital Microscope for PCB/Microelectronic/Circuit/Machining Inspection
3D Digital Microscope for PCB/Microelectronic/Circuit/Machining Inspection
3D Digital Microscope for PCB/Microelectronic/Circuit/Machining Inspection

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