High-Performance Wafer Sorting Machines for Enhanced Production Efficiency

• Customization: Available
• Application: Detector, Power Electronic Components, Temperature Measurement
• Batch Number: 2023+
• Model NO.: HM-004
• Certification: CE, RoHS
• Manufacturing Technology: Analog IC
• Material: Element Semiconductor
• Model: ULN2003
• Package: CSP
• Signal Processing: Digital
• Type: Intrinsic Semiconductor
• Product Type: Wafer Sorter Secs Gem System Device
• Loading Compatibility: Supports Multiple Loading Methods
• Software: Standardized Application Software
• Transmission Safety: High-Efficiency Wafer Handling
• Communication Protocol: Secs/Gem Compliant
• Wafer Size Support: 4''–12''
• Transfer Mechanism: Dual-Arm Robot
• Alignment System: Standard Wafer Edge Patroller
• Transport Package: Packed with Wooden Box by Sea Shipping
• Specification: 1200kg
• Trademark: Himalaya
• Origin: China
• Production Capacity: 5000

Product Description

Product Description

Wafer Sorter with SECS/GEM Integration
Compact, high-speed wafer handling system for 4"-12" wafers. Features dual-arm robot, SECS/GEM communication, and customizable picking (vacuum/Bernoulli). Supports Class 1 cleanrooms, processes 150+ wafers/hour, and offers deep customization for thin/fragile wafers.

Key Specs:

• Size: 1465×1397×2215mm (550kg)
• Power: 220V, 50Hz
• Air: 0.5-0.7MPa clean dry air

Ideal for automated semiconductor fabs.

factory supplier wafer sorter SECS GEM system device wafer industrial equipment solution producer
 

Key Features

• Completely independent intellectual property rights
• Compatible with multiple loading methods
• Standardized application software
• Safe and efficient transmission
• SECS/GEM communication
• Deep customization
• Capable of handling thin wafers
 

Product Parameters

• Wafer size: 4''-12'' single size or two similar sizes compatible and customizable
• Number of loading ports:  Standard Load Port *1 or other loading forms can be customized
• Wafer transfer:
Dual-arm wafer transfer robot • Wafer picking method:
Vacuum, Bernoulli, clamping or other structures can be customized
• Wafer alignment: Standard wafer edge patroller
• Wafer ID reading: Single-sided/double-sided wafer ID dedicated reader
• Communication: Support standard SECS/GEM or simple networking
• Cleanliness: Multiple levels can be customized, up to Class1
• Power supply specifications: Single-phase AC220V±10% 50HZ 10A
• Air source specifications: Positive pressure 0.5-0.7MPa clean dry compressed air, negative pressure better than -60kPa
• Output: ≥150 (including OCR)
• Equipment size: 1465×1397×2215mm
• Weight: ≈550kg
 

Intellectual Property	Independent IP, fully proprietary design.
Loading Compatibility	Supports multiple loading methods (customizable).
Software	Standardized application software with user-friendly interface.
Transmission Safety	High-efficiency wafer handling with fail-safe mechanisms.
Communication Protocol	SECS/GEM compliant (supports simple networking alternatives).
Customization	Deep customization available (loading ports, wafer handling, cleanliness, etc.).
Thin Wafer Handling	Capable of processing fragile/thin wafers (customizable pick-up methods).
Wafer Size Support	4''–12'' (single size or two similar sizes, customizable).
Loading Ports	Standard: 1 Load Port (additional/custom forms available).
Transfer Mechanism	Dual-arm robot for high-speed wafer transfer.
Wafer Picking Methods	Vacuum / Bernoulli / Clamping (customizable).
Alignment System	Standard wafer edge patroller for precision alignment.
Wafer ID Reading	Single-sided/double-sided dedicated OCR reader.

 

Detailed Photos

Packaging & Shipping