| Customization: | Available |
|---|---|
| After-sales Service: | Provided |
| Warranty: | 12 Months |
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Mps-0806h is a product specially for the sheet metal industry. It is mainly used for sheet metal cutting, closed structure, excellent performance, stability and high cost performance.
1. Stable marble platform and high-strength cast aluminum alloy beam are adopted.
2. The whole machine adopts high-quality servo motor and high-precision double drive screw drive structure, with high precision and processing efficiency.
3. The equipment is stable, the user-friendly operation interface, and the processing status is fed back in real time to ensure the orderly cutting process.
Product application:
Professional application for cutting various metal materials such as carbon steel plate, stainless steel plate, galvanized plate, electrolytic plate, aluminum alloy, brass, and copper.
| Feature | Specification | Benefit |
|---|---|---|
| Movable Gantry Platform | Marble base + movable gantry structure | Reduces vibration, enhances cutting stability. |
| Drive System | Linear motors + high-resolution grating rulers (e.g., ±0.01mm accuracy) | High-speed, precise cuts with minimal error. |
| Control Interface | Touchscreen HMI with real-time monitoring | Simplifies operation and troubleshooting. |
| Materials Compatibility | Carbon steel (1-20mm), stainless steel (1-15mm), aluminum (1-25mm), etc. | Versatile for diverse metalworking needs. |
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:Why choose us?
A3:OEM/ODM/Designing service.
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