| Customization: | Available |
|---|---|
| After-sales Service: | Free Training |
| Condition: | New |
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| Clip Bonding Machine Attributes | ||
| Category | Attribute | Description & Importance |
| Core Bonding Performance | Placement Accuracy | The precision of placing the clip on the die/substrate (e.g., ±5 µm). Critical for electrical connection and yield. |
| Bond Force Range | The force applied to attach the clip. Typically much higher than wire bonding (e.g., 10N - 250N). Essential for a reliable mechanical and electrical bond. | |
| Process Type | Support for single-step (place & bond) or two-step (place then reflow/sinter) processes. Defines the production workflow. | |
| Compatible Attach Materials | Works with solder paste, epoxy, or silver sintering paste. Determines the final package performance and reliability. | |
| Handling & Throughput | Clip Feeding System | Method for supplying clips: Waffle Packs (flexible) or Reel-to-Reel (high volume). Directly impacts automation level and UPH. |
| Substrate/Leadframe Handling | Capability to handle various package types (QFN, BGA, etc.) and sizes. Defines application flexibility. | |
| Throughput (UPH) | Units Per Hour. Key metric for production capacity and cost-of-ownership. | |
| Vision & Alignment | Vision System | Typically includes an Up-Looking Camera (for clip) and Down-Looking Camera(s) (for die/substrate). Essential for achieving placement accuracy. |
| Pattern Recognition | Advanced algorithms to handle different clip geometries and substrate finishes. Ensures robust alignment in high-volume production. | |
| Inspection Capabilities | Optional in-process inspection for clip presence, orientation, and coplanarity. Improves quality control and prevents defects. | |
| Motion & Tooling | Motion System | High-precision X, Y, Z, and theta (rotation) stages, often with linear motors. Provides the speed and accuracy for precise placement. |
| Bond Head & Collet | The tool that picks and places the clip. Collets are custom for clip shapes. Directly contacts the clip; critical for reliable handling. | |
| Thermal Management | Heated Work Chuck | Preheats the substrate for processes like solder reflow or epoxy curing. Required for most attach materials. |
| Temperature Stability | Precise control and uniformity across the heating plate. Ensures consistent bond quality across the entire substrate. | |
| Software & Control | User Interface (HMI) | Intuitive software for recipe creation, management, and process monitoring. Affects ease of use and setup time. |
| Data Collection & Traceability | Integration with factory systems (SECS/GEM) for tracking machine status and process data. Essential for advanced manufacturing and quality traceability. | |
| Utilities & Physical | Compressed Air | Required for pneumatics and actuators. Standard utility requirement. |
| Electrical Power | Typically 200VAC+, with significant consumption for heaters and motors. Important for facility planning. | |
| Footprint | The physical floor space required. Key for factory floor layout. | |
| Shielding Gas (Optional) | Inert gas (e.g., Nitrogen) to prevent oxidation during hot bonding. Needed for certain processes and materials. | |
| Optional Features | In-Line Plasma Cleaning | Cleans bonding surfaces immediately before placement. Dramatically improves adhesion and bond strength. |
| 3D Coplanarity Inspection | Measures the flatness of the clip and substrate. Prevents poor bonds due to warpage or misalignment. | |
| Force-Displacement Monitoring | Real-time monitoring of force and travel during bonding. Provides a process signature for 100% quality assurance. | |
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