High Speed Fully Automatic Testing and Sorting Machine for Semiconductor Device
| Customization: | Available |
|---|---|
| After-sales Service: | 7*24 Hours |
| Function: | High Temperature Resistance |
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Basic Info.
- Model NO.
- Himalaya-20
- Demoulding
- Automatic
- Condition
- New
- Certification
- ISO
- Warranty
- 12 Months
- Automatic Grade
- Automatic
- Installation
- Desktop
- Driven Type
- Electric
- Mould Life
- >1,000,000 Shots
- Weight
- 1 Metric Ton
- Throughput
- 12,000+ Units/Hour (@150ms/Device)
- Nozzle System
- 24 Suction Nozzles, DDR Motor-Driven Turret
- Test Capacity
- 2 to 8 Test Benches (Expandable)
- Binning
- 4 to 8 Bin Boxes + 1 Litter Box
- Power
- 220VAC, 3.5kw, 50/60Hz
- Compressed Air
- 5 to 7 Bar
- Environment
- 20 to 30°C, 30 to 70% Rh
- Transport Package
- Sea-Freight
- Specification
- 2350mm × 1400mm × 1900mm (L×W×H)
- Trademark
- Himalaya
- Origin
- China
- Production Capacity
- 100
Product Description
Mainly used in the final process of surface mount semiconductor device production, it can automatically complete the electrical parameter testing, classification and selection storage, laser printing identification, identification detection, external dimension detection, and final tape packaging output of the device
high-speed semiconductor automatic test handler (pick-and-place system), specifically designed for final testing, sorting, and tape-and-reel packaging of surface-mount devices (SMDs). Here's a detailed breakdown of its identity and key features:
Machine Identification
Likely Model Type:
- High-Speed Multi-Functional Test Handler
- Classification: Back-end semiconductor equipment (post-wafer fabrication, pre-packaging stage).
- Primary Function: Electrical testing, binning, laser marking, and tape-and-reel packaging of ICs (e.g., QFN, SOP, BGA) or discrete components (diodes, transistors).
Key Features Breakdown
1. Core Capabilities
- Electrical Testing: Integrated test benches (2-8 slots) for parametric/functional testing.
- Binning & Sorting: Up to 8 BIN boxes for quality grading.
- Laser Marking: Printing identification (e.g., lot numbers, date codes).
- 3D Inspection: Pin/lead coplanarity, dimensional checks (e.g., "Pin/3D5s detection").
- Tape-and-Reel Packaging: Outputs devices in reels for SMT assembly lines.
2. High-Speed Mechanics
- 24 Nozzle Turret: DDR motor-driven rotary system (12K+ UPH @ <150ms/cycle).
- Independent Z-Axis Control: Nozzles move vertically without interference.
- Modular Tooling: Quick-swap feeders (tubes, vibratory bowls) and output options (tubes, loose, reels).
3. Reliability & Maintenance
- MTBF >220 hours / MTBA ≥60 mins: Minimizes downtime.
- Self-Cleaning: Dedicated cleaning box for nozzle maintenance.
4. Compatibility & Flexibility
- Feeding Methods: Bulk, tubes, tapes.
- Device Types: Supports small SMDs (e.g., 0201 components) to larger ICs.
Technical Specifications Summary
| Category | Details |
|---|---|
| Throughput | 12,000+ units/hour (@150ms/device) |
| Nozzle System | 24 suction nozzles, DDR motor-driven turret |
| Test Capacity | 2-8 test benches (expandable) |
| Binning | 4-8 BIN boxes + 1 litter box |
| Dimensions | 2350mm × 1400mm × 1900mm (L×W×H) |
| Power | 220VAC, 3.5KW, 50/60Hz |
| Compressed Air | 5-7 bar |
| Environment | 20-30°C, 30-70% RH |
Typical Applications
- Final Test Sorting: Classifies ICs by performance (e.g., speed bins for CPUs).
- Quality Control: Rejects defects via 3D/pin inspection.
- Packaging Prep: Outputs tape-and-reel for pick-and-place machines.
Jiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!
Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.
Q1:How to choose a suitable machine?
A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.
Q2:What is the warranty period for the equipment?
A2:One year warranty and 24 hours online professional technical support.
Q3:How to choose a suitable machine?
A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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