



Post Sourcing Request

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu, China

Main Products:

Die Bonder , Wire Bonding , Laser Marking(ID IC Wafer) , Laser Grooving , Laser Cutting , ...

Year of Establishment:

2019-09-12

Repeat Buyers Choice:

80%~100%

Address:

Room 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China

Registered Capital:

100,000,000 RMB

Main Markets:

Europe

OEM/ODM Service

Sample Available

Overseas Agent / Branch

Visit My Factory

Die Bonder, Wire Bonding manufacturer / supplier in China, offering Integrated Human-Machine Operating System Fully Automatic Oxidation Diffusion Lpcvd Furnace, High Precision Wire Bonding Machine for LED Packaging, Sot/Sop/Ssop/Dfn/Qfn Automated Wire Bonding Machine with Gold/Copper Wire and so on.

Gold Member

Info marked by is verified by BV

Supplier Homepage About Us

About Us

Contact Supplier

Mr. Jack

Deputy General Manager

Company Profile

General Information

Trade Capacity

Partner Production Capacity

R&D Capacity

Company Show

Company Profile

Inquiry Basket

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu Himalaya Semiconductor Co., Ltd.

Book a Factory Tour

	Main Products:	‪Die Bonder‬ , ‪Wire Bonding‬ , ‪Laser Marking(ID IC Wafer)‬ , ‪Laser Grooving‬ , ‪Laser Cutting‬ , ‪...‬
	Year of Establishment:	2019-09-12
	Repeat Buyers Choice:	80%~100%
	Address:	Room 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
	Registered Capital:	100,000,000 RMB
	Main Markets:	Europe

BV Audit Report No. :

MIC-ASI2342144 Verify Now | Read Free Report

Empowering Global Semiconductor Excellence: An Introduction to Jiangsu Himalaya Semiconductor Co., Ltd.

In the rapidly evolving landscape of global electronics, precision and reliability are the cornerstones of success. Since its establishment in 2019, Jiangsu Himalaya Semiconductor Co., Ltd. Has emerged as a pivotal force in the semiconductor industry, specializing in the high-level integration and international trade of advanced manufacturing equipment.

With a footprint extending to over 30 countries and a robust network of more than 200 global customers and suppliers, we serve as the critical link in the semiconductor supply chain. Our mission is clear: To secure the most cost-effective, high-performance solutions for our clients while ensuring seamless, risk-free transactions for our partners.

Comprehensive Equipment Solutions for Semiconductor Manufacturing

We take pride in our diverse portfolio of high-precision machinery designed to meet the rigorous demands of modern wafer processing and packaging.

1. Advanced Bonding & Marking

Precision at the microscopic level is essential for chip integrity. Our core lineup includes:

Die Bonders: Ensuring high-speed, accurate placement of chips.

Wire Bonding: Providing reliable electrical interconnections with industry-leading stability.

Laser Marking: Specialized ID marking for IC wafers to ensure full traceability throughout the lifecycle.

2. Cutting-Edge Laser Processing

As wafers become thinner and materials more complex, our laser solutions provide the necessary finesse without compromising structural integrity:

Laser Grooving & Cutting: Expertly designed for glass, ceramics, and wafer packaging.

Internal Modification Machines: Specialized laser technology for Si/SiC (Silicon Carbide) and LT/LN (Lithium Tantalate/Lithium Niobate) wafers.

Laser Annealing: Optimized for Si/SiC substrates to enhance electrical properties and repair lattice damage.

3. Dicing & Dispensing

Automatic Dicing Saw Machines: High-efficiency dicing for wafer packaging applications.

Automatic Silicone Dispensing Equipment: Precision fluid control for protective coating and encapsulation.

Customized Industrial Solutions

Beyond standard machinery, Jiangsu Himalaya Semiconductor provides specialized engineering solutions tailored to unique factory requirements:

TGV (Through Glass Via) Technology: Offering manual, semi-automatic, and fully automatic equipment for next-generation 3D packaging.

Coating & Plating: Customized machines designed for specific surface treatment and metal deposition needs.

Environmental & Resource Management: Efficient solutions for handling exhausted metal sorter equipment, promoting sustainable manufacturing practices.

Why Partner with Jiangsu Himalaya Semiconductor?

In a market defined by volatility, we offer stability and strategic advantage. We understand that for our customers, the "final stage" of procurement is the most critical. We utilize our deep industry expertise to filter through global options, delivering products that balance cost with cutting-edge performance.

For our suppliers, we are a partner of trust. We strive for one-time payment collection and comprehensive risk avoidance, allowing manufacturers to focus on innovation while we handle the complexities of global distribution.

Contact Us Today

Whether you are scaling your production line or seeking a reliable global export partner, Jiangsu Himalaya Semiconductor Co., Ltd. is ready to elevate your operations.

Explore the peak of semiconductor technology with Himalaya.

General Information

4 items verified by BV

Main Products:

Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, ...

Year of Establishment:

2019-09-12

Repeat Buyers Choice:

80%~100%

Address:

Room 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China

Registered Capital:

100,000,000 RMB

Trade Capacity

All information verified by BV

Main Markets:

Europe

Supply Chain Partners:

30

Minimum Order Quantity:

1 Set

International Commercial Terms(Incoterms):

FOB, CIF, CFR, EXW

Terms of Payment:

LC, T/T, PayPal, Western Union

Average Lead Time:

Peak Season Lead Time: 3-6 months
Off Season Lead Time: 1-3 months

Export Year:

5 Years

Nearest Port:

Shenzhen Port

Partner Production Capacity

All information verified by BV

Inspection Type for Finished Products:

100% inspection(Visual inspection & Function inspection)

Inspection Method for Finished Products:

Finished product checked by packing staff

Traceability of Raw Materials:

No

R&D Capacity

All information verified by BV

ODM Service Available:

Yes

OEM Service Available:

Yes

Customization Options:

Flexible customization

Company Show

Bulletin Board

4 Items

fiber laser marking machine

fiber laser marking machine

UV laser cutting machine

UV laser cutting machine

Equipment manufacturer

Equipment manufacturer

Certificates

3 Items

Invention Patent

Verified by SGS. Final validity is subject to actual terms

Invention Patent

Exhibition

6 Items

Workshop

4 Items

Packaging

5 Items

Inspection

4 Items

Send your message to this supplier

*From:

*To:

Mr. Jack

*Message:

Enter between 20 to 4,000 characters.

This is not what you are looking for?  Post a Sourcing Request Now