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Jiangsu Himalaya Semiconductor Co., Ltd.
Jiangsu, China
Main Products:
Die Bonder , Wire Bonding , Laser Marking(ID IC Wafer) , Laser Grooving , Laser Cutting , ...
Year of Establishment:
2019-09-12
Repeat Buyers Choice:
80%~100%
Address:
Room 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital:
100,000,000 RMB
Main Markets:
Europe
OEM/ODM Service
Sample Available
Overseas Agent / Branch
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Die Bonder, Wire Bonding manufacturer / supplier in China, offering Integrated Human-Machine Operating System Fully Automatic Oxidation Diffusion Lpcvd Furnace, High Precision Wire Bonding Machine for LED Packaging, Sot/Sop/Ssop/Dfn/Qfn Automated Wire Bonding Machine with Gold/Copper Wire and so on.

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Mr. Jack
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Total 836 Products
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High Speed Fully Automatic Testing and Sorting Machine for Semiconductor Device
High Speed Fully Automatic Testing and Sorting Machine for Semiconductor Device
FOB Price: US $100,000-1,000,000 / Set
Min. Order: 1 Set
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High Speed Fully Automatic Gold/Copper/Aluminum Wire Bonder
High Speed Fully Automatic Gold/Copper/Aluminum Wire Bonder
FOB Price: US $5,000-70,000 / Piece
Min. Order: 1 Piece
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Fully Automatic Laser Grooving Equipment for Semiconductor Wafers
Fully Automatic Laser Grooving Equipment for Semiconductor Wafers
FOB Price: US $50,000-100,000 / Piece
Min. Order: 1 Piece
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Advanced Fully Automatic Laser Marking Machine for Wafer ID
Advanced Fully Automatic Laser Marking Machine for Wafer ID
FOB Price: US $50,000-70,000 / Piece
Min. Order: 1 Piece
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Advanced Frame Laser Marking Machine with Smart Label Detection
Advanced Frame Laser Marking Machine with Smart Label Detection
FOB Price: US $100,000-200,000 / Piece
Min. Order: 1 Piece
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Laser Grooving Machine Equipped with High-Precision Robotic Arms and Motion Platforms
Laser Grooving Machine Equipped with High-Precision Robotic Arms and Motion Platforms
FOB Price: US $30,000-300,000 / Piece
Min. Order: 1 Piece
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High End Ceramic Punching Equipment with High Precision Laser Processing System
High End Ceramic Punching Equipment with High Precision Laser Processing System
FOB Price: US $200,000-1,000,000 / Piece
Min. Order: 1 Piece
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Advanced Laser Stealth Dicing/Cutting Equipment for Semiconductor Wafers
Advanced Laser Stealth Dicing/Cutting Equipment for Semiconductor Wafers
FOB Price: US $70,000-100,000 / Set
Min. Order: 1 Set
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Automated Handling System Mobile Robots Logistics Operations Machine Manufacturer
Automated Handling System Mobile Robots Logistics Operations Machine Manufacturer
FOB Price: US $50,000-100,000 / Set
Min. Order: 1 Set
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High Precision Wafer Identification and Secure Storage System
High Precision Wafer Identification and Secure Storage System
FOB Price: US $50,000-200,000 / Set
Min. Order: 1 Set
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Advanced Fully Automatic Laser Debonding Machine for Precise Applications
Advanced Fully Automatic Laser Debonding Machine for Precise Applications
FOB Price: US $1,000,000-3,000,000 / Set
Min. Order: 1 Set
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Advanced Laser Cutting Machine for PCB and Pet Materials
Advanced Laser Cutting Machine for PCB and Pet Materials
FOB Price: US $50,000-100,000 / Piece
Min. Order: 1 Piece
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Advanced Fully Automatic IC Reel Packaging Machine for Semiconductors
Advanced Fully Automatic IC Reel Packaging Machine for Semiconductors
FOB Price: US $40,000-100,000 / Piece
Min. Order: 1 Piece
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8-Inch Silicon Wafer Semi Chip Standard Chip High End Lithography Machine Equipment
8-Inch Silicon Wafer Semi Chip Standard Chip High End Lithography Machine Equipment
FOB Price: US $50,000-100,000 / Piece
Min. Order: 1 Piece
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High End Semiconductor Fully Automatic Laser Ring Cutting Machine
High End Semiconductor Fully Automatic Laser Ring Cutting Machine
FOB Price: US $100,000-1,000,000 / Set
Min. Order: 1 Set
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High End Semiconductor Chip Fully Automatic Cracking Machine with Wafer Splitting Device
High End Semiconductor Chip Fully Automatic Cracking Machine with Wafer Splitting Device
FOB Price: US $100,000-1,000,000 / Set
Min. Order: 1 Set
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Fully Automatic Semiconductor Glue Coating and Developing Equipment
Fully Automatic Semiconductor Glue Coating and Developing Equipment
FOB Price: US $10,000-50,000 / Piece
Min. Order: 1 Piece
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LED Wafer Laser Cutting Equipment
LED Wafer Laser Cutting Equipment
FOB Price: US $500,000-1,000,000 / Set
Min. Order: 1 Set
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High-Precision Fully Automatic Wafer Marking Equipment for Semiconductor Industry
High-Precision Fully Automatic Wafer Marking Equipment for Semiconductor Industry
FOB Price: US $40,000-100,000 / Piece
Min. Order: 1 Piece
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High End Semiconductor Fully Automatic Llo Laser Peeling Equipment
High End Semiconductor Fully Automatic Llo Laser Peeling Equipment
FOB Price: US $1,000,000-2,000,000 / Set
Min. Order: 1 Set
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High End Semiconductor Fully Automatic Molding Equipment for Lead Frame/Substrate
High End Semiconductor Fully Automatic Molding Equipment for Lead Frame/Substrate
FOB Price: US $500,000-1,000,000 / Set
Min. Order: 1 Set
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High Precision Laser Resistor Trimming Automation System Solution (HTS900 Series)
High Precision Laser Resistor Trimming Automation System Solution (HTS900 Series)
FOB Price: US $100,000-1,000,000 / Piece
Min. Order: 1 Piece
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High-Precision Fiber Laser Trimming Machine with Smart Proximity Switch
High-Precision Fiber Laser Trimming Machine with Smart Proximity Switch
FOB Price: US $100,000-1,000,000 / Piece
Min. Order: 1 Piece
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Optimal Production Pss-H160 Seam Welding System for Industry
Optimal Production Pss-H160 Seam Welding System for Industry
FOB Price: US $100,000-1,000,000 / Piece
Min. Order: 1 Piece
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