High Precision Stealth Dicing Laser Dicer Machine for IC Glass Ceramics Semiconductor

• Customization: Available
• After-sales Service: 7*24 Hours
• Warranty: 12 Months
• Model NO.: WDM-01
• Application: IC
• Cooling System: Air Cooling
• Technical Class: Continuous Wave Laser
• Applicable Material: Metal
• Structure Type: Gantry Type
• Laser Classification: Semiconductor Laser
• Laser Technology: Laser Control Fault Cutting
• OEM: Yes
• Flatness of Cutter Face: ≤0.002mm
• Reach Accuracy: +0.003mm
• Minimum Measurement: 0.5*0.5mm
• Central System Function: Remove Machine Alarm Processing
• Cutting Substrate: Si, Pkg, PCB etc
• Feature: High Detection Capability
• Signal Reading: Accurate
• Spindle Output Power: 1.8kw(2.4kw)
• Spindle Speed Range: 6000-60000rpm
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China
• Production Capacity: 1111

Product Description

Product Description

Wafer dicing machine for semiconductor equipment

Wafer Dicing Machine

The wafer dicing machine is primarily used for precision cutting of semiconductor wafers, integrated circuits, QFN packages, light-emitting diodes (LEDs), LED chips, solar cells, and electronic substrates. It is compatible with various materials including silicon, quartz, alumina (Al2O3), ferric oxide (Fe2O3), gallium arsenide (GaAs), lithium niobate (LiNbO3), sapphire, and glass.

Working Principle: The machine operates by utilizing an aerostatic spindle to drive a diamond grinding wheel cutting tool at high rotational speeds. This enables precise cutting or grooving of wafers and devices along the predetermined dicing streets (cutting channels).

Specification

The wafer dicing machine consists of several key components designed for precise operation and user control:

Indicator – Displays critical machine parameters such as spindle speed, cutting depth, and operational status. It provides real-time feedback to ensure accurate processing.
Control Button – A user interface panel with tactile buttons for initiating, pausing, and adjusting machine functions. Operators can set cutting parameters and control the workflow efficiently.
Control System – The central processing unit that manages machine operations, including motion control, speed regulation, and safety protocols. It ensures high-precision cutting through automated adjustments.
Lighting – Integrated illumination for enhanced visibility during the dicing process. It helps operators monitor the cutting path and inspect wafer alignment.
Working Table – A precision-engineered platform that holds and positions the wafer during cutting. It typically includes vacuum suction or clamps to secure the material in place for accurate dicing.

X axis	maximum effective input rang of feed speed	310mm 0.1-1000mm/s	310mm	210mm
			0.1-1000mm/s	0.1-600mm/s
Y axis	max effective	310mm	310mm	170mm
	single step increment	0.0001mm	0.0001mm	0.0001mm
	reach accuracy	0.003mm/310mm	0.003mm/310mm	0.003mm/170mm
Z axis	maximum effective	40mm	40mm	40mm
	repetition accuracy	0.001mm	0.001mm	0.001mm
	maximum cutter diameter	58	58	58
T axis	maximum rotation angle	380°	380°	380°
spindle	speed range	6000-60000rpm	6000-60000rpm	6000-60000rpm
	output power	1.8KW(2.4KW)	1.8KW(2.4KW)	1.5KW (2.4KW)
power		AC380V±10%	AC380V±10%	AC380V±10%
Size W×D×H		1200mm×1629mm×1849mm	1080mm×1160mm×1800mm	630mmx900mmx1600mm

Application & Material Compatibility

Applications:

IC (Integrated Circuits)
QFN (Quad Flat No-leads packages)
DFN (Dual Flat No-leads packages)
LED substrates
Optical communication components
Processable Materials:

Silicon wafers
Ceramics
Glass
Alumina (Al2O3)
PCBs (Printed Circuit Boards)
Aluminum nitride (AlN)
Lithium niobate (LiNbO3)
Quartz

Material for Dicing Machine

Brittle and Hard Materials Such as Glass and Ceramics
Based on high-strength micro-crushed selected diamond, combined with a high-rigidity bond, the blade can maintain continuous and stable self-sharpening even under high-speed feed. This ensures more accurate cutting perpendicularity. 

IC Packaging Industry - QFN/DFN
As the miniaturization and diversification of semiconductor packaging components continue to accelerate, high-efficiency cutting, long service life, and stable cutting quality of QFN/DFN have become major trends. 

Photovoltaic Industry
Photovoltaic Industry - Integrated Diamond Grinding and Chamfering Wheel for Monocrystalline Silicon and Polycrystalline Silicon
Suitable for grinding and chamfering monocrystalline silicon and polycrystalline silicon.

LED And Semiconductor Industry

LED Industry
LED Industry - Sapphire Diamond Thinning Wheel
Suitable for sapphire thinning processing. Processable workpiece size range: 2-inch, 4-inch, and 6-inch. The wheel features stable quality, with low risk of deep scratches and workpiece breakage. It has a long service life and high cost-effectiveness. It can be matched with various imported and domestic machine tools. Customized processing is available according to customer requirements.

Semiconductor Industry
Semiconductor Industry - Silicon Wafer Diamond Thinning Wheel
Suitable for silicon wafer thinning processing. Processable workpiece size range: 6-inch, 8-inch, and 12-inch. 

Packing & Delivery

Packing

Freight Service

Packaging
Wooden Crate (IPPC Certified)Heavy-duty plywood/wooden case with fumigation compliance (ISPM-15 standard).
Shock-absorbent cushioning (foam, airbags) to protect sensitive components.
Weatherproof & tamper-proof sealing for international shipping.

Freight Options
Air Freight (Recommended for Urgent Shipments)
Sea-freight

Railway Freight (Land-Based Alternative)

Company Profile

Jiangsu Himalaya Semiconductor Co.,Ltd.

Jiangsu Himalaya Semiconductor Co., Ltd. is a premier semiconductor equipment manufacturer and global exporter established in 2019. We specialize in providing high-performance, cost-effective semiconductor manufacturing solutions to clients worldwide, with a strong presence in 30+ countries and a network of 200+ satisfied customers and suppliers.
 
Our mission is to deliver the highest value at the final procurement stage, ensuring:
Cost Efficiency – Competitive pricing without compromising quality Risk-Free Transactions – Secure one-time payment solutions for suppliersReliable Integration – End-to-end equipment and technical support

FAQ

Frequently asked questions and answers from the wafer dicing machine buyers

Q1: What is the cutting accuracy of modern wafer dicing machines?
A: Advanced wafer dicing machines typically achieve cutting accuracies of ±1-5μm, with high-end models reaching sub-micron precision. The accuracy depends on spindle technology (air-bearing vs. mechanical), blade quality, and vibration control systems.

Q2: What's the difference between blade dicing and laser dicing?
A:

• Blade dicing uses diamond-coated blades for mechanical cutting (ideal for most silicon wafers)
• Laser dicing employs focused laser beams (better for brittle materials like GaAs or thin wafers)
Key differences: Blade dicing is cost-effective but generates debris; laser dicing is cleaner but has higher thermal impact.

Q3: How do I choose the right dicing blade for my application?
A: Selection depends on:

-Material hardness (e.g., resin-bonded blades for silicon, metal-bonded for ceramics)
-Wafer thickness (thinner = finer grit required)
-Cutting speed vs. edge quality needs

Q4: What maintenance does a wafer dicing machine require?
A: Essential maintenance includes:

Daily: Blade inspection, debris removal
Weekly: Spindle bearing lubrication (if mechanical)
Monthly: Linear guide calibration
Quarterly: Laser alignment checks (for laser dicers)
Annual: Full system recalibration