Customization: | Available |
---|---|
After-sales Service: | Provided |
Precision: | High Precision |
Suppliers with verified business licenses
Audited by an independent third-party inspection agency
1. WINDOWS operating system - Using computer control, fault sound and light alarm and menu display
2. CCD visual positioning system
3. Adopt linear motor + motion control card
4. Modular design - can be combined as required, including single platform, double platform, conveying system, glue path detection system.
5. Automatic thermostatic system of valve - ensure consistent fluidity of paint
6. Optional laser height detection system - the Z axis height can be automatically calibrated after the workpiece is deformed
7. Optional precision weighing system - intelligent control and detection of dispensing volume, to ensure the consistency of dispensing
Specifications |
ADG-5DI |
Dimension (mm) |
L1166 * W1200 * H1600 |
Control |
Industrial personal computer + motion control card |
Dispensing working area (mm) |
X1=200; X2=200; Y=200 |
Number of principle axis |
5 axes |
Drive mode |
Linear motor (X,Y,A,U) / Servo motor(Z) |
Conveyor mode |
ESD belt |
Amplitude modulation mode |
Electric, 50-200mm |
Conveyor speed |
Stepping motor, 2-5m/min |
Maximum Moving speed (mm/s) |
1000 |
Repeatability (mm) |
±0.012 |
Coating capacity (CC) |
30/50 |
Communication protocol |
SMEMA |
Programming |
The mounter files can be imported; Online visual programming |
Input power |
220V 50/60Hz |
Required air (Mpa) |
≥ 0.65 |
Rated power (kw) |
3 |
Weight (kg) |
500 |
Equipment alarm |
Menu + Sound and light alarm |
Safety standards |
CE |
Glue valve selection |
Pneumatic injection valve, piezoelectric valve, screw valve can be used |
Options of extended function |
Booster pump; UPS; Voltage Regulator; Barcode scanner Microbalance (0.1mg); Laser altimetry (SICK) |
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.