Advanced Automatic IC Reel Packaging Machine for Semiconductor Efficiency

Product Description

Semiconductor Industry Process Fully Automatic IC Reel Packaging Equipment 

Product Description

Application field:

Mainly used for packaging 7-inch and 13-inch coils in the semiconductor industry process, it can automatically attach labels to coils and aluminum foil bags, automatically feed coils, desiccants, and humidity cards into aluminum foil bags, vacuum and heat seal, and ultimately achieve coil packaging.
Main features:
Simultaneously compatible with packaging of 7-inch and 13 inch reels with different thicknesses;
Simultaneously meet the automatic vacuum and heat sealing requirements of the reel/desiccant/humidity card into the aluminum foil bag;
The structure is easy to adjust and maintain, and can achieve fast feeding of four types of materials;

Flexible parameter settings and intuitive human-machine interface; The reel and desiccant are both fed in a dual position, achieving non-stop operation of the machine,
Aluminum foil bags and humidity cards can store up to 400PCS of materials, achieving non-stop operation on each shift of the machine.
Strong Reading of Reel Barcode Information System
Wide field of view, can reach more than three times the traditional barcode recognition field of view
Automatic focusing system
Automatic optimal parameter settings, barcode exposure time, image processing, etc
Polarization filter automatic control, automatically removes halo during barcode reading, achieving optimal barcode reading state
Precision optical system
High precision dedicated CCD visual processing module, used to identify the real-time position of the label that needs to be covered on the reel
CCD accuracy: ± 0.01mm
6-axis mechanical arm reel labeling component
Operating range: 600 mm
Repetitive accuracy: ± 0.05 mm
Positioning accuracy: ± 0.05 mm
7 inch/13 inch reel compatible
The reel is automatically transported in the track transmission, from the loading position to the labeling position, then to the desiccant/humidity card station, and finally to the aluminum foil bag
The track can automatically switch between 7 inch/13 inch modes
Each station in the track is equipped with positioning devices, which can accurately ensure the repeated accuracy of the reel transfer

one
UPH
80PCS/H
two
Aluminum foil bag feeding
400PCS
three
Humidity card
400PCS
four
Desiccant
Dual station feeding, 5g or 33g according to demand
five
IC reel
Compatible with 7 inches/13 inches, with thicknesses including 8mm, 10mm, and 12mm
six
Tagging
IC reel and aluminum foil bag are individually labeled and attached with labels
seven
Robot arm&CCD visual recognition function
CCD recognizes the real-time position of the reel label, and the robot accurately covers or attaches the new label to the designated position
eight
Identification system
one
Environmental temperature
22 ºC± 2 ºC
two
Relative humidity
30-60%
three
Cleanliness requirements
10000 level or above
four
Atmospheric pressure (CDA)
0.5-0.8 Mpa
five
Power supply
Single phase 220 V, 50 Hz, above 32 A
six
Grid ground wire
Complies with the national standard requirements of the computer room
seven
Power grid fluctuations
<5%
eight
Equipment size (L × W ×  H)
2700 mm ×  1800 mm × 2200 mm
nine
Equipment weight
About 1 ton
ten
Occasions to avoid
Places with a lot of garbage, dust, and oil mist;
Places with high vibrations and impacts;
Places that can reach drugs and flammable and explosive materials;
Places near high-frequency interference sources;
Places with rapid temperature changes;
In environments with high concentrations of CO2, NOX, SOX, etc.

 

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:Why choose us?
A3:OEM/ODM/Designing service.