30W Automatic UV Picosecond Laser Cutting Machine for Sapphire Glass FPC

• Customization: Available
• After-sales Service: 7*24 Hours
• Warranty: 12 Months
• Model NO.: PML-01
• Application: Automotive Industry, Semiconductor
• Cooling System: Water Cooling
• Technical Class: Pulse Laser
• Applicable Material: Nonmetal
• Structure Type: Gantry Type
• Laser Classification: Semiconductor Laser
• Laser Technology: Laser Control Fault Cutting
• Laser Power: 10W, 15W, 20W, 30W
• Processing Area: 600*500mm
• Laser Wavelength: 355nm
• Galvo Scanning Range: 50*50mm
• Output Pulse Width: ≤15PS
• Cutting Line Width: Less Than 20um
• Comprehensive Processing Precision: ±30um
• Repeat Precision: X/Y: ±1um
• Positioning Precision: X/Y: ±3um
• Power Requirement: 380V/50 - 60Hz
• Transport Package: Wooden Pack
• Specification: 1770*1670*1860mm
• Trademark: Himalaya
• Origin: China
• Production Capacity: 100

Product Description

Product Description

Revolutionize Precision Cutting with Our Fully Automated UV Picosecond Laser System
 

 Our state-of-the-art Ultraviolet Picosecond Laser Cutting Machine is engineered for high-precision, automated manufacturing of delicate and complex materials. Featuring a innovative roll-to-sheet, dual-station design, it enables continuous production with exceptional throughput. The system integrates a cold-processing UV picosecond laser to deliver perfectly smooth, burr-free cut edges with minimal thermal damage, making it the ideal solution for the most demanding applications in the electronics industry.

Core Features & Advantages:

1. Superior Cutting Quality with UV Picosecond Laser:

• Cold Ablation Process: The UV wavelength and ultrashort picosecond pulses virtually eliminate heat transfer to the material. This prevents burning, carbonization, and melting, resulting in exceptionally smooth, clean edges without burrs.

• Minimal Maintenance: The laser source boasts excellent beam quality and stable power distribution, requiring no regular maintenance of the laser or beam path, saving significant time and cost.

• Microscopic Precision: Focuses to an extremely small spot for narrow kerf widths and high cutting accuracy, perfect for intricate contours and fine features.

2. Unmatched Motion & Platform Stability:

• High-Speed XY Stage: Equipped with imported linear motors achieving accelerations up to 1G for blazing-fast positioning and reduced cycle times.

• Full-Closed Loop Control: Paired with high-resolution optical encoders, the system ensures exceptional positioning accuracy and long-term reliability.

• Marble Base: The massive marble platform provides superior rigidity, strength, and corrosion resistance, guaranteeing thermal and mechanical stability for consistent, high-precision results.

3. Intelligent Automation & Vision:

• Fully Automated Workflow: Our system offers true "One-Button" operation, seamlessly handling automatic feeding, cutting, piece counting, collection, and material changeover.

• Advanced CCD Positioning: The vision system pre-scans the material, automatically identifies fiducial marks (Mark points), and compensates for any misalignment, ensuring perfect cut placement every time.

4. Advanced Optical Delivery System:

• High-Speed Imported Galvo Scanner & F-Theta Lens: This combination delivers low thermal drift and stable, high-speed beam control, enabling precise and rapid cutting of complex patterns without sacrificing edge quality.

5. Simplified Operation with Smart Software:

• User-Friendly HMI: The intuitive human-machine interface is easy to learn and operate.

• Independent Process Database: Store and recall parameters for different materials with a single click, streamlining production changeovers and ensuring repeatability.

6. Process Integration:

• This single platform optimizes and replaces four complex traditional processes: FPC auxiliary material blanking, drilling, shaping, and punching, drastically reducing overhead and improving yield

Detailed Photos

Product Parameters

Item	Specification
Equipment Name	UV Picosecond Laser Cutting Machine
Laser Power	10W, 15W, 20W, 30W
Processing Area	600*500mm
Laser Wavelength	355nm
Galvo Scanning Range	50*50mm
Output Pulse Width	≤15ps
Cutting Line Width	<20um
Comprehensive Processing Precision	±30um
Depth Control Precision	±30um
Repeat Precision	X/Y: ±1um
Positioning Precision	X/Y: ±3um
CCD Positioning Precision	±5um
Focus Size	10 - 25um
Cutting Efficiency	800 - 7000mm/s (depending on material and process)
Compressed Air	≥0.5MAP
Ambient Temperature	25ºC±2
Continuous Working Time	24 hours
Equipment Dimensions	1770*1670*1860mm
Weight	2000kg
Power Requirement	380V/50 - 60Hz
Cooling Method	Water cooling
Applicable Materials	Mainly used in FPC, PCB, CVL, RF and other industries; cutting of FPC flexible boards, cover films, PET films, PI films, PP films, adhesive films, copper foils, explosion - proof films, electromagnetic films, FR4, 3M glue, PI reinforcement, PE films and other various films and auxiliary materials. It can also be used to cut various substrates, such as ceramics, silicon wafers, aluminum foils etc.

Applications

• FPC (Flexible Printed Circuit) Cutting

• CVL (Cover Layer) & PI (Polyimide) Film Cutting and Window Opening

• PCB (Printed Circuit Board) Cutting

• RF Soft/Hard Combination Board Cutting

• OLED Flexible Screen Cutting

• Silicon Wafer Dicing

• PTFE Cutting

Advantage

Key Features

Key Features: UV Picosecond Laser Cutting Machine

1. Advanced Laser Source:

• UV Picosecond Laser: Cold ablation process minimizes heat damage, preventing burning and melting.

• Superior Beam Quality: Produces a extremely small, focused spot for micron-level precision and narrow kerf widths.

• Maintenance-Free Operation: Solid-state design requires no routine maintenance for the laser or beam delivery, reducing downtime and cost.

2. High-Precision Motion System:

• Linear Motor XY Stage: Imported linear motors provide high-speed movement with acceleration up to 1G for fast throughput.

• Full-Closed Loop Control: Integrated with high-resolution optical encoders for exceptional positioning accuracy and repeatability.

• Marble Base Platform: Offers superior thermal stability, rigidity, and vibration damping, ensuring consistent cutting quality.

3. Intelligent Automation & Vision:

• "One-Button" Full Automation: Fully automated workflow includes auto feeding, cutting, counting, collection, and material changeover.

• High-Accuracy CCD Vision System: Automatically pre-scans and identifies fiducial marks (Mark points) to correct material placement and ensure cutting accuracy.
  
   

  

  

  

   

4. Precision Optical Components:

• Imported High-Speed Galvo Scanner: Enables fast and precise laser beam steering for complex contours and patterns.

• Telecentric F-Theta Lens: Provides a flat field and consistent spot size across the entire cutting area, ensuring uniform cut quality.

5. Efficient Production Design:

• Dual-Station, Roll-to-Sheet: Allows for continuous production; one station can be loaded/unloaded while the other is cutting, maximizing uptime.

• Integrated Process Solution: Replaces multiple traditional steps (blanking, drilling, shaping, punching) in a single machine.

6. User-Friendly Software:

• Intuitive HMI: Simple and easy-to-use interface for operators.

• Independent Process Database: Store and recall recipes for different materials for fast changeover and process consistency.

7. Versatile Material Application:

• Designed for processing delicate materials including FPC, CVL, PCB, RF boards, OLED screens, PI film, silicon wafers.
  
   

  

  

  FAQ

  

1. How does the UV picosecond laser prevent heat damage to delicate materials like FPC and PI films?
Our laser utilizes a "cold ablation" process. The combination of the ultraviolet (355nm) wavelength and ultrashort (≤15ps) pulses allows the laser energy to directly break the molecular bonds of the material and vaporize it without transferring significant heat to the surrounding area. This effectively eliminates burning, melting, and carbonization, resulting in perfectly smooth, burr-free edges essential for high-end electronics manufacturing.

2. What does "fully automated" and "one-button operation" actually mean for daily production?
It means the entire workflow is hands-off after initial setup. An operator simply loads a roll of material and presses start. The machine then automatically handles:
*   Feeding the material onto the cutting platform.
*   Using its vision system to scan and align the material based on fiducial marks.
*   Executing the cutting program with high precision.
*   Counting finished pieces.
*   Unloading cut pieces to a collection bin.
*   Advancing the roll for the next sheet.
This maximizes uptime and reduces labor costs and potential for human error.

3. Can this one machine really replace four traditional processes?
Yes. Traditionally, manufacturing flexible circuits involves separate, often manual, steps for auxiliary material blanking, drilling, shaping, and punching. Our system integrates all these functions into a single, automated platform. It can cut outlines, drill micro-vias, create complex internal shapes (window openings), and precisely cut tabs and features all in one pass, drastically simplifying production, reducing overhead, and improving overall yield.

4. How does the dual-station, roll-to-sheet design improve efficiency?
This innovative design features two independent processing stations. While one station is actively cutting a sheet of material, the operator can be safely unloading finished parts and loading new raw material onto the other station. This eliminates waiting for the machine to finish its cycle before unloading/loading can begin, enabling truly continuous 24/7 production and significantly increasing overall throughput.

5. How do I know which laser power (10W, 15W, 20W, or 30W) is right for my application?
The optimal power depends on your specific material type, thickness, and required cutting speed. Generally:
*   10W/15W:** Ideal for very thin, delicate films (e.g., adhesive layers, thin PI films) where extreme precision is paramount over raw speed.
*   20W:** A versatile choice for a wide range of standard applications, offering an excellent balance of speed and precision for most FPC and PCB materials.
*   30W:** Best for thicker materials, multi-layer stacks, or applications where maximum throughput is the primary goal. Our team can help you determine the best configuration based on a review of your samples and production requirements.