High Precision FPC Package Glue Dispenser Machine System Automatic Silicone Wafer Equipment Factory

• Customization: Available
• After-sales Service: Free Training
• Precision: High Precision
• Model NO.: DI-01
• Condition: New
• Certification: RoHS, ISO, CE
• Warranty: 12 Months
• Automatic Grade: Automatic
• Installation: Desktop
• Driven Type: Electric
• Product Name: FPC Package Dispenser Machine
• Dimension: L900×W650×H1460
• Control Mode: Computer Controlled
• Number of Spindles: X, Y, Z
• Moving Speed: 800 mm/S Max
• Valve Nozzle Cleaning Device: Vacuum Cleaning
• Power Supply: 220V 50/60Hz
• Required Air Pressure (MPa): ≥ 0.65
• Equipment Alarm: Menu, Sound and Light
• Working Area (mm): X:260 Y:260 Z:100
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China
• Production Capacity: 5000

Product Description

High Precision FPC Package Dispenser machine Automatic Silicone wafer Equipment factory
 

Product Description

 

High-Precision Desktop Dispensing System (TSV/HSV Series)

Our TSV-300 & HSV-300 dispensing systems are computer-controlled, servo-driven solutions designed for ultra-precise fluid dispensing in SMT, FPC packaging, LED assembly, and semiconductor applications. Featuring visual programming, CCD alignment, and automatic error detection, this system ensures high repeatability, fast operation, and minimal human intervention for industrial production.

 

Key Features & Advantages

1. Advanced Control & Software

• Industrial PC + Motion Control Card - Ensures high-speed, stable operation for precision dispensing.
• Windows OS + Anda Control Software - Intuitive visual programming for easy setup.
• CCD Visual Positioning - Auto-alignment for accurate dispensing on PCBs and flexible circuits.
• Servo Motor Drive (X/Y/Z Axes) - Enables fast movement (800mm/s) with ±0.025mm repeatability.

2. High-Speed & Precision Dispensing

• Working Area (X260 × Y260 × Z100mm) - Suitable for small to medium-sized PCBs.
• 30cc Coating Capacity - Supports continuous dispensing without frequent refills.
• Vacuum Nozzle Cleaning - Reduces clogging & downtime for consistent performance.
• Automatic Coating Inspection - Detects dispensing errors in real time.

3. Robust Safety & Reliability

• Menu + Sound & Light Alarm - Immediate error alerts for quick troubleshooting.
• ESD Grounding Point - Protects sensitive electronics from static damage.
• CE Certified - Complies with international safety standards.
• Voltage Stabilizer + UPS - Ensures stable power supply to prevent interruptions.

4. Wide Application Compatibility

 SMT Red Glue Dispensing (PCB assembly)
 FPC Packaging (Flexible circuits)
 LENS & LED Encapsulation (Optical & display modules)
 Solder Paste Dispensing (Precision soldering)
 Fingerprint Module Assembly (Biometric sensors)

 

 

 

Standard Features 

Computer Control, Windows OS
CCD visual positioning system
Servo Motor
UPS and voltage stabilizer
ESD grounding point-
CE certifed

 

Optional Features 

Automatic constant temperature system to ensure the fuidity consistent
Laser Height Detection to calibrate Z axis automatically for component
deformation

Product advantage:

TSV Series desktop dispensing system is applicable for LENS dispensing, FPC package, SMT red glue dispensing, solder past dispensing, LED package, fingerprint identifcation module, etc. 

 

Specifications	TSV-300	HSV-300
Dimension (mm)	L810×W660×H760	L900×W650×H1460
Weight (kg)	105	190
Control	Industrial personal computer + motion control card
Software	Anda control software + windows system
Programming	Visual programming
Number of spindles	X,Y,Z
Spindle drive	Servo motor + module
Working area (mm)	X:260 ; Y:260 ; Z:100
Quantity of rubber valve	1 (standard configuration)
Max. Moving speed (mm/s)	800
Repeatability (mm)	± 0.025
Coating capacity (cc)	30
Valve nozzle cleaning device	Vacuum cleaning
Equipment alarm	Menu + sound and light alarm
Coating inspection	Automatic detection
Power supply	220V 50/60Hz
Required air pressure (Mpa)	≥ 0.65
Safety standards	CE
Rated power (kw)	1
Standard configuration	CCD visual positioning;  Electrostatic interface;  232 scanner socket

Applications

 

Wide application for:

 SMT Red Glue Dispensing (PCB assembly)
 FPC Packaging (Flexible circuits)
 LENS & LED Encapsulation (Optical & display modules)
 Solder Paste Dispensing (Precision soldering)
 Fingerprint Module Assembly (Biometric sensors)

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:Why choose us ?
A3:OEM/ODM/Designing.