Precision Laser Cutting Equipment for Superior Grooving Performance

• Customization: Available
• After-sales Service: Provided
• Function: High Temperature Resistance
• Model NO.: LG-2
• Demoulding: Automatic
• Condition: Used
• Certification: ISO
• Warranty: 12 Months
• Automatic Grade: Automatic
• Installation: Desktop
• Driven Type: Electric
• Mould Life: >1,000,000 Shots
• Product Name: Laser Grooving Cutting Equipment
• Feature 1: Guaranteed Quality
• Feature 2: Customized According to Needs
• OEM/ODM Service: Provided
• Transport Package: Customized or Wooden Box Packaging
• Specification: Standard Specifications
• Trademark: Himalaya
• Origin: China
• Production Capacity: 100

Product Description

Product Description

Equipment Advantage

Equipped with high precision linear motor and high speed X-Y motion platform

Equipped with special customized laser head, which ensures high cutting quality and low heat influence

The software is easy to operate and the equipment is convenient to maintain

The cutting mode can be freely combined by narrow beam and wide beam, equipped with a single focus lens cutting system which can improve the processing stability

Basic Parameters

• 1. Applicable Products:Low-K, CMOS, etc
• 2. Applicable wafer size:200mm-300mm
• 3. Laser head:UV nanosecond or short pulse custom laser head
• 4. Cutting depth:≥10μm
• 5. Cutting speed:0-1000mm/s
• 6. Processing method:full-automatic
• 7. Cutting width: 30~90μm
• 8. Equipped with backlight chuck table which has better edge alignment

Parameter	Specification
Applicable Products	Low-K, CMOS, MEMS, Power Devices, Compound Semiconductors (SiC, GaN, etc.)
Applicable Wafer Size	200mm (8") - 300mm (12")
Laser Head	UV Nanosecond (266/355nm) or Custom Short-Pulse Laser (<10ps Optional)
Cutting Depth	≥10μm (Adjustable via Multi-Pass Mode)
Cutting Speed	0-1000mm/s (Programmable Speed Profiles for Edge Quality Optimization)
Processing Method	Full-Automatic (Cassette-to-Cassette, Robot Handling, Vision Alignment)
Cutting Width	30-90μm (Kerf Width Controllable via Beam Shaping Optics)
Chuck Table	Backlight Chuck with Multi-Spectral Alignment (Edge/Notch Detection ±2μm)
Optional Features	- In-situ Depth Monitoring

Exhibition & Customers

Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.

Packaging & Shipping

 

FAQ

Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. 

Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.

Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.