Cutting-Edge Vacuum Reflow Solutions for Power Semiconductor Production
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Product Highlights
- Automatic Servo Control: Servo motor control lift and motor drive feed for precise operation.
- Multi-Gas Compatibility: Supports Nitrogen, formic acid, and hydrogen gas environments.
- LINUX System Control: Embedded industrial LINUX system for stable and efficient control.
- Water Cooling System: Configured with water cooling system for product contact cooling.
- High Mould Life: Mould life spans 300,000 to 1,000,000 shots for durability.
- Flexible Customization: ODM and OEM services available with flexible customization options.
Product Attributes
- Customization
- Available
- After-sales Service
- Online Service
- Function
- High Temperature Resistance
- Model NO.
- HMLA-HX03
- Demoulding
- Automatic
- Condition
- New
- Certification
- ISO
- Warranty
- 12 Months
- Automatic Grade
- Automatic
- Installation
- Vertical
- Driven Type
- Electric
- Mould Life
- 300,000-1,000,000 Shots
- Transport Package
- Air Freight
- Specification
- 0*0*0
- Trademark
- Himalaya
- Origin
- China
- Production Capacity
- 200
Product Images of Cutting-Edge Vacuum Reflow Solutions for Power Semiconductor Production
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Cutting-Edge Vacuum Reflow Solutions for Power Semiconductor Production -
Cutting-Edge Vacuum Reflow Solutions for Power Semiconductor Production -
Cutting-Edge Vacuum Reflow Solutions for Power Semiconductor Production -
Cutting-Edge Vacuum Reflow Solutions for Power Semiconductor Production -
Cutting-Edge Vacuum Reflow Solutions for Power Semiconductor Production -
Cutting-Edge Vacuum Reflow Solutions for Power Semiconductor Production -
Cutting-Edge Vacuum Reflow Solutions for Power Semiconductor Production
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Product Description
| Basic parameter | |||
| Equipment model | HMLA-300 | HMLA-400 | |
| Heating method | Metal heating platform, product contact conduction heat | ||
| Heating zone | 2PCS | 3PCS | |
| Cooling zone | 1PCS | ||
| Maximum temperature | ≥450ºC | ||
| Heating platform uniformity | ≤±5ºC | ||
| Vacuum degree in vacuum area | ≤1mbr | ||
| Vacuum zone melting | 3PCS | 4PCS | |
| Cooling-down method | Configured with water cooling system, product contact cooling | ||
| Method of feeding | Servo motor control lift; motor drive feed | ||
| Feed connection | 900mm±20mm Connected to the automatic operation of the feed production | ||
| The maximum size of the product | 100mm*200mm | ||
| Furnace height | 50mm | ||
| Capacity | 7-15min/CPS tool | 5-10min/CPS tool | |
| Heating platform material | Polymer alloy material + special surface treatment | ||
| The bubble rate | single≤1,entirety≤2 | ||
| Gas | Nitrogen gas, formic acid gas, and hydrogen gas | ||
| Nitrogen consumption | 50L-100L/min | 60L-120L/min | |
| Minimum oxygen content | 10ppm | ||
| Methylene acid usage | 30-100L/min | 40-120L/min | |
| Power | Maximum power: 35KW Operating power: 10-15KW |
Maximum power: 45KW Operating power: 12-18KW |
|
| Control method | Embedded industrial and industrial control system | ||
| Control method | LINUX system | ||
| Power standard | 380VThree-phase five-line system | ||
| Appearance size | L3500xW1800xH1800mm | L4000xW1800xH1800 mm | |
| Equipment weight | 3000KG | 3500KG | |
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
About the Supplier
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Company Profile
Empowering Global Semiconductor Excellence: An Introduction to Jiangsu Himalaya Semiconductor Co., Ltd.
In the rapidly evolving landscape of global electronics, precision and reliability are the cornerstones of success. Since its establishment in 2019, Jiangsu Himalaya Semiconductor Co., Ltd. Has emerged as a pivotal force in the semiconductor industry, specializing in the high-level integration and international trade of advanced manufacturing equipment.
With a footprint extending to over 30 countries and a robust network of more than 200 global customers and suppliers, we serve as the critical link in the semiconductor supply chain. Our mission is clear: To secure the most cost-effective, high-performance solutions for our clients while ensuring seamless, risk-free transactions for our partners.
Comprehensive Equipment Solutions for Semiconductor Manufacturing
We take pride in our diverse portfolio of high-precision machinery designed to meet the rigorous demands of modern wafer processing and packaging.
1. Advanced Bonding & Marking
Precision at the microscopic level is essential for chip integrity. Our core lineup includes:
Die Bonders: Ensuring high-speed, accurate placement of chips.
Wire Bonding: Providing reliable electrical interconnections with industry-leading stability.
Laser Marking: Specialized ID marking for IC wafers to ensure full traceability throughout the lifecycle.
2. Cutting-Edge Laser Processing
As wafers become thinner and materials more complex, our laser solutions provide the necessary finesse without compromising structural integrity:
Laser Grooving & Cutting: Expertly designed for glass, ceramics, and wafer packaging.
Internal Modification Machines: Specialized laser technology for Si/SiC (Silicon Carbide) and LT/LN (Lithium Tantalate/Lithium Niobate) wafers.
Laser Annealing: Optimized for Si/SiC substrates to enhance electrical properties and repair lattice damage.
3. Dicing & Dispensing
Automatic Dicing Saw Machines: High-efficiency dicing for wafer packaging applications.
Automatic Silicone Dispensing Equipment: Precision fluid control for protective coating and encapsulation.
Customized Industrial Solutions
Beyond standard machinery, Jiangsu Himalaya Semiconductor provides specialized engineering solutions tailored to unique factory requirements:
TGV (Through Glass Via) Technology: Offering manual, semi-automatic, and fully automatic equipment for next-generation 3D packaging.
Coating & Plating: Customized machines designed for specific surface treatment and metal deposition needs.
Environmental & Resource Management: Efficient solutions for handling exhausted metal sorter equipment, promoting sustainable manufacturing practices.
Why Partner with Jiangsu Himalaya Semiconductor?
In a market defined by volatility, we offer stability and strategic advantage. We understand that for our customers, the "final stage" of procurement is the most critical. We utilize our deep industry expertise to filter through global options, delivering products that balance cost with cutting-edge performance.
For our suppliers, we are a partner of trust. We strive for one-time payment collection and comprehensive risk avoidance, allowing manufacturers to focus on innovation while we handle the complexities of global distribution.
Contact Us Today
Whether you are scaling your production line or seeking a reliable global export partner, Jiangsu Himalaya Semiconductor Co., Ltd. is ready to elevate your operations.
Explore the peak of semiconductor technology with Himalaya.
About Our Factory & Business Background
- Address
- Room 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
-
Registered Capital
- 100,000,000 RMB
-
Terms of Payment
- LC, T/T, PayPal, Western Union
-
International Commercial Terms(Incoterms)
- FOB, CIF, CFR, EXW
-
Average Lead Time
-
Peak Season Lead Time: 3-6 months
Off Season Lead Time: 1-3 months -
Nearest Port
- Shenzhen Port
-
Minimum Order Quantity
- 1 Set
-
Supply Chain Partners
- 30
Our Production Capability & Technical Expertise
-
Main Products
- Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment
-
Inspection Type for Finished Products
- 100% inspection(Visual inspection & Function inspection)
-
Inspection Method for Finished Products
- Finished product checked by packing staff
-
Customization Options
- Flexible customization
-
ODM Service Available
- Yes
-
OEM Service Available
- Yes
-
Traceability of Raw Materials
- No
Our Industry Experience & Global Business Record
-
Year of Establishment
- 2019-09-12
-
Export Year
- 5 Years
-
Main Markets
- Europe
-
Repeat Buyers Choice
- 80%~100%
FAQ
- How to choose a suitable machine?
- You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
- What is the warranty period for the equipment?
- One year warranty and 24 hours online professional technical support.
- What gases can be used with this equipment?
- It supports Nitrogen gas, formic acid gas, and hydrogen gas.
- What is the power consumption of the equipment?
- Maximum power is 35KW-45KW, and operating power is 10-18KW depending on the model.
- What is the minimum order quantity?
- The minimum order quantity is 1 Set.
- What are the payment terms?
- Payment terms include LC, T/T, PayPal, and Western Union.
- What is the lead time for production?
- Peak season lead time is 3-6 months, and off-season lead time is 1-3 months.
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