Innovative Auto Transfer Molding System for Semiconductor Manufacturing

Product Description

Product Description

Himalaya 002 Fully Automatic Semiconductor Molding Machine

The Himalaya 002 is a state-of-the-art, fully automatic semiconductor molding machine engineered for high-precision, high-volume production. Designed to meet the stringent demands of the semiconductor industry, this system integrates advanced PLC control, precision temperature management, and robust safety features to deliver unparalleled efficiency and reliability in the encapsulation process. It is the ideal one-stop solution for automating your semiconductor packaging and test line.

Characteristic

Fully automatic plastic packaging system, also known as fully automatic packaging system;

Servo control system, PLC (Omron)+controller;
WIN10+15 inch touch screen+touch keyboard;
CCD image detection, anti backtracking detection for incoming materials;
Can correspond to a large lead frame of 90mmx300mm;
Standardized mold structure for easy replacement;
Equipped with a visual System identification to identify the feeding direction;
Efficient cake feeding components, aluminum material box feeding;
Automatic box entry, double material receiving box stacked material receiving;
Supports flexible expansion of up to 4 sets of compressors, achieving high UPH;
Optional mold vacuum pumping function, isolation mold function, and post molding detection function;
Using imported raw materials, with stable performance, high accuracy, long service life, and guaranteed quality;
 

Performance Parameters

Closing pressure: 98-1764kN;

Injection pressure: 4.9-29.4kN adjustable;
Applicable lead frame/substrate size: width 20-90mm, length 124-300mm, thickness 0.15-1.2mm;
Applicable size of plastic sealing material: diameter φ   11-20mm, length/diameter 1.2-2.0 (Max 35mm).

System Characteristics & Features
Category	Feature Description
Control & Operation	• Fully integrated servo control system
	• Omron PLC & motion controller for high reliability
	• Windows 10 OS with 15-inch touch screen and touch keyboard for intuitive operation
Vision & Inspection	• Integrated CCD image detection for incoming material inspection
	• Anti-backtracking detection to ensure process integrity
	• Visual System for automatic identification of feeding direction
Handling & Flexibility	• Capable of handling large lead frames up to 90mm x 300mm
	• Standardized mold structure for quick and easy mold changeover
	• Efficient aluminum material box feeding system
	• Automatic box entry with double stacked material receiving boxes
Performance & Scalability	• Supports flexible expansion with up to 4 sets of compressors for high UPH (Units Per Hour)
	• Robust architecture designed for maximum productivity
Optional Enhancements	• Mold Vacuum Pumping Function
	• Isolation Mold Function
	• Post-Molding Detection Function for quality assurance
Quality & Construction	• Manufactured using high-quality imported raw materials
	• Engineered for stable performance, high accuracy, and long service life

Equipment Details
Sample DisplaySample Display

 

 

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience. 
 

What is the primary function of an epoxy molding machine?

The primary function of an epoxy molding machine is to encapsulate components or products in epoxy resin, providing protection, insulation, and enhancing their durability.

How do epoxy molding machines improve manufacturing efficiency?

Epoxy molding machines improve manufacturing efficiency by streamlining workflows, achieving consistent quality standards, and reducing material waste, thus optimizing production processes.

What types of epoxy molding machines are available for different applications?

Various types of epoxy molding machines are available, including transfer molding systems, compression molding equipment, injection molding technology, and hybrid molding solutions, each suited to specific applications and industries.

What are the essential components of a modern epoxy molding machine?

Essential components include mold clamping and pressure systems, material delivery mechanisms, heating and curing controls, and user interface and programming options, all of which are crucial for efficient and high-quality production.

How do automation and smart features enhance epoxy molding machines?

Automation and smart features, such as programmable logic controllers (PLCs), robotic integration, real-time monitoring, and remote operation capabilities, enhance production efficiency, flexibility, and product quality.

Which industries benefit from epoxy molding machine technology?

Key industries that benefit from epoxy molding machine technology include semiconductor and microelectronics manufacturing, automotive component production, consumer electronics assembly, medical device fabrication, and aerospace applications.

What factors should be considered when selecting an epoxy molding machine?

When selecting an epoxy molding machine, consider production volume and capacity requirements, material compatibility, facility space and infrastructure, budget constraints, and vendor support and service networks.

How can production efficiency be optimized with an epoxy molding machine?

Optimizing production efficiency involves material preparation and handling best practices, cycle time reduction strategies, mold design optimization, and quality control integration methods.

What maintenance is required for epoxy molding machines?

Regular maintenance includes preventative maintenance schedules, troubleshooting common issues, and diagnostic procedures to minimize downtime and ensure effective operation.

How do I choose the right epoxy molding machine manufacturer?

When choosing a manufacturer, consider industry leaders and their specializations, price-to-performance analysis, customer satisfaction metrics, and support and warranty considerations.