| Customization: | Available |
|---|---|
| After-sales Service: | 1 Year |
| Warranty: | 1 Year |
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Product Introduction: The Manual Film Applicator Series is a rapid film application machine specially designed for wafer, glass, LED, PCB, and ceramic cutting processes. Its unique film-saving design significantly reduces film costs. Equipped with an air-flexible elastic (adjustable elasticity) pressure roller and platen design, it not only adapts to products of various thicknesses but also minimizes film application stress, preventing product damage. It's user-friendly, requiring no training for immediate operation.
Key Features:
Compatible with blue tape, UV tape, PET-backed tape, and dual-layer tapes.
Optional micro-porous film application platen for ultra-thin wafers.
Heated and elastic film application platen design that self-adapts to wafers of different thicknesses.
Exclusive adjustable pressure roller for film application.
Equipped with circumferential and transverse cutting blades.
Optional ionizing air bar for static elimination.
Compact, desktop design for space-saving convenience.
Film-Saving Manual Film Applicator: The specially designed film-saving structure makes the Manual Film Applicator Series a highly film-efficient manual machine, saving about 15% more film compared to ordinary manual machines. This significantly reduces customer film costs, with the cost-saving effect becoming even more pronounced when using expensive UV film now or in the future.
Micro-Porous Film Application Platen for Ultra-Thin Wafers (Optional): The micro-porous platen design, coupled with a unique air path design and elastic support structure, is suitable for wafers, glass, or ceramics as thin as 100 µm. This structure, along with the air-flexible elastic and adjustable roller device, minimizes damage to ultra-thin wafers during film application, greatly reducing the probability of breakage.
Heated and Elastic Film Application Platen! The heated platen design, with an adjustable heating temperature range, ensures optimal film adhesion. The elastic platen self-adapts to wafers, glass, or ceramics of different thicknesses. The anti-static surface treatment not only minimizes static generated during film application but also prevents physical scratching of the chips. This machine includes an automatic film take-up system, making it suitable for dual-layer films with protective layers.
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Dimension |
L933*W450*H317mm |
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Compatible size |
6"~8" |
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Total power |
500W |
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Input power supply |
100-240V AC 50-60HZ |
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Air pressure |
0.5-0.8Mpa |
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Film type |
Blue film/UV film |
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Plate heating temperature |
0~65ºC |
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Film thickness |
0.05~0.2mm |
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Film function |
Manual |
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Film cutting function |
Manual rotary |
Wafer Laminator
The wafer laminating machine is a machine that coats the blue film or UV film on the wafer and the FRAME iron ring frame, so that the wafer and the FRAME iron ring frame are fixed together. This equipment can stretch and cover the film on the semiconductor (wafer, glass, LED, PCB), and paste the film on the back of the wafer, that is, the cutting frame, through the circular knife and the cross-cutting knife, and can also protect the film from the Patterned wafer surface lift-off.
The main function
1. Suitable for blue film, UV film, PET substrate film and double layer film.
2. An optional micro-hole film platen that can be applied to ultra-thin wafers.
3. The heated and elastic lamination plate can be adapted to different thicknesses of wafers.
4. Unique film roller pressure adjustable design.
5. Equipped with circular cutter and cross cutter.
6. Optional plasma air bar electrostatic removal device.
7. Small size, desktop placement type.
A vacuum laminator is a precision machine that bonds layers of material (films, foils, PCBs, solar cells, etc.) under controlled heat, pressure, and vacuum to eliminate air bubbles and ensure uniform adhesion.
Vacuum-sealed environment - Prevents air entrapment & delamination
Precision temperature control - For thermally activated adhesives (EVA, POE, etc.)
Adjustable pressure system - Ensures even bonding without damage
Automated / semi-automated operation - For high-throughput manufacturing
Solar Panel Manufacturing
Electronics & Displays
Touch panel lamination (OGS, cover glass bonding)
Packaging:
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